Managing the Heat in the Next Generation of ATCA Chassis
ATCA / PICMG chassis designs dominate the industry as the platform for designing new systems. Standardizing around a particular chassis design offers economies of scale in both product availability and deployment in the field. However, as the physical design of a chassis becomes standardized, the power dissipation occurring inside is far from standardized.
A Heat Transfer Study of Forced Channel Flow
The scenario of forced convection through a channel is encountered in many electronics systems. In a familiar example, air is forced through a chassis past a matrix of stacked circuit boards. The fluid, typically air, begins its path through what is called an entry region, where the boundary layers begin to form between a solid wall and an otherwise inviscid flow.
How Wicks and Orientation Affect Heat Pipe Performance
A heat pipe is a device with very high thermal conductance that can transport large quantities of heat with small temperature difference between its hot and cold ends. It is normally used to transport heat from one area to another or to smooth the temperature distribution on a solid surface. Heat pipes are widely used in aerospace applications, military devices, temperature control systems, and now in personal computers.
Factorial Design in Electronics Cooling
Factorial design is a statistical tool that researchers use to investigate the effects of two or more independent variables on a single dependent variable. This article explains the theory of factorial design by using it to investigate the effects of a heat sink’s design parameters on its thermal performance.
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