Tag Archives: magazine

The Monthly Qpedia is Out!

Qpedia_Aug13_coverThe monthly issue of Qpedia has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues.

This month’s featured articles include:

Application of TECs to Thermal Management of 3D ICs

From the thermal perspective, 3D stacked chips pose different challenges than what has been experienced in 2D packaging. For example, the heat dissipation of 3D ICs is highly non-uniform and multidirectional, due to the intrinsic chip architecture and the available real estate. When cooling at sub-ambient temperatures is necessary, the small footprint of a 3D chip becomes an impediment to deploying a cooling solution. Additionally, precision temperature control becomes difficult, since the surface to be controlled may be buried deep in the 3D stack. In response to cooling concerns about 3D ICs, this article presents a review of methods available for cooling 3D ICs to sub ambient temperatures using TECs.

Challenges in Testing Thermal Interface Materials

When choosing a thermal interface material (TIM), most of the time we look at the datasheet and find the thermal impedance if it is a solid material or the thermal conductivity if it is grease. Then, we calculate the thermal resistance and temperature rise with those numbers. But, how do we know that a TIM is performing as advertised? Can we really tell if one TIM will perform better than another, based on their specs? Additionally, the material presented in this article suggests that the data printed in TIM datasheets should be evaluated carefully to ensure that the testing procedures are similar to the actual application. Furthermore, even with the existing standards, many variables still exist.

Industry Developments: Portable Cooling Systems

Buildings and rooms constructed to house data centers are getting larger, more congested and warmer. Many of these structures have sophisticated thermal management systems featuring high-powered coolers or harnessing cold local water or air. For some needs, however, a portable cooling system can provide a much simpler and less costly solution. These systems can deliver direct cooling relief to equipment hot spots, and some can lower a room’s temperature when a central cooling system is inadequate or nonexistent.

Technology Review: Enhancing Heat Transfer on Surfaces

In this issue our spotlight is on enhancing heat transfer on surfaces. There is much discussion about its deployment in the electronics industry, and these patents show some of the salient features that are the focus of different inventors.

Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.

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Don’t forget the Qpedia Book Series Promotion that coolingZONE is currently running! Save 25% off the hardcover books that are a must have in every engineer’s library!

Latest Qpedia Now Available for Download

Qpedia Thermal eMagazine June 2013

Qpedia Thermal eMagazine June 2013

Qpedia Thermal eMagazine, Volume 7, Issue 6, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues.

This month’s featured articles include:

Enhancing Heat Sink Performance Using Thermoelectric Coolers

With the increase in the power dissipation of components and the parallel reduction of their size, engineers and researchers across the globe have been predicting that the era of air cooling might come to an end. Even though in some applications, with very high power dissipations such as IGBTs, air cooling may not be adequate and liquid cooling is a must; air cooling will continue to be the first choice for most electronic cooling applications for many years to come. Advances in air cooling continue to extend its use and the implementation of thermoelectric coolers (TECs) in heat sink applications is one such effort.

Immersion Liquid Cooling for Servers in Data Centers

Data center designers and operators have invented many ways to improve the data center’s thermal efficiency, such as optimizing the rack layout and air conditioner location, separating cold aisles and hot aisles, optimizing the configuration of pipes and cables in under-floor plenum, introducing liquid cooling to high-power severs. While the above methods can improve the data center heat load management, they cannot dramatically reduce the Power Usage Effectiveness (PUE). This article reviews two relatively new solutions: active single-phase immersion cooling technology proposed by Green Revolution Cooling (GRC) and a passive two-phase immersion cooling technology proposed by the 3M Company.

Industry Developments: Piezoelectric Cooling

Piezoelectric fans and jets must overcome various materials, thermal and mechanical challenges to become widely used in electronics cooling, but because they consume just 1/150 of the electricity of circular fans, run with little noise and have no parts that will wear out, they remain of great interest. In this article, a number of issues are addressed, including the inverse effect of the piezoelectric phenomena and dual piezoelectric cooling jets.

Technology Review: Innovative Cold Plate Designs, 2007 – 2012

In this issue our spotlight is on innovative cold plate designs. There is much discussion about its deployment in the electronics industry, and these patents show some of the salient features that are the focus of different inventors.

& Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.

Download the issue now.

Not a Qpedia subscriber? Subscribe Now for free at: http://www.qats.com/Qpedia-Thermal-eMagazine/Subscribe-to-Qpedia and see why over 18,000 engineers read Qpedia.

Did you know Qpedia also publishes a book series? The five volume set contains 248 in-depth articles, researched and written by veteran engineers. They address the most critical areas of electronics cooling, with a wide spectrum of topics and thorough technical explanation. Order Now.

The New Qpedia Thermal eMagazine is Out

Qpedia Thermal eMagazine, Volume 7, Issue 4, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues.

Featured articles in this issue include:

Dropwise Condensation in Vapor Chambers
Considerable attention has been devoted in the past to the evaporation process taking place in a vapor chamber. However, increased heat fluxes at the condensation end have prompted efforts to improve the condensation performance of the vapor chambers. This article presents a review of a novel method for improving the thermal performance of a vapor chamber condensing section by using special surfaces promoting dropwise condensation.

 

Heat Sink Manufacturing Using Metal Injection Molding

Using Metal Injection Molding It is only in the last few years that metal injection molding (MIM) has gained a foothold in the thermal community and its salient advantages have become more evident. The MIM process allows intricate features to be added into the heat sink design to boost thermal performance and its production process is very scalable compared with machining. Injection molding enables complex parts to be formed as easily as simple geometries, thereby allowing increased design freedom.  This article explore the merits of copper material in the MIM process.

