Tag Archives: data center

Cooling AI Data Centers

How important are AI data centers? In just months, Elon Musk’s xAI team converted a factory outside Memphis into a cutting-edge, 100,000-GPU center for training the Colossus supercomputer—home to the Grok chatbot.

Initially powered by temporary gas turbines (later replaced by grid power), Colossus installed its first 100,000 chips in only 19 days, drawing praise from NVIDIA CEO Jensen Huang. Today, it operates 200,000 GPUs, with plans to reach 1 million GPUs by the end of 2025. [1]

Figure 1 – Elon Musk’s 1 Million Sq Ft xAI Colossus Supercomputer Facility near Memphis, TN. [1]

There are about 12,000 data centers throughout the world, nearly half of them in the United States. Now, more and more of these are being built or retrofitted for AI-specific workloads. Leaders include Musk’s xAI, Microsoft, Meta, Google, Amazon, OpenAI, and others.

High power is essential for such operations, and like computational electronics of all sizes heat issues need to be resolved.

GenAI

A key driver of data center growth is Generative AI (GenAI)—AI that creates text, images, audio, video, and code using deep learning. Chatbots and large language model ChatGPT are examples of GenAI, along with text-to-image models that generate images from written descriptions.

Managing all this is possible from new generations of processors, mainly GPUs. They all draw on higher levels of power and generate higher amounts of heat.

Figure 2 – Advanced AI Processor, the NVIDIA GH200 Grace Hopper Superchip with Integrated CPU to Increase Speed and Performance. [2,3]

AI data centers prioritize HPC hardware: GPUs, FPGAs, ASICs, and ultra-fast networking. Compared to CPUs (150–200 W), today’s AI GPUs often run >1,000 W.  . To handle massive datasets and complex computations in real-time they need significant power and cooling infrastructure.

Data Center Cooling Basics

Traditional HVAC was sufficient for older CPU-driven data centers. Today’s AI GPUs demand far more cooling, both at the chip level and facility-wide. This has propelled a need for more efficient thermal management systems at both the micro (server board and chip) and macro (server rack and facility) levels. [4]

Figure 3 – The Colossus AI Supercomputer Now Runs 200,000 GPUs. It Operates at 150MW Power, Equivalent to 80,000 Households. [5]

At Colossus, Supermicro 4U servers house NVIDIA Hopper GPUs cooled by:

  • Cold plates
  • Coolant distribution manifolds (1U between each server)
  • Coolant distribution units (CDUs) with redundant pumps at each rack base [6]

Each 4U server is equipped with eight NVIDIA H100 Tensor Core GPUs. Each rack contains eight 4U servers, totaling 64 GPUs per rack.

Between every server is a 1U manifold for liquid cooling. They connect with CDUs, heat-exchanging Coolant Distribution Units at the bottom of each rack that include a redundant pumping system. The choice of coolant is determined by a range of hardware and environmental factors.

Figure 4 – Each Colossus Rack Contains Eight 4U Servers, Totaling 64 GPUs Per Rack. Between Each Server is a 1U Manifold for Liquid Cooling. [7]
Figure 5 – The Base of Each Rack Has a 4U CDU Pumping System with Redundant Liquid Cooling. [7]

Role of Cooling Fans

Fans remain essential for DIMMs, power supplies, controllers, and NICs.

Figure 6 – Rear Door Liquid-Cooled Heat Exchangers. [7]

At Colossus, fans in the servers pull cooler air from the front of the rack, and exhaust the air at the rear of the server. From there, the air is pulled through rear door heat exchangers. The heat exchangers pass warm air through a liquid-cooled, finned heat exchanger/radiator, lowering its temperature before it exits the rack.

Direct-to-Chip Cooling

NVIDIA’s DGX H100 and H200 server systems feature eight GPUs and two CPUs that must run between 5°C and 30°C. An AI data center with a high rack density houses thousands of these systems performing HPC tasks at maximum load. Direct liquid cooling solutions are required.

Figure 7 – An NVIDIA DGX H100/H200 System Featuring Eight GPUs [8]
Figure 8 – The NVIDIA H100 SmartPlate Connects to a Liquid Cooling System to Bring Microconvective Chip-Level Cooling That Outperforms Air Cooling by 82%. [9]

Direct liquid cooling (cold plates contacting the GPU die) is the most effective method—outperforming air cooling by 82%. It is preferred for high-density deployments of the H100 or GH200.

Scalable Cooling Modules

Colossus represents the world’s largest liquid-cooled AI cluster, using NVIDIA + Supermicro technology. For smaller AI data centers, Cooling Distribution Modules (CDMs) provide a compact, self-contained solution.

