ATS maxiFLOW heat sinks provide the highest thermal performance for physical volume occupied compared to other heat sink designs.
maxiFLOW heat sinks are ideal for cooling BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs and LQFP packages. Whenever higher cooling capacity is required, maxiFLOW, provided with thermal tape, can readily be used. The double-sided adhesive thermal tape facilitates the attachment of the heat sink to the device.
For fast, secure clip-on attachment, ATS provides the industry-leading maxiGRIP and superGRIP mounting systems. maxiFLOW heat sinks are available @ digikey
==> Improve your thermal management with maxiFLOW Heat Sinks by learning about maxiFLOW on our website.