Category Archives: heat sink

Extruded, Skived or Zipper Fin Heat Sinks

Which is Right for Your Design?

Compare extruded, skived, and zipper fin heat sinks to find the best thermal management solution for electronics, telecom, AI, and power applications.

As power densities continue to increase in electronics, thermal management has become a critical design consideration. Selecting the right heat sink technology can significantly impact system performance, reliability, size, and cost.

Let’s look at the differences between these heat sink technologies and provide guidance on where each solution performs best.

Extruded Heat Sinks

Extruded heat sinks are manufactured by forcing heated aluminum through a shaped die, creating a continuous profile that can be cut to desired lengths. This process produces an integral structure where the base and fins are formed from a single piece of material. [1]

Advantages

  • Lowest manufacturing cost for medium-to-high volume production
  • Excellent mechanical strength due to one-piece construction
  • Wide availability and short lead times
  • Lightweight and corrosion-resistant
  • Suitable for many general-purpose cooling applications

Fig 1 – Extruded Aluminum Heat Sinks are Produced in Continuous Profiles to be Cut to Desired Lengths. [2,3]

Limitations

  • Fin height and fin density are limited by extrusion tooling constraints
  • Typically manufactured from aluminum alloys only
  • Lower thermal performance compared to advanced fin technologies
  • Less effective in high-power or space-constrained designs

Best Applications for Extruded Heat Sinks include:

  • Industrial controls
  • Power supplies
  • LED lighting systems
  • Telecommunications equipment
  • Consumer electronics
  • Moderate-power electronics with natural or forced-air cooling

When cost, simplicity, and manufacturability are primary concerns, extruded heat sinks often provide the best overall value.

Skived Fin Heat Sinks

Skived heat sinks are produced by slicing thin layers of material from a solid metal block and bending them upward to form fins. Because the fins remain attached to the base material, the resulting structure maintains excellent thermal conductivity.

Both aluminum and copper can be used, with copper skived heat sinks offering particularly high thermal performance. [4,5]

Advantages

  • Higher fin density than extrusion
  • Taller, thinner fins improve heat transfer
  • No thermal interface between fins and base
  • Excellent thermal conductivity
  • Can be manufactured from copper for demanding applications

Fig 2 –  Skived Heat Sinks are Produced by Slicing Thin Layers from a Solid Metal Block and Bending Them to Form Fins. [6,7]

Limitations

  • Higher manufacturing cost than extrusions
  • More complex fabrication process
  • Practical limits on fin geometry still exist
  • Heavier when copper is used

Applications that Skived heat sinks excel in:

  • High-performance computing
  • CPUs and GPUs
  • Networking equipment
  • Power conversion systems
  • Medical electronics
  • Aerospace and defense electronics

Designers often select skived heat sinks when thermal performance requirements exceed the capabilities of traditional extrusions but a bonded-fin assembly is unnecessary.

Zipper Fin Heat Sinks

Zipper fin heat sinks use individually stamped metal fins that are mechanically interlocked into grooves in a base plate. The fins resemble the teeth of a zipper, giving the technology its name. This manufacturing approach allows extremely high fin densities and flexible fin geometries that are difficult or impossible to achieve through extrusion or skiving. [8]

Advantages

  • Extremely high fin density
  • Excellent airflow utilization
  • Can be integrated with heat pipes
  • Flexible fin shapes and configurations
  • Available in aluminum, copper, or mixed-material designs
  • Ideal for forced-air cooling applications
  • Supports large cooling surface areas in compact footprints

Figure 3 – Zipper Fin Heat Sinks use Individually Stamped Metal Fins Interlocked into a Base Plate, Shown Here with Integral Heat Pipes. [9,10]

Limitations

  • Higher manufacturing complexity
  • More expensive than standard extrusions
  • Thermal resistance at fin-to-base interfaces can be slightly higher than monolithic designs
  • Typically optimized for systems with active airflow

Zipper fin heat sinks are commonly used in:

  • Data center servers
  • AI and HPC systems
  • Telecom infrastructure
  • Base stations
  • Enterprise networking equipment
  • High-power FPGA and ASIC applications

Whenever maximum cooling performance is required in a constrained space with forced airflow available, zipper fin heat sinks are often the preferred solution.

