Tag Archives: thermal characterization

ATS’ Standard Board Level Heat Sinks for PCB

We’ve just released our new line of standard board level heat sinks. These stamped heat sinks are ideal for PCB application, especially where TO-220 packages are used. Available now through Digi-Key Electronics​ or at this link from ATS http://www.qats.com/eShop.aspx?produc…

 

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Read The Specs but Test The Product: How to Perform Thermal Characterization of Board Mounted Power Supplies

Board mounted power supplies are an important part of  many electronic systems.  There are a number of reasons for that, among them, space savings, lower thermal footprint, and reduction in noise.   With those advantages, specifying the right supply is an important task for the design or component engineer.  And once you do, characterizing the device is important.  The specifications from the manufacturer may be correct in their lab, but, verifying in your lab insures your end product is safe.

Characterizing a device can take many forms based on what the device is, but the overall goal is to insure the device is consistent with the specifications supplied and meets the design point for a given project.  In the case of board mounted power supply, thermally characterization is part of this process.

The team at Ericsson has put together a white paper on the thermal characterization of board mounted power supplies in a sealed box:  one of the more demanding thermal applications.  In the white paper they note:

  • Applications where board mounted power supplies may be most often used in a sealed box
  • A suggested test set up to perform characterization that simulates a sealed box
  • An example test to give engineers an idea of outcomes

The white paper does a good job at explaining these pieces and you can get your copy here: Ericsson Board Mounted Power Supply Thermal Characterization Procedure.

Need a heat sink for your next power brick application?  See ATS’s power brick family of heat sinks is ready for your hottest power supply application

Like what you read here on ATS’s Thermal Engineering Blog?   If you do, subscribe to Qpedia, our industry leading thermal magazine for engineers.

 

 

ATS Expands in the COTS Market with its Wind Tunnel Sale to the US Navy

ATS has continued to expand in the COTS industry because of its expertise in resolving thermal challenges through its consulting services, cooling solutions, and thermal test instruments. Most recently, the CWT-107 open loop wind tunnel was sold to the United States Navy for use in their Research Development Labs.

 

CWT-107

CWT-107 Open Loop Wind Tunnel

The CWT-107 is a research quality wind tunnel designed for multiple PCB and component level testing. It is used in air flow characterization and flow visualization, thermal resistance measurements and generation of P-Q curves. The large test section (24″ x 2″ x 7″) is designed to accommodate multiple PCBs, as seen in a typical ATCA chassis. The wind tunnel can also be used to characterize different heat sink sizes for natural and forced convection cooling. Additionally, multiple heat sinks can be tested side by side to determine their thermal performance in the same environment.

The following video is a brief demonstration and walk through of the CWT-107 Open Loop Wind Tunnel:

To learn more about the CWT-107 and how ATS products can be utilized in COTS applications, please visit www.qats.com.

Want to keep up to date on ATS products, services, free engineering webinars and our monthly Qpeda Thermal eMagazine? Subscribe to ATS

ATS Offers Arrow Customers a Half-Day of Free Access to its Thermal Characterization Lab

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As part of the new distribution agreement between Arrow Electronics and Advanced Thermal Solutions, Inc., ATS is offering a half-day of free, no-obligation use of its unique Thermal Characterization Laboratory to Arrow customers. The Thermal Characterization Lab, located at ATS headquarters in Norwood, MA, allows engineers to perform thermal testing on heat sinks, fans and fan trays, PCBs, blades, enclosures, or complete systems. Experienced engineers, board and system designers can perform the tests themselves, or consult with an ATS thermal engineer at no cost during their 4 hours of laboratory time.

ATS’ Thermal Characterization Lab features a full range of research-quality instruments, including open and closed loop wind tunnels, for ambient and elevated temperature testing, all with PC-driven controls and automated data collection. The lab is also outfitted with a full array of the company’s sensor systems and thermocouples, which can be used to characterize electronic products under variable airflow and temperature conditions.

Liquid Crystal Thermography

In addition, the lab also features a JEDEC approved component thermal testing facility for conducting multitude of device level testing per JEDEC standards. The facility also provides a complete liquid crystal and IR thermography systems for non-invasive temperature mapping to 0.1oC with one micron-level spatial resolution; and a liquid cooling facility for complete testing and characterization of cold-plates, cooling effect and proof of concept testing.

 

“Most of today’s electronics have thermal situations that can turn into big problems if left alone. The easiest, lowest cost way to manage this is to conduct an accurate thermal characterization of the problem at hand,” said Kaveh Azar, Ph.D., President and CEO of Advanced Thermal Solutions, Inc. “If you have the right facility and associated know-how, you can often complete your test in a half-day, then you can readily assess what is the best thermal solution for your application. For engineers short on time and resources, we believe this free use of ATS’ Thermal Characterization Lab could be very helpful.”

Download the Brochure

To contact ATS for more information on this opportunity, please call 781-769-2800, email ats-hq@qats.com or visit www.qats.com.

Flow Visualization in PCB Testing: Part 3

Part 3: Best Wind Tunnels for Flow Visualization

In our final post of the 3 part blog series, we discuss lab equipment that easily allow for optimal flow visualization when testing PCBs.

Our first two posts show the benefits of air and liquid flow visualization in PCB testing. In order to successfully evaluate the thermal performance of a component and PCB, the proper test environment must exist:

A test system that:

  • Accommodates both single components and multiple PCBs
  • Reflects the actual system
  • Can simulate elevated temperature conditions with a controlled flow, if required

 

ATS offers a family of wind tunnels that offer an automated facility for thermal characterization, testing, and optimization of PCBs, components, and heat sinks.

ATS Wind Tunnels

 

All ATS wind tunnels have a large Plexiglas test section for optimal flow visualization. Wind tunnel controllers, such as the WTC-100 and CLWTC-1000 automate testing while accessories such as the HP-97 simulate heat dissipation. Most wind tunnels are easily portable and can be operated vertically or horizontally, maximizing compact lab space.

Rework of PCB layout using flow visualization techniques

Flow visualization is an easy and effective way to understand the flow condition of a component. It allows the PCB layout to be changed at the design stage, reducing the development costs of reworking the board layout after the design has be solidified. It minimizes thermal component costs, increases system reliability, and speeds up a product’s time to market.

To learn more about the wide range of ATS Wind Tunnels, please visit http://www.qats.com/Products/Wind-Tunnels or email ats-hq@qats.com.

Click here for part 1 of this three part series
Click here for part 2 of this three part series