Category Archives: Power

ATS Showcasing Thermal Solutions for Power Electronics at APEC 2018

Advanced Thermal Solutions, Inc. (ATS), a leading-edge thermal engineering and manufacturing company focused on the thermal management of electronics, is pleased to announce that it will be showcasing its new line of liquid cold plates and other thermal solutions for power electronics in Booth No. 1738 at APEC 2018, the world’s premier event for applied power electronics, being held in the Henry B. Gonzalez Convention Center in San Antonio, Texas from March 4-8.

APEC 2018

ATS will have a video demonstration and samples of its newly-released liquid cold plates, which boast an innovative, internal fin array with an optimized aspect ratio that provides 30 percent better performance than other commercially-available cold plates currently on the market.

ATS cold plates are the perfect thermal solution for power electronics, such as IGBT, wide-bandgap, and more.

“Even as power supplies and power ICs increase in efficiency, challenging thermal issues remain,” said Steve Nolan, ATS Vice-President of Sales and Business Development. “There is a demand for more power across the industry and ATS is committed to supporting the electronics industry with the right solutions in the varied component and end-markets on the market today, whether its cooling for IBGT, emerging wide-bandgap, power bricks, CPUs, BGAs or more.”

He added, “APEC provides us the opportunity to share our solutions with these manufacturers, as well as discuss how we can help with any of their future needs.”

ATS cold plates are the perfect solution for cooling high-powered electronics, such as IGBT modules. (Advanced Thermal Solutions, Inc.)

Cold plates are part of an array of liquid cooling solutions that ATS has to offer, including heat exchangers with the industry’s highest density fins to optimize heat transfer and a line of chillers for precise control of coolant temperature.

In addition to its liquid cooling solutions for power electronics, ATS will also showcase its popular Power Brick heat sinks, which are based on the patented maxiFLOW™ design and specially designed for cooling 1/8, 1/4, 1/2, and full-brick DC/DC power converters. ATS has added a straight-fin option to its line of power brick heat sinks to give power engineers an option with a smaller footprint for crowded boards.

ATS has straight-fin heat sinks as part of its Power Brick line to give additional cooling options for power engineers. (Advanced Thermal Solutions, Inc.)

ATS will also display samples of its vast array of high-performance flat and round heat pipes that are perfect for spreading heat away from high-powered components, particularly in boards that have high component-density and little space for other cooling methods.

Visit ATS at Booth No. 1738 at APEC 2018 and join Steve Nolan and Product Engineering Manager Greg Wong to learn more about the numerous thermal solutions that ATS has designed for the power electronics industry.

Find more information about ATS liquid cold plates, Power Brick heat sinks, or ATS consulting and design services, at https://www.qats.com/ or contact ats-hq@qats.com.

Industry Tips for Placing DC/DC Converters on PCB

DC/DC Converters

This article outlines industry tips and suggestions about placing DC/DC power converters on a PCB with other components. (Advanced Thermal Solutions, Inc.)

The design of a printed circuit board (PCB) that includes isolated DC to DC power converters is an important consideration to ensure the optimal performance of a system. Engineers have to be concerned with parasitic impedance and capacitance, the effects of the electromagnetic field created by the power converter on nearby components, as well as voltage accuracy, environmental noise reduction, and limiting radiated electro-magnetic interference (EMI).

This electromagnetic effect can cause significant voltage drops and improper design of a PCB could force engineers to make potentially costly changes (in terms of design time and budget), such as additional circuitry or upgrades to external components like power switches and capacitors.(i)

There are many advantages to using DC/DC converters and engineers adding these power bricks to a PCB do not have to be experts on power supply design, since the Distributed-power Open Systems Alliance (DOSA) has defined the industry standards for footprints and pinouts. Engineers know ahead of time how much space to dedicate and how the converter will be connected to the board.(ii)

“The brick typically comprises all the components (apart from filter circuits) required for a switching power supply including MOSFET switches, energy storage components, and switching controller,” writes Steven Keeping of Electronic Products on DigiKey.com. “By selecting a brick, an engineer does not have to worry about the intricacies of switching power supply design. The supplier has done all the work to ensure the unit operates optimally.”

While much of the work has been done by the manufacturer of the DC/DC converter to ensure its proper function, the engineer designing the system still has to consider the converter’s placement on a board carefully.

Parasitic Resistance, Impedance, and Capacitance

The most prominent issue that DC/DC converters can cause on a PCB is parasitic resistance, capacitance, and impedance. The power module creates an electromagnetic field that could disrupt the performance of components within its boundaries. As noted above, this could cause an unwanted voltage drop for the system and force more external power to be pushed through the converter.

