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The Online Publication and Book Series Dedicated to the Thermal Management of Electronics

Qpedia Thermal eMagazine was launched in 2007 as a monthly newsletter focused on the thermal management of electronics. Now in its 9th year of publication, Qpedia is a highly respected monthly magazine that is distributed at no charge to over 18,000 engineers. Written and published by the engineers of Advanced Thermal Solutions, Inc., Qpedia is a technical resource to help the engineering community solve the most challenging thermal problems. Each issue provides practical approaches to thermal management challenges and explains the new technologies for successfully cooling today and tomorrow’s hot-running electronics.

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Table of Contents - October 2009

Current Issues

October 2009

Synthetic Jets Air Cooling: Air Cooling with High Local Heat Transfer Coefficient
As today’s electronics generate more heat inside ever smaller spaces, engineers are challenged to find new ways to effectively cool the components. In this article, we discuss synthetic jets, an air cooling technology that can provide a high local heat transfer coefficient at a low flow rate with low acoustics and high reliability.


Heat Flux Measurement: Practical Applications for Electronics
Heat flux sensors are practical measurement tools which are useful for determining the amount of thermal energy passed through a specific area per unit of time. Measuring heat flux can be useful, for example, in determining the amount of heat passed through a wall or through a human body, or the amount of transferred solar or laser radiant energy to a given area. This article highlights several practical uses of the heat flux sensor in the design of electronics systems.


Hydrodynamic & Thermal Entry Length Correlations for Turbulent Flow in a Cylindrical Tube 
The study of fluid flow in tubes is an important topic in engineering, as it occurs frequently in practice, especially in the design of heat exchanger equipment. Of particular importance to the design engineer is an understanding of the hydrodynamic and thermal entry length correlations for cylindrical tubes (the most common profile). We will examine each of these issues in turn.


Cooling Electronics Enclosures
The telecommunications industry installs electronic components inside many types of enclosures. They come in sealed and vented forms and use active cooling or passive cooling methods. Until recently, the thermal management performance of basic enclosures was sufficient to meet the industry requirements. But with today’s rising component power and increased board density, the need for upfront thermal management planning is critical in telecom enclosures.


Cooling News
Product, Service and Event Announcement from Around the Industry