Tag Archives: engineering fundamentals

Holiday Sale: 25 % Off Qpedia Book Series!


coolingZONE is running a holiday promotion on the Qpedia Book Series, discounting 25% off the normal retail value until December 31, 2012. Qpedia Thermal eMagazine is the official media sponsor of coolingZONE. The Qpedia book series provides an expert resource for engineering professionals, professors, students and others who want to learn more about the theories and applications of electronics thermal management.

The four volume set contains nearly 200 in-depth articles, researched and written by veteran engineers. They address the most critical areas of electronics cooling, with a wide spectrum of topics and thorough technical explanation. Each article features color illustrations and images along with important thermal calculations and formulas.

Qpedia Volume 1 topic highlights:

– Heat sink design

– Pool boiling

– Sensors

– Thermal chassis

– Pitot tubes

– Heat transfer

Qpedia Volume 2 topic highlights:

– Thermal grease

– Vapor chamber cooling

– Liquid cooling

– Natural convection cooling

– Phase change materials

Qpedia Volume 3 topic highlights:

– CFD modeling

– PCB optimization

– Jet impingement cooling

– LED cooling

– Cold plates

– Refrigeration systems

Qpedia Volume 4 topics highlights:

– Multilayer mini-channel heat sinks

– Electro-osmotic pumps

– Thermoelectric coolers

– High altitude heat transfer

– Data center cooling

– Defense electronics

– Automotive electronics cooling

Check out the video on Qpedia Volume 4

Over fifteen thermal and mechanical engineers combined their expertise to create the articles in this useful collection, including Kaveh Azar, Ph.D. and Bahman Tavassoli, Ph.D., both of whom are internationally recognized experts in the field of the thermal management of electronics. Qpedia Thermal eMagazine, published by Advanced Thermal Solutions, Inc. (ATS) was launched in 2007 as a technical publication dedicated to the thermal management of electronics.

Filled with careful explanations, step-by-step calculations, and practical examples from real life challenges, this expert collection of articles is a must have for any mechanical, electrical, and thermal engineer or anyone interested in the rapidly growing field of electronics cooling.

Order the Qpedia Book Series with 25% off now at www.coolingzone.com The books can be purchased as a complete set, combination, or individually. Volume discounts for organizations and academic institutions are also available.

Next Webinar “Natural Convection Cooling: Optimizing Heat Sink Fin Spacing and More for Heat Transfer”

The better educated you are about implications of heat in electronics, the better prepared you are when heat problems inevitably occur and the more valuable you will be perceived at your company. Advanced Thermal Solutions breaks down the often complex field of thermal management into individual, key topics that are more easily understood and mastered. Our next webinar, Natural Convection Cooling: Optimizing Heat Sink Fin Spacing and More for Heat Transfer, is on Thursday, November 29, 2012 at 2pm EST.

Most high-powered electronic devices are cooled by forced convection airflow, but occasionally there is a need for natural convection cooling. Determining factors, which include cost, noise, vibration and reliability, can cause the need to eliminate the use of a fan or blower particularly in consumer electronics and outdoor enclosures. Attendees will learn more about how to implement natural convection cooling, how to optimize for fin spacing and other important design elements for a successful thermal management solution.

Register Now for the free webinar “Natural Convection Cooling: Optimizing Heat Sink Fin Spacing and More for Heat Transfer” on Thursday, November 29, 2012 at 2pm EST.

In the meantime, check out the article on “Natural Convection in Vertical Channels” from Qpedia to see how techniques for optimizing heat transfer in natural convection situations.