According to a report published by members of the Institute of Electrical and Electronics Engineers (IEEE) from Georgia Tech University, “Short and wide routing traces have lower parasitic resistances and inductances and therefore superimpose less ill-fated effects to the system. As a result, to reduce the parasitic resistance and inductance, the first rule in PCB layout is to place connected power components as close as possible and in a way that their interconnection lengths are minimal.”(iii)

An article on DigiKey.com adds, “The signal traces should not be routed underneath the module, unless they are sandwiched between ground planes, to avoid noise coupling. Similarly, to prevent any coupling, no component should be placed under the module.”(iv)

The IEEE report continued, “Ground planes are effectively close high-speed return paths for average forward signal paths, but arbitrarily increasing the ground plane may not necessarily reach critical nodes. In PCB technologies with more than two layers, middle layers are normally dedicated to ground planes, thereby decreasing their distance to high-current forward switching paths.”

It also recommended using parallel connections for the supply ground, load ground, and measurement instrument’s ground rather than series connectors that are potentially unreliable and that can add impedance between nodes. The report stated, “Undesired noise and high temperature gradients across the PCB usually result when problems with supply ground connections exist.”

DC/DC converters regulate the voltage supply to the system from external power supplies, which makes accuracy a critical component of its performance. In order to ensure the optimal accuracy, it is recommended that the feedback sense terminal is connected as close to the load as possible. It is this voltage that will be converted.

(Advanced Thermal Solutions, Inc.)

Radiated Electromagnetic Interference

Another major concern for placing a DC/DC converter on a PCB is the amount of radiated electromagnetic interference (EMI) is emitted from the module. This is limited by industry standards (CISPR in Europe and FCC in the U.S.) but, as converters work by converting input voltage to AC before converting it back to DC at the correct voltage, there is an electromagnetic field that is produced when the converter is in use.

To minimize the effects of this EMI, “High-frequency nodes should be as short as possible. The metal paths act as antennas and their frequency range is directly proportional to their length. High frequency signal-return paths should be as close as possible to their respective forward paths. The two traces will therefore generate equal but opposite magnetic fields, canceling each other and hence reducing radiated EMI.”(v)

Tim Hegarty, writing for EDN Network, said, “A passive shield layer is established by placing a ground plane as close as possible to the switching loop by using a minimum dielectric thickness. The horizontal current flow on the top layer sets up a vertical flux pattern. The resulting magnetic field induces a current, opposite in direction to the power loop, in the shield layer.

“By Lenz’s Law, the current in the shield layer generates a magnetic field to counteract the original power loop’s magnetic field. The result is an H-field self-cancellation that amounts to lower parasitic inductance, reduced switch-node voltage overshoot, and enhanced suppression of EMI. Having an uninterrupted, continuous shield plane on layer 2 underneath and at closest proximity to the power loop offers the best performance.”(vi)

On DigiKey.com, Steve Taranovich of Electronic Products Magazine wrote, “The input of a DC/DC power module is a constant power at low frequencies. As the voltage decreases, current increases. This will present negative impedance at the input source. The converter will oscillate when the combination of the input filter’s impedance and the power module impedance becomes negative, causing a mismatch to occur. One way to prevent this is to ensure that the output impedance of the filter is much smaller than the input impedance of the power module at all frequencies.”(vii)

Another issue related to electromagnetic field is ground bounce, which is produced by changing magnetic flux due to the fast-changing currents. One of the solutions to prevent this problem, which could cause noise in video and audio devices, is to ensure that “true ground” is at the low end of the load and that all the other points are part of the ground return. In a two-layer PCB, Jeff Barrow of Analog.com also suggests, “A well-planned cut in the ground plane will constrain the return current to a minimum loop area and greatly reduce the bounce. Any residual bounce voltage that is developed in the cut return line is isolated from the general ground plane.”(viii)

Conclusions

Industry standard DC/DC converters have made adding a power supply to a PCB easier for engineers in terms of known sizes and connections. The footprint of a power module is known, but engineers still have important considerations to make before deciding where it should be placed. Keeping in mind the effects of parasitic impedance, capacitance, and resistance and ensuring that the electromagnetic interference will not surpass industry standards or affect other components on the board will ensure optimal performance of the system as a whole.

