ATS maxiFLOW heat sinks provide the highest thermal performance for physical volume occupied compared to other heat sink designs.
maxiFLOW heat sinks are ideal for cooling BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs and LQFP packages. Whenever higher cooling capacity is required, maxiFLOW, provided with thermal tape, can readily be used. The double-sided adhesive thermal tape facilitates the attachment of the heat sink to the device.
For fast, secure clip-on attachment, ATS provides the industry-leading maxiGRIP and superGRIP mounting systems. maxiFLOW heat sinks are available @ digikey
Chillers can be a key component in the liquid loop. They serve the function of conditioning the coolant before it heads back into the cold plate in a liquid loop. The standard refrigeration cycle of recirculating chillers is displayed below in Fig. 1.
The choice of the chiller and the fluid are an important part of the creation of the liquid loop. ATS has some resources to help engineers in this work.
Another helpful resource for engineers is our article, “Cold Plates and Recirculating Chillers for Liquid Cooling Systems“. This article helps engineers understand the use of both cold plates and chillers deployed in the liquid loop. We also include a comparison of ATS and other industry chillers for quick reference for engineers.
But what if your new to how the liquid cooling loop works? Our 2 min. video walks engineers through. The video “What is a Cold Plate and How Does it Work” is a 2 minute video on the ATS YouTube Channel showing how the liquid loop works.
dualFLOW coolers are used in dense systems with high-powered processors, e.g., CPUs, FPGAs and GPUs. They feature a straight fin heat sink base with a high-performance blower that pulls air across the device from two directions for enhanced cooling. ATS dualFLOW coolers provide at least 20% improvement in thermal performance compared to other CPU coolers on the market.
They fit standard Intel™ LGA2011 square or LGA2066 sockets, also known as Socket R. A PCB backing-plate is available for applications other socket types.
dualFLOW models include aluminum or copper fins, and a vapor chamber base to match with needed thermal performance or weight restrictions.
ATS’ high quality, low cost, aluminum stamped heat sinks are ideal for cooling TO-220s and other low power packages (e.g. TO-3s, TO-5s, TO-218s, TO-126s, TO-127s and TO-202s). They feature anodized material with solderable tabs. Stamped heat sinks are attached using clips, nuts or thermal adhesive tape. The simple design and manufacturing of these heat sinks allows high volume manufacturing and reducing assembly costs.