With Thermal Engineer day approaching (7/24) we here at ATS would like to thank all of the PR firms and digital news magazines who covered our new clipKIT campaign.
As a token of our appreciation, we have provided a link to our customers and viewers to download our clipKIT data sheet for all your attachment needs. HERE.
Posted in ATS News, Uncategorized
Tagged Advanced Thermal Solutions, electronics, electronics cooling, engineering, engineering education, Fan, Fan Characterization, heat sink, heat sink attach, publication, QPedia, temperature measurement, thermal analysis, thermal conductivity, thermal design, thermal engineering, thermal management, webinar, Wind Tunnel
Qpedia Thermal eMagazine, Volume 7, Issue 5, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues.
Featured articles in this issue include:
Next Generation Processor Cooling and Power Trends
CMOS semiconductor technology has been faithfully following Moore’s Law for several decades now. This Law states that the number of transistors per unit area doubles about every year [1]. This trend is likely to continue in the foreseable future. In addition, two other technical trends will accompany the roadmap of future processors: manycore chip multiprocessors and 3D integration. This article presents a review of recent predictions for future 2D and 3D manycore processors architectures.
Thermal Performance of Thin Flat Heat Pipes
As the demands for faster, smaller and multifunctional mobile devices, such as cell phones, PDAs, and netbooks, keep increasing, both system and electronic engineers are trying to integrate more functional models into smaller and thinner devices. This has forced thermal engineers into looking for more innovative and effective passive methods to cool semiconductor devices with their increasing power density. Thin flat heat pipes, whose thickness is less than 1.5 mm, have found more applications on mobile devices and certainly drawn more attention from researchers.
Industry Developments: Smartphone Cooling Systems
With increasingly processor-intensive apps being used on mobile devices, the steadily powerful chipsets in smartphones are running hotter than ever. Many desktop computers and larger, powerful computing systems use water cooling to keep their CPUs from overheating. Now smaller versions of these cooling systems are being employed in warm smart phones. While NEC was the first major smartphone company to launch a liquid-embedded smartphone, other manufacturers, such as Apple, Samsung Electronics and HTC are likely to soon follow in 2013.
Technology Review: Air Delivery Systems Utilizing Piezofan or Standard Fans
In this issue our spotlight is on air delivery systems using piezo and standard fans. There is much discussion about this and these patents show some of the salient features that are the focus of different inventors.
Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.
Download the issue now.
Not a Qpedia subscriber? Subscribe Now for free at: http://www.qats.com/Qpedia-Thermal-eMagazine/Subscribe-to-Qpedia and see why over 18,000 engineers read Qpedia.
Don’t miss the next ATS webinar, “Using Thermal Interface Materials to Improve Heat Sink Thermal Performance”.
This is a free, pre-recorded webinar that will be held at 2pm ET on Thursday July 18th. Attendees will gain a much better understanding on what thermal interface materials are, how they function and how to best use them. The pros and cons of various thermal interface materials is also discussed. This class is from the perspective of the engineer who uses the material not one of the thermal interface material suppliers themselves.
There is no fee to attend, but virtual seating is limited so Register Now
Posted in Webinar
Tagged education, engineering, engineering education, engineering training, engineering webinar, heat sink, mechanical engineer, TIM, training, webinar
Qpedia Thermal eMagazine, Volume 6, Issue 11, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues. Featured articles in this month’s issue include:
Honeycomb Heat Sinks for LEDs
LEDs, or light-emitting diodes, are a form of solid-state lighting. An LED light is often made of a small piece of semiconductor, an integrated optical lens used to shape its radiation pattern, and a heat sink, used to dissipate heat and maintain the semiconductor at low operating temperature. LED lights present many advantages over incandescent light sources, including lower energy consumption, longer lifetime, improved physical robustness, smaller size and faster switching. This article examines Ma et al’s findings with respect to the honeycomb heat sink design employed in LEDs, which has proven to be highly efficient.
Characteristics of Thermosyphons in Thermal Management
With the increase of heat fluxes and shrinking chip sizes in electronics applications, there is a need to spread the heat from the small chip to the larger heat sink or to transport the heat to a location where there is ample space to remove the heat. Heat pipes, vapor chambers and thermosyphons have been introduced to undertake this task and, in this article, we focus on some aspects of the design of thermosyphons. The advantage of thermosyphons is that they have no capillary limit and can transport large amounts of heat over long distances.