Using the design tips that are listed here, engineers are well on their way to creating an effective PCB layout with a DC/DC converter. Using Advanced Thermal Solutions, Inc. (ATS) Power Brick heat sinks will ensure the proper thermal management of the converters and of the board.
Learn more about Power Brick heat sinks at https://www.qats.com/eShop.aspx?productGroup=0&subGroup=2&q=Power%20Brick.

For more information about Advanced Thermal Solutions, Inc. thermal management consulting and design services, visit www.qats.com or contact ATS at 781.769.2800 or ats-hq@qats.com.

References

i http://rincon-mora.gatech.edu/research/pcb.pdf
ii http://www.digikey.com/en/articles/techzone/2012/dec/an-introduction-to-board-mounted-dcdc-converter-bricks
iii http://rincon-mora.gatech.edu/research/pcb.pdf
iv http://www.digikey.com/en/articles/techzone/2012/jul/proper-pcb-layout-minimizes-noise-coupling-for-point-of-load-converter-modules
v http://rincon-mora.gatech.edu/research/pcb.pdf
vi http://www.edn.com/design/power-management/4439749/3/DC-DC-converter-PCB-layout–Part-2
vii http://www.digikey.com/en/articles/techzone/2011/dec/conducted-and-radiated-emissions-reduction-techniques-for-power-modules
viii https://pdfs.semanticscholar.org/e3bb/49a1403b2da7d3d77e7024f7be208ee3a732.pdf

Industry Developments: Cooling Electronics in Wind Turbines

By Norman Quesnel, Senior Member of Marketing Staff
Advanced Thermal Solutions, Inc.

(This article will be featured in an upcoming issue of Qpedia Thermal e-Magazine, an online publication dedicated to the thermal management of electronics. To get the current issue or to look through the archives, visit http://www.qats.com/Qpedia-Thermal-eMagazine. To read the preceding post on Cooling Solar Power Inverters, click https://www.qats.com/cms/2016/11/21/industry-developments-cooling-solar-power-inverters.)

Wind power systems capture natural air currents and convert them, first to mechanical energy and then electricity. Windmills have long harnessed natural, renewable wind currents to grind grains and pump water. Now those windmills have evolved into highly engineered wind turbines, with very long, highly-engineered blades spinning on steel towers some that are tens of meters high.

There are some relatively small wind turbines that power individual houses or businesses. They can generate around 100 kW of power. But most of today’s wind turbine industry is for utility-scale power generation. These are large, tall wind turbines, in fields of dozens or hundreds, delivering high levels of electricity to power grid systems that reach thousands of end users. More than a quarter million of such turbines are in use around the world.

Cooling Electronics in Wind Turbines

Fig. 1. The Alta Wind Energy Center in California has more than 600 wind turbines and can produce more than 1.5 GW of power. [1]

Most utility-scale wind turbines are built on open, naturally windy land or off-shore. Each turbine can produce 1.0-1.5 MW, enough energy to power hundreds of homes. The United States has about 75 GW of installed wind power capacity. And, despite some local resistance, the U.S. has begun to join other countries with off-shore installations. China has by far the most installed wind power capacity at about 150 GW. Globally, the combined power capacity from wind turbines is forecast to nearly double between 2016 and 2020 to 792 GW. This would be enough to power 220 million average homes in the U.S. [2, 3]

Mechanics of Wind Turbines

When natural wind blows past a turbine, its blades capture the energy and rotate. This rotation spins a shaft inside the rotor. The shaft is connected to a gearbox that can increase the speed of rotation. The gearbox connects to a generator that produces electricity. Most wind turbines consist of a steel tubular tower. On top of this is a nacelle structure, housing the turbine’s shaft, gearbox, generator and controls.

On the wind-facing end of the nacelle is a hub to which the turbine blades are attached. Together, the blades and the hub are called the rotor. The diameter of the rotor determines how much energy a turbine can generate. The larger the rotor, the more kinetic energy is harnessed. Furthermore, a larger rotor requires a taller tower, which exposes the rotor to faster winds. [4]

A wind turbine is equipped with wind assessment equipment, including weather vanes. These send data to a computer to automatically rotate the turbines into the face of the wind and to a pitch system that can angle the blades to further optimize energy capture. [5]

Cooling Electronics in Wind Turbines

Fig. 2. The major components of a wind turbine. [6]

Turbines and Fire

Hundreds of wind turbines catch fire each year. The most common cause is lightning strikes, but overheated equipment can also be responsible. Highly flammable materials such as hydraulic lubrication oil and plastics are in close proximity to machinery and electrical wires inside the nacelle. A fire can ignite from faulty wiring or overheating. The results are catastrophic. The rush of oxygen from high winds can quickly expand a fire inside a nacelle. Once a fire starts, it is not likely to be deliberately extinguished. Water hoses can’t reach a nacelle’s height and wind turbines like these are typically set in remote locations, far from emergency aid. [7]