 

Industry Developments: Thermoelectric Modules and Coolers

Thermoelectric modules (TEMs) are rugged, reliable and quiet devices that serve as heat pumps. The real heat-moving components inside TEMs are thermoelectric coolers or TECs. These are solid-state heat pumps and are designed for applications where temperature stabilization, temperature cycling, or cooling below ambient, are required. Today, TEMs are used in electro-optics applications, such as the cooling and stabilizing of laser diodes, IR detectors, cameras (charge coupled device), microprocessors, blood analyzers and optical switches. This article explores some of the latest developments in these devices.

 

Technology Review: Reducing Thermal Spreading Resistance in Heat Sinks

In this issue our spotlight is on reducing spreading resistance in heat sinks. There is much discussion about how this phenomenon can be achieved, and these patents show some of the salient features that are the focus of different inventors.

 

Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.

 

Download the issue now.

 

Not a Qpedia subscriber? Subscribe Now for free at: http://www.qats.com/Qpedia-Thermal-eMagazine/Subscribe-to-Qpedia and see why over 18,000 engineers read Qpedia.

Latest Qpedia Issue Marks New Milestone

Qpedia Thermal eMagazine | Volume 6 | Issue 12The latest Qpedia Thermal eMagazine has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues.

This month’s featured articles are:

Pin-Fin Heat Sink Performance Under Air Jet Impingement

This paper summarizes the research on pin fin heat sinks under single confined jets, conducted by El-Sheikh and Garimella, and the study of pin fin heat sinks under single free jets, completed by Issa and Ortega Their experimental tests shows that the thermal performance of pin fin heat sinks behave similarly under some circumstances and act differently under some other configurations for confined jet impingement and free jet impingement. For engineers, this has implications for their use of jet impingement as a cooling method.

The Challenges of TIM Selection in Today’s Demanding Electronics Cooling Environment

With ever hotter running devices, users often rely quite heavily on thermal interface material (TIM) to provide an added factor in obtaining the margins that they require to meet product qualification. Thus, TIM continues to play a critical role in todays electronics environment, proving a viable heat conductive medium between the silicon heat source and the heat dissipating device, and serving to decrease the thermal resistance between chip and heat sink. This paper explores some of the test approaches undertaken by researchers with regard to TIM and why users must be particularly careful in selecting TIM.

Industry Developments: Cooling Automotive Electronic Control Units

As the numbers of ECUs increase, so do their design differences and the complexity of their software. And, as more operators and passengers rely on ECUs for a better driving experience, designers and OEMs must ensure that their performance lives up to expectations. In this piece, the writer explores the various thermal challenges facing ECUs.

Technology Review: Cold Plates 2010 to 2012

Qpedia continues its review of technologies developed for electronics cooling applications. We are presenting selected patents that were awarded to developers around the world to address cooling challenges. After reading the series, you will be more aware of both the historic developments and the latest breakthroughs in both product design and applications.

This release marks the final issue of Volume 6. Qpedia has now published 72 issues and 288 articles in 6 volumes and hardbound book sets. Thank you to the editors and guest contributors who have spent countless hours researching, writing, and sharing their technical expertise with the engineering community. We are proud to be the only monthly publication dedicated to the thermal management of electronics.

Want to be a Qpedia guest editor? Submit a study, white paper, patent release, or technical article at www.qats.com.

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New Qpedia Thermal eMagazine Published!

Qpedia Thermal eMagazine, Volume 6, Issue 11, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues. Featured articles in this month’s issue include:

Honeycomb Heat Sinks for LEDs

LEDs, or light-emitting diodes, are a form of solid-state lighting. An LED light is often made of a small piece of semiconductor, an integrated optical lens used to shape its radiation pattern, and a heat sink, used to dissipate heat and maintain the semiconductor at low operating temperature. LED lights present many advantages over incandescent light sources, including lower energy consumption, longer lifetime, improved physical robustness, smaller size and faster switching. This article examines Ma et al’s  findings with respect to the honeycomb heat sink design employed in LEDs, which has proven to be highly efficient.

Characteristics of Thermosyphons in Thermal Management

With the increase of heat fluxes and shrinking chip sizes in electronics applications, there is a need to spread the heat from the small chip to the larger heat sink or to transport the heat to a location where there is ample space to remove the heat. Heat pipes, vapor chambers and thermosyphons have been introduced to undertake this task and, in this article, we focus on some aspects of the design of thermosyphons. The advantage of thermosyphons is that they have no capillary limit and can transport large amounts of heat over long distances.

Industry Developments: Heat Pipes Providing High Performance

Heat pipes are increasing in type and use for the benefits they provide. Because of their lower total thermal resistance, heat pipes transfer heat more efficiently and evenly than solid aluminum or copper. Heat pipes contain a small quantity of working fluid (e.g. water, acetone, nitrogen, methanol, ammonia). Learn the conclusions of a recent study that focused on the best working fluid and another study of heat pipes in outer space.

Technology Review: Cold Plates, 2010 to 2012

Qpedia continues its review of technologies developed for electronics cooling applications. We are presenting selected patents that were awarded to developers around the world to address cooling challenges. After reading the series, you will be more aware of both the historic developments and the latest breakthroughs in both product design and applications.

Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.

Download the issue now.

Not a Qpedia subscriber? Subscribe Now for free at: http://www.qats.com/Qpedia-Thermal-eMagazine/Subscribe-to-Qpedia and see why over 18,000 engineers read Qpedia.