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ATS-X51325R-C1-R0 32.5 x 32.5 x 19.5  mm   BGA Heat Sink - High Performance maxiFLOW/superGRIP-Low-Profile
*Image above is for illustration purpose only..
32.5 x 32.5 x 19.5 mm  BGA Heat Sink - High Performance maxiFLOW/superGRIP-Low-Profile
ATS Part#: ATS-X51325R-C1-R0
Description: 32.5 x 32.5 x 19.5 mm  BGA Heat Sink - High Performance maxiFLOW/superGRIP-Low-Profile
Component Specific:
Heat Sink Type: maxiFLOW
Heat Sink Attachment: superGRIP
Installation Guide: Download PDF
Thermal Performance: See detail
Mechanical Drawing: See detail
  • Requires minimal space around the component's perimeter; ideal for densely populated PCBs
  • Allows the heat sink to be detached and reattached without damaging the component or the PCB, an important feature in the event a PCB may need to be reworked
  • Strong, uniform attachment force helps achieve maximum performance from phase-change TIMs
  • Eliminates the need to drill mounting holes in the PCB
  • Assembly comes standard with a high performance maxiFLOW™ heat sink, which maximizes convection (air) cooling. Please refer to the superGRIP™  Keep-Out Guidelines and superGRIP™  Installation/Removal Guide for further details
  • Comes standard with clean break, reworkable, Chomerics T-766 phase change material
  • Designed for standard height components, from 1.5 to 2.9 mm
Product Details
Part Number Length
(mm)
Width
(mm)
Height
(mm)
Fin Tip to Fin Tip
(mm)
TIM FINISH Data Sheet RoHS & REACH
ATS-X51325R-C1-R0 32.5 32.5 19.5 57.4 T766 Blue Anodized download data sheet

Application Notes for maxiFLOW superGRIP Low Profile

Low-profile maxiFLOW™ heat sinks are designed for component heights ranging from 1.5-2.99 mm and the specially-designed fin array increases the surface area to provide the highest thermal performance per volume occupied when compared to other heat sinks on the market.

The low-profile, spread-fin array maximizes surface area and enhances convection cooling, while superGRIP™ attachment technology offers secure hold without a significant increase in footprint or the need to drill holes in the board.

Using superGRIP™ heat sink attachment technology also gives design engineers more flexibility because of their easy assembly and removal. There is no damage to the board, which is important because of dense PCB routing and the potential need for rework.

Thermal Performance
Schematic Image AIR VELOCITY THERMAL RESISTANCE
FT/MIN M/S °C/W Unducted Flow °C/W Ducted Flow

*Image above is for illustration purpose only.
100 0.5 N/A N/A
200 1.0 2.7 2.0
300 1.5 2.1 N/A
400 2.0 1.9 N/A
500 2.5 1.7 N/A
600 3.0 1.5 N/A
700 3.5 1.4 N/A
800 4.0 1.3 N/A

maxiFLOW superGRIP Low Profile Notes

  • Length and width dimensions refer to the size of the component. Dimensions of the heat sink are subject to tolerances of up to .99 mm in order to accommodate the clip assembly
  • Thermal performance data are provided for reference only. Actual performance may vary by application
  • ATS reserves the right to update or change its products without notice to improve the design or performance
  • Additional tooling fees may be required for custom applications
  • Products generally available and in stock through ATS’s distribution channels. Typical lead time is a minimum of 4-6 weeks
  • Contact ATS to learn about custom options available

ATS-X51325R-C1-R0
32.5 x 32.5 x 19.5 mm  BGA Heat Sink - High Performance maxiFLOW/superGRIP-Low-Profile
download data sheet
ATS-MaxiGRIP
Shock and Vibe Compliance Data
download Shock and Vibe Compliance Data
superGRIP™
Installation & Removal
download data sheet
superGRIP™
Clearance Guidelines
download data sheet
ATS-maxiGRIP
Installation Guidelines
download data sheet
ATS-maxiGRIP
Clearance Guidelines
download data sheet
RoHS
Obtain RoHS Certificate
download data sheet