Cooling Electronics in Wind Turbines

Fig. 3. A wind turbine’s blazing nacelle and hub at a wind farm in Germany. Lubricating oil is often the fuel when these fires occur. [8]

Electronic Devices in the Nacelle – and Heat

Most wind turbines don’t catch fire, of course. Yet, despite all the surrounding wind, the electronics in their nacelles still need significant thermal management to function continuously. The most important electronics are the generator and power converting devices.

The generator is the heart of a wind turbine. It converts the rotational energy of the wind-spun rotor into electrical energy. It generates the electric power that the wind turbine system feeds into the grid.

Generating electricity always entails the loss of heat, causing the generator’s copper windings to get hot. Larger capacity generators are even further challenged. The thermal losses will increase with the generator in proportion to the cube of its linear dimensions, resulting in a serious decline in generator efficiency.[9]

Excess generator heat must be dissipated to maintain efficiency and avoid damage. On most wind turbines this is accomplished by enclosing the generator in a duct, using a large fan for air cooling. Some manufacturers provide water-cooled generators that can be used in wind turbines. The water-cooled models require a radiator in the nacelle to void the heat from the liquid cooling matrix.

Wind turbines may be designed with either synchronous or asynchronous generators, and with various forms of direct or indirect connection to the power grid. Direct grid connection means that the generator is connected to the (usually 3-phase) alternating current grid.

Wind turbines with indirect grid connections typically use power converters. These can be AC-AC converters (sometimes called AC/DC-AC converters). They change the AC to direct current (DC) with a rectifier and then back to usable AC using an inverter. In this process, the current passes through a series of Insulated Gate Bipolar Transistor switches (IGBTs). These convert direct current into alternating current to supply to the grid by generating an artificial sine wave. The more frequently the switch is turned on and off, the closer to a true sine wave the current flow becomes, and the more sine-like the flow, the purer the power. The resulting AC is matched to the frequency and phase of the grid. [10]

However, the faster these switches actuate, the more heat they develop and given a wind turbine’s variable inputs, IGBTs for this application need to cycle very frequently. This generates large amounts of heat that will dramatically decrease overall efficiency unless properly cooled. [11]

Cooling Electronics in Wind Turbines

Fig. 4. An active air cooling system inside a wind turbine nacelle features an air-to-air heat exchanger for managing heat in the generator (Vensys). [12]

Even with efficiency improvements, a wind turbine’s power generation systems and subsystems must manage ever increasing heat within its limited nacelle space. In addition, even if incurred power losses are as little as 3-5 percent, thermal management systems would have to dissipate 200-300 kW and more of heat.

Air cooling has been used effectively in small-scale wind turbines, but it is not practical for removing the heat produced in MW-scale units. Its thermal capacity is so low that it is difficult to blow enough air across a motor or through the converter to maintain reliable operating temperatures. That is why water cooling is used more often than air for larger wind turbines.

Cooling Electronics in Wind Turbines

Fig. 5. Electronics in a medium voltage (Up to 12 MW) wind turbine converter. Cooling is provided by a closed-loop unit with a mix of deionized water and glycol (ABB).[13]

However, water cooled systems are relatively large, and their thermal efficiency limitations force the size and weight of power generation sub-systems to essentially track their power throughput. Due to the thermal performance limitations of water, the power-generation equipment for a 10 MW wind turbine is nearly twice the size and weight of a 5 MW model. This is largely because water cooling cannot adequately remove additional heat loads without spreading them out.

One supplier of liquid cooling systems for wind turbine electronics is Parker Hannifin. Its Vaporizable Dielectric Fluid (VDF) system provides heat transfer capability significantly greater than that of water. The VDF system requires less fluid and lower pump rates. The same dissipation rates provided by a 6 liter/minute water flow can be achieved by 1 liter/minute VDF flow, thus allowing for a smaller system.