Figure 9 – The iCDM-X Cooling Distribution Module from ATS Includes Pumps, Heat Exchanger and Liquid Coolant for Managing Heat from AI GPUs and Other Components. [10]

Most AI data centers are smaller, and power and cooling needs are lower, but essential. Many heat issues can be resolved using self-contained Cooling Distribution Modules.

The compact iCDM-X cooling distribution module provides up to 1.6MW of cooling for a wide range of AI GPUs and other chips. The module measures and logs all important liquid cooling parameters. It uses using just 3kW of power, and no external coolant is required.

These modules include:

•         Pumps

•         Heat exchangers

•         Cold plates

•         Digital monitoring (temp, pressure, flow)

Their sole external component is one or more cold plates removing heat from AI chips. ATS provides an industry-leading selection of custom and standard cold plates, including the high-performing ICEcrystal series.

Figure 10 – The ICEcrystal Cold Plates Series from ATS Provide 1.5 kW of Jet Impingement Liquid Cooling Directly onto AI Chip Hotspots.

Cooling Edge AI and Embedded Applications

AI isn’t just for big data centers—edge AI, robotics, and embedded systems (e.g., NVIDIA Jetson Orin, AMD Kria K26) use processors running under 100 W. These are effectively cooled with heat sinks and fan sinks from suppliers like Advanced Thermal Solutions. [11]

Figure 11 – High Performance Heat Sinks for NVIDIA and AMD AI Processors in Embedded and Edge Applications. [11]

NVIDIA also partners with Lenovo, whose 6th-gen Neptune cooling system enables full liquid cooling (fanless) across its ThinkSystem SC777 V4 servers—targeting enterprise deployments with NVIDIA Blackwell + GB200 GPUs. [12]

Figure 12 – Lenovo’s Neptune Direct Water Cooling Removes Heat from Power Supplies, for Completely Fanless Operation. [12]

Benefits gained from the Neptune system include:

  • Full system cooling (GPUs, CPUs, memory, I/O, storage, regulators)
  • Efficient for 10-trillion-parameter models
  • Improved performance, energy efficiency, and reliability

Conclusion

With surging demand, AI data centers are now a major construction focus. Historically, cooling problems are the #2 cause of data center downtime (behind power issues). With the high power needed for AI computing, these builds should carefully fit with their local communities in terms of electrical needs and sources, and water consumption. [13]

AI workloads will increase U.S. data center power demand by 165% by 2030 (Goldman Sachs), with nearly double 2022 levels (IBM/Newmark). Sustainable design and resource-conscious cooling are essential for the next wave of AI infrastructure. [14,15]

References

1. The Guardian, https://www.theguardian.com/technology/2025/apr/24/elon-musk-xai-memphis

2. Fibermall, https://www.fibermall.com/blog/gh200-nvidia.htm

3. NVIDA, https://resources.nvidia.com/en-us-grace-cpu/grace-hopper-superchip?ncid=no-ncid

4. ID Tech Ex, https://www.idtechex.com/en/research-report/thermal-management-for-data-centers-2025-2035-technologies-markets-and-opportunities/1036

5. Data Center Frontier, https://www.datacenterfrontier.com/machine-learning/article/55244139/the-colossus-ai-supercomputer-elon-musks-drive-toward-data-center-ai-technology-domination

6. Supermicro, https://learn-more.supermicro.com/data-center-stories/how-supermicro-built-the-xai-colossus-supercomputer

7. Serve The Home, https://www.servethehome.com/inside-100000-nvidia-gpu-xai-colossus-cluster-supermicro-helped-build-for-elon-musk/2/

8. Naddod, https://www.naddod.com/blog/introduction-to-nvidia-dgx-h100-h200-system

9. Flex, https://flex.com/resources/flex-and-jetcool-partner-to-develop-liquid-cooling-ready-servers-for-ai-and-high-density-workloads

10. Advanced Thermal Solutions, https://www.qats.com/Products/Liquid-Cooling/iCDM

11. Advanced Thermal Solutions, https://www.qats.com/Heat-Sinks/Device-Specific-Freescale

12. Lenovo, https://www.lenovo.com/us/en/servers-storage/neptune/?orgRef=https%253A%252F%252Fwww.google.com%252F

13. Deloitte, https://www2.deloitte.com/us/en/insights/industry/technology/technology-media-and-telecom-predictions/2025/genai-power-consumption-creates-need-for-more-sustainable-data-centers.html

14.GoldmanSachs, https://www.goldmansachs.com/insights/articles/ai-to-drive-165-increase-in-data-center-power-demand-by-2030

15. Newmark, https://www.nmrk.com/insights/market-report/2023-u-s-data-center-market-overview-market-clusters

Latest Qpedia Now Available for Download

Qpedia Thermal eMagazine June 2013

Qpedia Thermal eMagazine June 2013

Qpedia Thermal eMagazine, Volume 7, Issue 6, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues.