Key Considerations and Performances of Heat Sink Types

The optimal choice depends on thermal requirements, available space, airflow conditions, and budget. [11,12]

Choose an Extruded heat sink when:

  • Cost is a primary concern
  • Thermal loads are moderate
  • Standard profiles meet design requirements
  • Production volumes are high

Choose a Skived heat sink when:

  • Higher thermal performance is needed
  • Increased fin density is beneficial
  • Copper construction is desirable
  • Space is limited but airflow may be moderate

Choose a Zipper Fin heat sink when:

  • Maximum cooling performance is required
  • Forced airflow is available
  • Fin density must be maximized
  • Thermal constraints are severe

Summary

No single heat sink technology can provide every electronic cooling solution. Extruded heat sinks remain the most economical solution for many designs, while skived heat sinks offer improved thermal performance through higher fin densities and superior material options. For the most demanding thermal challenges, zipper fin heat sinks provide exceptional cooling capability and design flexibility.

Ultimately, the ideal heat sink is one that satisfies thermal requirements while meeting mechanical, manufacturing, and economic objectives. By carefully evaluating airflow, thermal load, space constraints, materials, and cost, engineers can select the most effective thermal management solution for their specific application.

References

  1. Eaton, https://www.eaton.com/us/en-us/catalog/thermal-management-solutions/aluminum-extrusion-profiles.html
  2. Rapid Direct, https://www.youtube.com/watch?v=nIcYV1lDs2w
  3. Davantech, https://www.davantech.com/milling-customized-extruded-aluminum-heatsinks-precision-manufacturing-for-efficient-heat-dissipation/
  4. KenFa Tech, https://www.kenfatech.com/skived-vs-extruded-heat-sink/
  5. Kimsen, https://kimsenglobal.com/skived-fin-heat-sink-technical-deep-dive-for-engineers/
  6. Wekiko-Bythermal, https://www.youtube.com/shorts/RzM_fObq4w0
  7. Heatell, https://www.heatell.com/skived-fin-heat-sink/?utm_source=chatgpt.com
  8. Eaton, https://www.eaton.com/us/en-us/products/thermal-management-solutions/materials-finishes/zipper-tech-overview.html
  9. Gito Machine, https://www.youtube.com/shorts/_JJR477bHjQ
  10. Advanced Thermal Solutions, Inc., https://www.qats.com/Heat-Sinks/Zipper-Fin
  11. Boyd, https://info.boydcorp.com/hubfs/Resources/Resource-Center/Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
  12. KingKa Tech, https://www.kingkatech.com/Skived-Vs-Extruded-Heat-Sinks-What-Are-The-Key-Differences-id48217376.html

Cooling Embedded AI Electronics

Embedded AI enables dedicated functions within larger systems. These AI chips power countless devices—robotic arms, smart thermostats, security cameras, medical instruments, drones, and vehicles—enhancing functionality and decision-making at the edge.

ChatGPT is one of the most visited websites in the world. Along with Gemini, Perplexity AI, Grok, and many others, online AI tools are increasingly popular and specialized. This is leading to more power-hungry AI data centers, where hundreds of thousands of GPU chips run at upwards of 1,000 watts each. [1]

But millions of lower power AI chips are running quietly in edge applications all around us.

In smart homes, embedded AI powers thermostats, voice/image recognition, and security. In factories, it drives automated quality control, predictive maintenance, and robotic assembly.

Figure 1 – Embedded AI Systems in Industry Provide Fast, Local Processing to Enhance Production and Safety. [2]

Using local AI inference, these systems make independent decisions, predict outcomes, and automate operations in real time. Connected via the Internet of Things (IoT), they share data and improve interoperability, making homes and factories smarter and more efficient.

AI Technologies in Embedded Systems

  • AI vs. ML: Artificial Intelligence (AI) includes deep learning that uses artificial neural networks to process unstructured data. Machine learning (ML), a subset of AI, focuses on training algorithms to learn from data and adapt over time.
  • Discriminative AI: Embedded systems typically use discriminative AI—optimized for data analysis and evaluation—requiring lower compute power than generative models.

Embedded AI Chips and Cooling Needs

AI processors and modules in embedded applications are not the high-powered versions in data centers. For those, liquid cooling with constant monitoring is essential.