The hermetically sealed VDF assembly is designed to be leak proof, but if a leak occurs the non-conductive fluid will not damage electronic components. The cooling system’s efficiencies and lack of thermal stack-up provide an additional advantage in that the system maintains a fairly tight temperature range. The lack of thermal cycling removes a strain on the turbine’s electronics, which extends their useful life. [14]

Cooling Electronics in Wind Turbines

Figure 6. Dual-phase liquid cooling method for converters has a circulating refrigerant in a closed-loop. Vaporizing coolant removes heat from devices and re-condenses to liquid in a heat exchange (Parker). [15]

Conclusion

Heat issues in wind turbine electronics mainly concern the generator and the power conversion electronics. The heat load of the generator comes from copper wire resistance and from iron loss from the rotation of the core. Further heat loss is mechanical due to friction. These energy losses become heat energy that is distributed into the wind turbine nacelle.

The excess heat from the nacelle-based power conversion systems is mainly due to impedance from electronic components such as capacitors and thyristors. Higher temperatures will reduce the system’s life and increase failure rate. Thermal management methods such as liquid cooling can be effectively adapted for nacelle electronics. [10]

References
1. https://en.wikipedia.org/wiki/Alta_Wind_Energy_Center
2. https://en.wikipedia.org/wiki/Wind_power_by_country
3. http://www.ozy.com/fast-forward/how-twinning-tech-will-power-our-future/71993
4. Layton, Julia, How Wind Power Works, HowStuffWorks.com.
5. http://www.awea.org/Resources/Content.aspx?ItemNumber=900&navItemNumber=587
6. https://www.linkedin.com/pulse/smart-grid-energy-harvesting-martin-ma-mba-med-gdm-scpm-pmp
7. http://www3.imperial.ac.uk/newsandeventspggrp/imperialcollege/newssummary/news_17-7-2014-8-56-10
8. https://www.youtube.com/watch?v=sYoQ6mS2gss
9. http://ele.aut.ac.ir/~wind/en/tour/wtrb/electric.htm
10. Jian, S., Xiaoqian, M., Shuying, C. and Huijing, G., Review of the Cooling Technology for High-power Wind Turbines, 5th Intl Conf on Advanced Design and Manufacturing Engineering, 2015.
11. http://www.windpowerengineering.com/design/mechanical/cooling-electronics-in-a-hot-nacelle/
12. http://www.vensys.de/energy-en/technologie/generatorkuehlung.php
13. https://library.e.abb.com/public/430f5f2493334e4ead2a56817512d78e/PCS6000%20Rev%20B_EN_lowres.pdf
14. http://www.windsystemsmag.com/article/detail/60/cool-system-hot-results
15. http://buyersguide.renewableenergyworld.com/parker-hannifin-renewable-energy-solutions/pressrelease/parker-to-launch-converter-cooling-systems-for-1mw-wind-turbines-at-husum-wind-energy-2012.html

For more information about Advanced Thermal Solutions, Inc., its products, or its thermal management consulting and design services, visit www.qats.com or contact ATS at 781.769.2800 or ats-hq@qats.com.

Read The Specs but Test The Product: How to Perform Thermal Characterization of Board Mounted Power Supplies

Board mounted power supplies are an important part of  many electronic systems.  There are a number of reasons for that, among them, space savings, lower thermal footprint, and reduction in noise.   With those advantages, specifying the right supply is an important task for the design or component engineer.  And once you do, characterizing the device is important.  The specifications from the manufacturer may be correct in their lab, but, verifying in your lab insures your end product is safe.

Characterizing a device can take many forms based on what the device is, but the overall goal is to insure the device is consistent with the specifications supplied and meets the design point for a given project.  In the case of board mounted power supply, thermally characterization is part of this process.

The team at Ericsson has put together a white paper on the thermal characterization of board mounted power supplies in a sealed box:  one of the more demanding thermal applications.  In the white paper they note:

  • Applications where board mounted power supplies may be most often used in a sealed box
  • A suggested test set up to perform characterization that simulates a sealed box
  • An example test to give engineers an idea of outcomes

The white paper does a good job at explaining these pieces and you can get your copy here: Ericsson Board Mounted Power Supply Thermal Characterization Procedure.

Need a heat sink for your next power brick application?  See ATS’s power brick family of heat sinks is ready for your hottest power supply application

Like what you read here on ATS’s Thermal Engineering Blog?   If you do, subscribe to Qpedia, our industry leading thermal magazine for engineers.

 

 

Bill Weihl, Google’s Green Energy Czar, speaks on how to Create Energey Efficient Datacenters

Stacey Higginbotham, of Gigaom, interviewed Bill Weihl, Google’s Green Energy Czar, on how to create energy efficient datacenters.  It’s about a 15 minute interview but it’s very interesting with lots of great points about creating energy efficient datacenters including the thermal management of datacenters.

Click to their interview here:  Google’s Bill Weihl on Data Center Efficiency