HeatPipe Design Tool

iHeatPipe™ Design Tool

Tell us your device requirements — our tool will recommend a suitable off-the-shelf ATS heat pipe that meets your specifications or guide you through a complete custom engineering design process.

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1. Your requirements

2. Choose your path

3. Details

4. Review

5. Results

Step 1 — What does your application need? (everything here comes from a datasheet or a ruler)

Heat load, Q (W)

Total power the device dissipates — from the component datasheet (TDP / P_D)

Desired device case temperature (°C)

Maximum case temperature your device allows — from the datasheet (T_C max). If it only gives junction temperature T_J, subtract θ_JC×Q first.

Ambient air temperature (°C)

Air temperature inside your enclosure or at the heat sink inlet

Heat transport distance (mm)

Distance from the hot device to where the heat will be dumped — measure it in your layout. This sets the heat pipe length.

Heat pipe shape

Flat pipes attach more easily to components; round pipes suit drilled fin stacks

Orientation (° from horizontal)

How the pipe will sit in your final assembly

Number of bends

Bends needed to route around components

Angle of each bend (°)

Each bend costs ≈2.5% of capacity per 45° and needs a minimum bend radius (ATS: 3× diameter)

Step 2 — How would you like to proceed?

Recommend an ATS heat pipe for my requirements

The fastest route. The tool searches ATS’s catalog of standard round and flat heat pipes and recommends part numbers that meet your specification (length within ±15% of your transport distance), rated with ATS published performance data. No heat pipe expertise needed.

I’ll specify the engineering details

Full design mode. You choose the envelope material, exact geometry, wick structure and working fluid; the tool computes transport limits, thermal resistance, effective conductivity and the complete temperature chain from the validated physics model.

Step 3 — Condenser cooling

How is the condenser end cooled?

Heat sink datasheets list thermal resistance in °C/W

Condenser cooling thermal resistance (°C/W)

Typical: 0.2–1.0 °C/W forced air, 1–5 °C/W natural convection

Cold surface temperature (°C)

Temperature the cold plate holds the condenser at

Envelope material and geometry

Envelope (pipe) material

Copper: standard for electronics. Aluminum: lighter; limits wick and fluid choices.

Total length (mm)

Prefilled from your transport distance — adjust if needed

Evaporator length (mm)

Length of contact with the hot device / heat spreader block

Condenser length (mm)

Length of contact with the heat sink or cold plate

Outer diameter (mm)

Standard round sizes. Auto-select picks the smallest that carries the load with 25% margin AND holds your case temperature.

Flattened height (mm)

A flat pipe is a round pipe flattened to this height; lower profile costs some capacity. Width follows from the starting diameter.

Step 4 — Wick structure and working fluid

Wick type

The wick pumps liquid back to the hot end by capillary action

Working fluid

Must be chemically compatible with the envelope and suit your temperature range

Step 5 — Review your inputs

Save this design / contact ATS

I would like an ATS engineer to contact me about this design