blueICE ultra low-profile heat sinks come in 2 to 7mm heights and are ideal for tight-space, passive cooling applications such as:
– connected appliances
– IIOT (Industrial Internet of Things)
– autonomous farming equipment
Their spread fin design offers thermal resistance as low as 1.23° C/W in air velocity of 600 ft/min.
blueICE heat sinks are very lightweight, ranging from 4 to 30 grams. A double-sided, thermal conductive adhesive tape can be used to attach a blueICE heat sink securely. This no-hardware attachment method reduces weight and assembly time, while saving valuable board space. Available from ATS’s global distribution network.
ATS maxiFLOW heat sinks provide the highest thermal performance for physical volume occupied compared to other heat sink designs.
maxiFLOW heat sinks are ideal for cooling BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs and LQFP packages. Whenever higher cooling capacity is required, maxiFLOW, provided with thermal tape, can readily be used. The double-sided adhesive thermal tape facilitates the attachment of the heat sink to the device.
For fast, secure clip-on attachment, ATS provides the industry-leading maxiGRIP and superGRIP mounting systems. maxiFLOW heat sinks are available @ digikey
Edge computing devices are often installed environmentally severe and/or remote locations where reliable, long-term operation is essential. It is critical to thermally manage the CPUs, FPGAs, GPUs and other processing devices housed inside. Active cooling from ATS fanSINKs provides the cooling airflow continuously needed at the device level.
fanSINKs feature cross-cut, straight fins that maximize fan airflow for more efficient cooling. They are available for component packages from 27mm-84mm. Depending on their size, fanSINKs can be securely clipped onto a device with the ATS maxiGRIP attachment system, or with PEM screws or push pin hardware for direct attachment to the PCB. Smaller fanSINKs attach with maxiGRIP’s high performance plastic frame clip and 300 series stainless steel spring clip. The secure maxiGRIP attachment eliminates the need to drill holes in the PCB. Larger size fanSINKs fit tightly on components and attach firmly to the PCB with standoff and spring hardware.
fanSINKs are pre-assembled with Chomerics T-412 thermal adhesive tape (smaller sizes), or with Chomerics T-766 phase change thermal interface material (larger sizes). These proven interface materials increase heat flow into the sinks to maximize cooling performance. Fans for use with fanSINKs are customer specified and provided.
fanSINKS can be purchased via ATS’s global distribution network, including Mouser and Digi-Key and Sager. Also, Sager provides customer specific value add of fans to meet customer application requirements.
ATS’ high quality, low cost, aluminum stamped heat sinks are ideal for cooling TO-220s and other low power packages (e.g. TO-3s, TO-5s, TO-218s, TO-126s, TO-127s and TO-202s). They feature anodized material with solderable tabs. Stamped heat sinks are attached using clips, nuts or thermal adhesive tape. The simple design and manufacturing of these heat sinks allows high volume manufacturing and reducing assembly costs.