Tag Archives: publication

Digital News Gets Support from ATS

With Thermal Engineer day approaching (7/24) we here at ATS would like to thank all of the PR firms and digital news magazines who covered our new clipKIT campaign.

thermal technology - digital news - electronics businessAs a token of our appreciation, we have provided a link to our customers and viewers to download our clipKIT data sheet for all your attachment needs. HERE.

 

The Monthly Qpedia is Out!

Qpedia_Aug13_coverThe monthly issue of Qpedia has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues.

This month’s featured articles include:

Application of TECs to Thermal Management of 3D ICs

From the thermal perspective, 3D stacked chips pose different challenges than what has been experienced in 2D packaging. For example, the heat dissipation of 3D ICs is highly non-uniform and multidirectional, due to the intrinsic chip architecture and the available real estate. When cooling at sub-ambient temperatures is necessary, the small footprint of a 3D chip becomes an impediment to deploying a cooling solution. Additionally, precision temperature control becomes difficult, since the surface to be controlled may be buried deep in the 3D stack. In response to cooling concerns about 3D ICs, this article presents a review of methods available for cooling 3D ICs to sub ambient temperatures using TECs.

Challenges in Testing Thermal Interface Materials

When choosing a thermal interface material (TIM), most of the time we look at the datasheet and find the thermal impedance if it is a solid material or the thermal conductivity if it is grease. Then, we calculate the thermal resistance and temperature rise with those numbers. But, how do we know that a TIM is performing as advertised? Can we really tell if one TIM will perform better than another, based on their specs? Additionally, the material presented in this article suggests that the data printed in TIM datasheets should be evaluated carefully to ensure that the testing procedures are similar to the actual application. Furthermore, even with the existing standards, many variables still exist.

Industry Developments: Portable Cooling Systems

Buildings and rooms constructed to house data centers are getting larger, more congested and warmer. Many of these structures have sophisticated thermal management systems featuring high-powered coolers or harnessing cold local water or air. For some needs, however, a portable cooling system can provide a much simpler and less costly solution. These systems can deliver direct cooling relief to equipment hot spots, and some can lower a room’s temperature when a central cooling system is inadequate or nonexistent.

Technology Review: Enhancing Heat Transfer on Surfaces

In this issue our spotlight is on enhancing heat transfer on surfaces. There is much discussion about its deployment in the electronics industry, and these patents show some of the salient features that are the focus of different inventors.

Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.

Download the issue now and see why over 18,000 engineer’s subscribe to Qpedia. Click here to subscribe Subscribe to ATS

Don’t forget the Qpedia Book Series Promotion that coolingZONE is currently running! Save 25% off the hardcover books that are a must have in every engineer’s library!

The New Qpedia Thermal eMagazine is Out

Qpedia Thermal eMagazine, Volume 7, Issue 4, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues.

Featured articles in this issue include:

Dropwise Condensation in Vapor Chambers
Considerable attention has been devoted in the past to the evaporation process taking place in a vapor chamber. However, increased heat fluxes at the condensation end have prompted efforts to improve the condensation performance of the vapor chambers. This article presents a review of a novel method for improving the thermal performance of a vapor chamber condensing section by using special surfaces promoting dropwise condensation.

 

Heat Sink Manufacturing Using Metal Injection Molding

Using Metal Injection Molding It is only in the last few years that metal injection molding (MIM) has gained a foothold in the thermal community and its salient advantages have become more evident. The MIM process allows intricate features to be added into the heat sink design to boost thermal performance and its production process is very scalable compared with machining. Injection molding enables complex parts to be formed as easily as simple geometries, thereby allowing increased design freedom.  This article explore the merits of copper material in the MIM process.

 

Industry Developments: Thermoelectric Modules and Coolers

Thermoelectric modules (TEMs) are rugged, reliable and quiet devices that serve as heat pumps. The real heat-moving components inside TEMs are thermoelectric coolers or TECs. These are solid-state heat pumps and are designed for applications where temperature stabilization, temperature cycling, or cooling below ambient, are required. Today, TEMs are used in electro-optics applications, such as the cooling and stabilizing of laser diodes, IR detectors, cameras (charge coupled device), microprocessors, blood analyzers and optical switches. This article explores some of the latest developments in these devices.

 

Technology Review: Reducing Thermal Spreading Resistance in Heat Sinks

In this issue our spotlight is on reducing spreading resistance in heat sinks. There is much discussion about how this phenomenon can be achieved, and these patents show some of the salient features that are the focus of different inventors.

 

Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.

 

Download the issue now.

 

Not a Qpedia subscriber? Subscribe Now for free at: http://www.qats.com/Qpedia-Thermal-eMagazine/Subscribe-to-Qpedia and see why over 18,000 engineers read Qpedia.

New Qpedia Thermal eMagazine Published!

Qpedia Thermal eMagazine, Volume 6, Issue 11, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues. Featured articles in this month’s issue include:

Honeycomb Heat Sinks for LEDs

LEDs, or light-emitting diodes, are a form of solid-state lighting. An LED light is often made of a small piece of semiconductor, an integrated optical lens used to shape its radiation pattern, and a heat sink, used to dissipate heat and maintain the semiconductor at low operating temperature. LED lights present many advantages over incandescent light sources, including lower energy consumption, longer lifetime, improved physical robustness, smaller size and faster switching. This article examines Ma et al’s  findings with respect to the honeycomb heat sink design employed in LEDs, which has proven to be highly efficient.

Characteristics of Thermosyphons in Thermal Management

With the increase of heat fluxes and shrinking chip sizes in electronics applications, there is a need to spread the heat from the small chip to the larger heat sink or to transport the heat to a location where there is ample space to remove the heat. Heat pipes, vapor chambers and thermosyphons have been introduced to undertake this task and, in this article, we focus on some aspects of the design of thermosyphons. The advantage of thermosyphons is that they have no capillary limit and can transport large amounts of heat over long distances.

Industry Developments: Heat Pipes Providing High Performance

Heat pipes are increasing in type and use for the benefits they provide. Because of their lower total thermal resistance, heat pipes transfer heat more efficiently and evenly than solid aluminum or copper. Heat pipes contain a small quantity of working fluid (e.g. water, acetone, nitrogen, methanol, ammonia). Learn the conclusions of a recent study that focused on the best working fluid and another study of heat pipes in outer space.

Technology Review: Cold Plates, 2010 to 2012

Qpedia continues its review of technologies developed for electronics cooling applications. We are presenting selected patents that were awarded to developers around the world to address cooling challenges. After reading the series, you will be more aware of both the historic developments and the latest breakthroughs in both product design and applications.

Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.

Download the issue now.

Not a Qpedia subscriber? Subscribe Now for free at: http://www.qats.com/Qpedia-Thermal-eMagazine/Subscribe-to-Qpedia and see why over 18,000 engineers read Qpedia.

The Perfect Holiday Gift for Any Engineer

Holiday Sale: 25% Off Qpedia Books

The holidays are a time for giving, but ATS provides the engineering community with educational services year round, offering short courses, tutorial programs and free monthly webinars. In addition, ATS publishes Qpedia Thermal eMagazine, the only monthly publication dedicated to the field of thermal management. Over 18,000 engineers subscribe to the magazine, looking to advance their professional careers, academic studies, or understanding of electronics cooling. Qpedia and coolingZONE are running a holiday sale, discounting Qpedia Books by 25%. The Qpedia Book Series is a must have for every engineer, providing detailed and technical explanations for real life challenges that arise in the professional environment of engineers. The promotion is only until December 31st, so don’t miss your chance to order these invaluable books at a discounted price.

Order Now!