Industry Developments: Heat Pipes Providing High Performance
Heat pipes are increasing in type and use for the benefits they provide. Because of their lower total thermal resistance, heat pipes transfer heat more efficiently and evenly than solid aluminum or copper. Heat pipes contain a small quantity of working fluid (e.g. water, acetone, nitrogen, methanol, ammonia). Learn the conclusions of a recent study that focused on the best working fluid and another study of heat pipes in outer space.
Technology Review: Cold Plates, 2010 to 2012
Qpedia continues its review of technologies developed for electronics cooling applications. We are presenting selected patents that were awarded to developers around the world to address cooling challenges. After reading the series, you will be more aware of both the historic developments and the latest breakthroughs in both product design and applications.
Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.
Download the issue now.
Not a Qpedia subscriber? Subscribe Now for free at: http://www.qats.com/Qpedia-Thermal-eMagazine/Subscribe-to-Qpedia and see why over 18,000 engineers read Qpedia.
Posted in Qpedia Thermal eMagazine
Tagged academia, article, azar, cold plate, education, electronics, electronics cooling, electronics magazine, engineering, engineering education, engineering magazine, free magazine, heat pipe, heat sink, heat sink design, heat transfer, heatsink, honeycomb heat sink, LED, LED cooling, LED heatsink, magazine, patent, publication, reference, semiconductor, solid state lighting, technical, technology, thermal engineering, thermal management, thermal resistance, thermodynamics, thermosyphons, Vapor Chamber
coolingZONE is running a holiday promotion on the Qpedia Book Series, discounting 25% off the normal retail value until December 31, 2012. Qpedia Thermal eMagazine is the official media sponsor of coolingZONE. The Qpedia book series provides an expert resource for engineering professionals, professors, students and others who want to learn more about the theories and applications of electronics thermal management.
The four volume set contains nearly 200 in-depth articles, researched and written by veteran engineers. They address the most critical areas of electronics cooling, with a wide spectrum of topics and thorough technical explanation. Each article features color illustrations and images along with important thermal calculations and formulas.
Qpedia Volume 1 topic highlights:
– Heat sink design
– Pool boiling
– Sensors
– Thermal chassis
– Pitot tubes
– Heat transfer
Qpedia Volume 2 topic highlights:
– Thermal grease
– Vapor chamber cooling
– Liquid cooling
– Natural convection cooling
– Phase change materials
Qpedia Volume 3 topic highlights:
– CFD modeling
– PCB optimization
– Jet impingement cooling
– LED cooling
– Cold plates
– Refrigeration systems
Qpedia Volume 4 topics highlights:
– Multilayer mini-channel heat sinks
– Electro-osmotic pumps
– Thermoelectric coolers
– High altitude heat transfer
– Data center cooling
– Defense electronics
– Automotive electronics cooling
Check out the video on Qpedia Volume 4
Over fifteen thermal and mechanical engineers combined their expertise to create the articles in this useful collection, including Kaveh Azar, Ph.D. and Bahman Tavassoli, Ph.D., both of whom are internationally recognized experts in the field of the thermal management of electronics. Qpedia Thermal eMagazine, published by Advanced Thermal Solutions, Inc. (ATS) was launched in 2007 as a technical publication dedicated to the thermal management of electronics.
Filled with careful explanations, step-by-step calculations, and practical examples from real life challenges, this expert collection of articles is a must have for any mechanical, electrical, and thermal engineer or anyone interested in the rapidly growing field of electronics cooling.
Order the Qpedia Book Series with 25% off now at www.coolingzone.com The books can be purchased as a complete set, combination, or individually. Volume discounts for organizations and academic institutions are also available.
Posted in Qpedia Thermal eMagazine
Tagged Advanced Thermal Solutions, azar, book, book promotion, book sale, cold plates, cooling technology, coolingzone, data center cooling, electrical engineer, electronics, electronics cooling, electronics industry, engineer, engineering book, engineering calculations, engineering challenges, engineering design, engineering education, engineering formulas, engineering fundamentals, engineering problems, engineering reference, engineering solutions, heat sink design, heat transfer, high altitude heat transfer, holiday sale, junction temperature, LED cooling, mechanical engineer, natural convection cooling, nausselt number, publication, QPedia, sensor, student, temperature measurement, thermal analysis, thermal conductivity, thermal engineering, thermal grease, thermal management, thermal management solutions, thermal studies, thermocouple, thermodynamics