The Online Publication and Book Series Dedicated to the Thermal Management of Electronics
Qpedia Thermal eMagazine was launched in 2007 as a monthly newsletter focused on the thermal management of
electronics. Now in its 9th year of publication, Qpedia is a highly respected monthly magazine that is distributed
at no charge to over 18,000 engineers. Written and published by the engineers of Advanced Thermal Solutions, Inc.,
Qpedia is a technical resource to help the engineering community solve the most challenging thermal problems. Each
issue provides practical approaches to thermal management challenges and explains the new technologies for
successfully cooling today and tomorrow’s hot-running electronics.
Table of Contents -
November 2009
November 2009
Natural Convection in Vertical Channels
In contrast with airflow generated by the mechanical working of a prime air mover, natural convection results from the buoyancy forces generated by the ambient air being heated by a heat source. Air adjacent to the heat source absorbs heat from the surface, becomes hotter than the surrounding air, and rises due to density differences.
Thermal Issues in Stacked Die Packages
High performance package manufacturers are migrating to stacked die packages. This stacking can be done either laterally or vertically. The most common way to increase memory and support complex functions is to pack more chips on top of each other in a package. In a stacked version, this increases the density of IC elements and the Moore’s law can still be applied.
Heat Sink Transient Response
In general, heat sink response time is closely related to its material properties and to convection heat transfer from its surface. In this article, the transient response of aluminum and copper heat sinks under different heat flux and flow conditions is studied numerically.
General Methods for Measuring Thermal Conductivity
This article provides an overview of the principal methods for measuring thermal conductivity, particularly in electronics thermal management. Designing successful electronics cooling solutions requires an accurate knowledge of the thermal and mechanical properties of the various materials involved.
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