Thermal Challenges for Future Datacenter Architecture
Facilities for housing high-performance computing, networking and large data storage systems present unique design challenges. They typically require energy-efficiency, flexibility, scalability, maintainability and cost-effective operations. The experts in the field consider four evolutionary forces that dictate the structure and operation of data centers (DC).
The Use of Phase Change Materials for Thermal Management
Phase change materials (PCMs) are substances that can melt and solidify at desired temperatures. They store and release large amounts of energy when they change phase. When the temperature of a PCM is below its melting point, it acts like other solid materials: i.e., its temperature rises as it absorbs heat. When it reaches its melting point, part of the PCM begins to melt and absorb large amounts of heat.
Advanced Packaging Materials for Electronic Components
When exploring the use of liquid cooling for thermal management, calculations are needed to predict its performance. This article presents basic equations for liquid cooling and provides numerical examples on how to calculate the loads in a typical liquid cooling system.
The Peformance Difference Between Fans and Blowers and Their Implementation
Machines which deliver liquids are simply called pumps, but if gases are involved, like air, three different terms are in use, depending upon the pressure rise achieved [1]. If the pressure rise is very small (a few inches of water), a gas pump is called a fan; up to 1 atm, it is usually called a blower; and above 1 atm it is commonly termed a compressor [1]. 25 mm of water, at 4ºC, is around 249 Pa.