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High-Performance Cold Plate

Liquid Cooling Systems

Coming January 2026

The ATS Liquid Cooling System Family delivers precision-engineered thermal solutions from bench-top R&D setups to megawatt-class data center infrastructure. Featuring the iCDM and CDU lines, these systems offer intelligent control, high reliability, and seamless performance for AI computing, power electronics, immersion cooling, and thermal testing.

ArctiQ AI Cold Plates

Coming January 2026

The ArctiQ AI Cold Plates family delivers precision liquid cooling for next-generation AI processors, GPUs, and high-density compute modules. Scalable from edge to data center systems, each plate offers optimized flow paths, uniform surface cooling, and options for multichannel and jet impingement designs to achieve maximum thermal efficiency and reliability.

High-Performance Cold Plate
High-Performance Cold Plate

Cold Plates

ATS offers a broad range of high-performance liquid cold plates engineered for efficient heat removal from high-power components. With options including microchannel, tubed, dual-sided, and custom designs, ATS cold plates deliver low thermal resistance and reliable performance for demanding electronics and power-dense applications.

AI Specific Heat Sinks

High-performance heat sinks specifically engineered for NVIDIA Jetson™ and AMD Kria™ SOMs, available in both passive and active configurations. Each solution includes pre-assembled thermal interface material and mounting hardware, delivering reliable, ready-to-install cooling for edge AI, robotics, and embedded computing applications.

High-Performance Cold Plate

Ready to take your AI or data center cooling to the next level?

Partner with ATS for proven, engineered thermal solutions — from precision cold plates to scalable liquid cooling systems. Contact our experts today to design the perfect cooling solution for your application.