The Online Publication and Book Series Dedicated to the Thermal Management of Electronics
Qpedia Thermal eMagazine was launched in 2007 as a monthly newsletter focused on the thermal management of
electronics. Now in its 9th year of publication, Qpedia is a highly respected monthly magazine that is distributed
at no charge to over 18,000 engineers. Written and published by the engineers of Advanced Thermal Solutions, Inc.,
Qpedia is a technical resource to help the engineering community solve the most challenging thermal problems. Each
issue provides practical approaches to thermal management challenges and explains the new technologies for
successfully cooling today and tomorrow’s hot-running electronics.
Table of Contents -
September 2009
September 2009
LED Lighting: A Case Study in Thermal Management
This article examines the thermal management of a light emitting diode (LED)-based lighting system. First, we discuss the environment in which the lighting system will be used. Then, we look at the system’s cooling needs and the various analyses used to confirm that the LED thermal requirements are being met. The article concludes with a comparison of the results.
Thermal Transient Response of Low Power Cabinets
Rooms that contain telephone switching equipment usually have an environmental control system to ensure that all equipment work at their preferred temperature and humidity. This control system typically can cool a telecommunication room that has equipment heat load in the enclosure and thermal load from accessory devices, under the worst conditions. The air conditioning system could fail due to a utility power outage, fan failure or a chiller system malfunction. The failure of a cooling system will increase the temperature of both the equipment and the temperature, which will lead to system failure and service interruption.
Single-and Two-Phase Flow Calculations for Small Channels
Increasingly powerful electronic devices are pushing traditional air cooling technology to its performance limit. It is increasingly difficult to design cost-effective air-cooled heat sinks that can dissipate more than 100 W/cm2 heat flux at the device level [1]. Liquid cooled heat sinks have emerged as the natural substitute for air cooled heat sinks because of their better performance and smaller size.
CFD Analysis of a Heat Sink Filled with Phase Change Material
Phase change materials are a low cost solution to many application such as discrete or array of components having temporal peak powers. Instead of designing an expensive cooling system, phase change materials can be used for absorbing heat during short mission applications e.g. a missile and within systems which operate in harsh environments.
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