This month’s featured articles include:

Enhancing Heat Sink Performance Using Thermoelectric Coolers

With the increase in the power dissipation of components and the parallel reduction of their size, engineers and researchers across the globe have been predicting that the era of air cooling might come to an end. Even though in some applications, with very high power dissipations such as IGBTs, air cooling may not be adequate and liquid cooling is a must; air cooling will continue to be the first choice for most electronic cooling applications for many years to come. Advances in air cooling continue to extend its use and the implementation of thermoelectric coolers (TECs) in heat sink applications is one such effort.

Immersion Liquid Cooling for Servers in Data Centers

Data center designers and operators have invented many ways to improve the data center’s thermal efficiency, such as optimizing the rack layout and air conditioner location, separating cold aisles and hot aisles, optimizing the configuration of pipes and cables in under-floor plenum, introducing liquid cooling to high-power severs. While the above methods can improve the data center heat load management, they cannot dramatically reduce the Power Usage Effectiveness (PUE). This article reviews two relatively new solutions: active single-phase immersion cooling technology proposed by Green Revolution Cooling (GRC) and a passive two-phase immersion cooling technology proposed by the 3M Company.

Industry Developments: Piezoelectric Cooling

Piezoelectric fans and jets must overcome various materials, thermal and mechanical challenges to become widely used in electronics cooling, but because they consume just 1/150 of the electricity of circular fans, run with little noise and have no parts that will wear out, they remain of great interest. In this article, a number of issues are addressed, including the inverse effect of the piezoelectric phenomena and dual piezoelectric cooling jets.

Technology Review: Innovative Cold Plate Designs, 2007 – 2012

In this issue our spotlight is on innovative cold plate designs. There is much discussion about its deployment in the electronics industry, and these patents show some of the salient features that are the focus of different inventors.

& Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.

Download the issue now.

Not a Qpedia subscriber? Subscribe Now for free at: http://www.qats.com/Qpedia-Thermal-eMagazine/Subscribe-to-Qpedia and see why over 18,000 engineers read Qpedia.

Did you know Qpedia also publishes a book series? The five volume set contains 248 in-depth articles, researched and written by veteran engineers. They address the most critical areas of electronics cooling, with a wide spectrum of topics and thorough technical explanation. Order Now.

How to apply adaptive cooling to keep cloud computing data centers cool

Data centers are the heart of cloud computing. They are impressive computing systems in and of themselves. But with so much CPU power generating so much heat how can thermal engineers architect them for optimal thermal management? One solution is adaptive cooling. Our thermal engineering team has written a white paper addressing adaptive cooling and it can be yours without cost or obligation, just click to this link: “ATS White Paper: Adaptive Cooling in Data Centers“

Next Generation Tools give Data Centers New Strategies for Thermal Management

Todd Schneider over at Electrorack has penned an article on some new approaches to thermal management in the data center. Among the topics Tom covers:

  • An update on metrics being used to determine facility efficiency
  • What’s behind the pressure on data center managers to comply with Go Green initiatives for power usage
  • Discussion of different solutions including: air side solutions, aisle containment solutions, active and passive ducted containment, water-side refrigerant and rear-door exchangers

Todd’s article is well worth a read to help in thinking through what might be next in your data center thermal management strategy. You can read the entire article at Data Center Knowledge by clicking through to this link: “Combatting Thermal Issues with Next-Gen Tools“

ATS Thermal Webinar: Thermal Management of a Datacenter August 12, 2PM

Here’s an open invite to all our readers to our next webinar, “Thermal Management of a Data Center”. We’ll be hosting it on August 12, 2010 at 2PM EST. Our webinars are no charge and taught by our R&D staff to keep them light on “mareticture” and heavy on the kind of technical details engineers and others can use to develop effective thermal management solutions.

Data Centers are effectively large scale systems composed of the components of racks of computers. Novel approaches to cooling data centers of various sizes are being undertaken today to obtain the best and most green cooling possible. This vertical webinar will consider approaches for small, medium and large scale data centers to achieve a given data centers cooling goals.

You can register for our webinar at this link: “Thermal Management of a Data Center Registration“