Tag Archives: journal

The New Qpedia Thermal eMagazine is Out

Qpedia Thermal eMagazine, Volume 7, Issue 4, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues.

Featured articles in this issue include:

Dropwise Condensation in Vapor Chambers
Considerable attention has been devoted in the past to the evaporation process taking place in a vapor chamber. However, increased heat fluxes at the condensation end have prompted efforts to improve the condensation performance of the vapor chambers. This article presents a review of a novel method for improving the thermal performance of a vapor chamber condensing section by using special surfaces promoting dropwise condensation.


Heat Sink Manufacturing Using Metal Injection Molding

Using Metal Injection Molding It is only in the last few years that metal injection molding (MIM) has gained a foothold in the thermal community and its salient advantages have become more evident. The MIM process allows intricate features to be added into the heat sink design to boost thermal performance and its production process is very scalable compared with machining. Injection molding enables complex parts to be formed as easily as simple geometries, thereby allowing increased design freedom.  This article explore the merits of copper material in the MIM process.


Industry Developments: Thermoelectric Modules and Coolers

Thermoelectric modules (TEMs) are rugged, reliable and quiet devices that serve as heat pumps. The real heat-moving components inside TEMs are thermoelectric coolers or TECs. These are solid-state heat pumps and are designed for applications where temperature stabilization, temperature cycling, or cooling below ambient, are required. Today, TEMs are used in electro-optics applications, such as the cooling and stabilizing of laser diodes, IR detectors, cameras (charge coupled device), microprocessors, blood analyzers and optical switches. This article explores some of the latest developments in these devices.


Technology Review: Reducing Thermal Spreading Resistance in Heat Sinks

In this issue our spotlight is on reducing spreading resistance in heat sinks. There is much discussion about how this phenomenon can be achieved, and these patents show some of the salient features that are the focus of different inventors.


Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.


Download the issue now.


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The Perfect Holiday Gift for Any Engineer

Holiday Sale: 25% Off Qpedia Books

The holidays are a time for giving, but ATS provides the engineering community with educational services year round, offering short courses, tutorial programs and free monthly webinars. In addition, ATS publishes Qpedia Thermal eMagazine, the only monthly publication dedicated to the field of thermal management. Over 18,000 engineers subscribe to the magazine, looking to advance their professional careers, academic studies, or understanding of electronics cooling. Qpedia and coolingZONE are running a holiday sale, discounting Qpedia Books by 25%. The Qpedia Book Series is a must have for every engineer, providing detailed and technical explanations for real life challenges that arise in the professional environment of engineers. The promotion is only until December 31st, so don’t miss your chance to order these invaluable books at a discounted price.

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September Qpedia Thermal eMagazine Released

This Month’s Qpedia Thermal eMagazine has been released! This issue includes the following topics:
Direct-Bond-Copper Aluminum Nitride Microchannel Heat Sink for IGBT Modules

The advancement in semiconductor technology has coerced engineers into looking for more innovative and effective methods to cool semiconductor devices with increasing power density. The continuing efforts towards the shrinking of the Metal Oxide Semiconductor Field-Effect Transistor (MOSFET) and the Insulated Gate Bipolar Transistor (IGBT) gate size have made it impossible for standard electronics packages and pure air-cooled devices to handle the heat load dissipated by some high-power devices, such as high end CPUs, power transistors, DSP chips, etc.
TEC Selection in Thermal Management

With the push towards reducing component size, increasing power dissipation and lowering junction temperature, engineers must utilize different and more effective means for achieving their goals. Thermo electric coolers (TECs) are one such means to achieve their ends. TECs have been on the market for decades and their application in component cooling can be attractive, if they are designed properly or chosen correctly. Even though their COP is much lower than a Carnot cycle efficiency, they can solve some problems if the fundamentals of a TEC are well understood by the engineering team.
Industry Developments: Thermally Conductive PCBs

A wide range of printed circuit board materials are available for electronic assemblies requiring heat management characteristics (high-power devices, RF and wireless, lighting/LED boards, etc.). In widening use are metal-clad PCBs with a standard dielectric, and metal cores of various thicknesses of aluminum and copper. Providers of these PCBs offer tight machining tolerances and high-quality fabrication services for effective thermal management.
Technology Review: High Performance Heat Transfer Devices

Qpedia continues its review of technologies developed for electronics cooling applications. We are presenting selected patents that were awarded to developers around the world to address cooling challenges. After reading the series, you will be more aware of both the historic developments and the latest breakthroughs in both product design and applications.
Cooling News from Around the Industry

Find out why over 18,000 engineers subscribe to Qpedia and Download your free copy at qats.com!