Figure 2 – Intel FPGAs Support Real-Time Deep Learning Inference for Embedded Systems and Data Centers. [4, 5]

Embedded AI processors often come in compact system-on-module (SOM) formats that include CPUs, memory, and specialized chips like GPUs or DSPs. These modules prioritize space efficiency and typically rely on air cooling—either passive or fan-assisted—rather than the liquid cooling found in high-wattage data centers.

Following are some popular AI processors and approved heat sinks.

AMD Kria™ SOMs

The AMD Kria K24 SOM runs on as little as 2.5 watts and typically uses a passive (fan-less) heat sink. Its low power and compact size allow it to be installed close to the processes it manages, such as intelligent motor control. The more capable Kria K26 SOM supports higher-end tasks like machine vision and robotic planning and may require active cooling. [6]

Figure 3 –The AMD Kria K24 and K26 SOMs Can Be Used for Sophisticated Robotic Applications. The K24 Provides Intelligent Motor Control. The K26 Manages Complex Machine Vision. [6]

In the above robotics application, different heat sinks are available to cool the K24 and K26 SOMs. These come in varieties for providing optimum levels of air cooling, as well as for fitting available spaces. The K24 SOM can be cooled with a passive (fan-less) sink. Depending on its application, the K26 SOM may need an active heat sink. Examples of heat sinks for cooling the K26 SOM are below. [7]

Figure 4 – Fan-assisted Heat Sinks, Like the Above ATS Model May be Needed for Cooling AMD Kria K26 System-on-Modules. In Some Applications, Passive (fan-less) Heat Sinks are Sufficient.

Figure 5 – Three Passive Heat Sinks Developed to Cool AMD Kria K24 SOMs. The Taller Finned Versions Provide More Cooling Performance but Need More Headroom and are Heavier. [8]

NVIDIA Jetson Modules

Widely used NVIDIA Jetson modules power a wide range of AI in embedded systems. These compact, powerful modules enable AI solutions in manufacturing, logistics, and healthcare. They leverage NVIDIA’s GPU technology for accelerated AI computations.

In the Jetson module family, Orin systems are specifically engineered to provide high-speed support for a wide range of sensors, enabling seamless integration with various edge AI applications.

One of these, the Jetson AGX Orin series, uses just 15 to 75 watts of power depending on the specific module, workload, and external factors such as local temperatures. They’re designed for passive cooling to manage heat in applications with prolonged operating temperatures, where fans could be affected by dust and debris. [9]

Figure 6 – Top: NVIDIA’s Jetson AGX Orin Module Features an AI Accelerator Graphic Chip and an  Ampere GPU Architecture Chip in One Package. It Can be Passively Cooled with a Specially-Designed, NVIDIA-Approved ATS Heat Sink. [9,10]

Bottom: The Many Uses of Orin Modules Include Embedding in Zipline Delivery Drones [11]

The Orin, another Jetson module, is a small, powerful computer for embedded AI applications connected to the IoT. Its capabilities include deep learning, computer vision, graphics, and multimedia.

Figure 7 – Top: An NVIDIA Jetson Orin Nano Module and a Specially-Designed ATS Active Heat Sink. [12, 10] Bottom: Multiple Security Cameras and Sensors Feed Visual Data to an Orin Nano Module Whose AI Detects Unusual Activities. [13]

One application for Orin Nano modules is in security surveillance systems. Cameras and sensors are placed in strategic locations. The Orin Nano module processes their visual data, detecting unusual activities and triggering alerts when identified by the AI.

When Air Cooling Isn’t Enough

One exception to air cooling for embedded processors is in some smart phones. Tasked to perform ever more functions, including AI, their increasingly powerful chips require higher performance cooling.

For example, Qualcomm Snapdragon 8-series chips, used in phones like the OnePlus 13, generate significant heat under heavy loads. Vapor chambers help dissipate that heat across a broader surface for effective cooling without active fans.

Figure 8 – Top: The Top-Rated OnePlus 13 Phone Features a Qualcomm Snapdragon 8 Elite Chip. Botton: A Teardown Video Reveals the Vapor Chamber for Cooling the Snapdragon Chip. [14,15]

Embedded AI Efficiency

Embedded AI continues to gain ground due to its compact design, low latency, and localized processing. Its benefits include:

  • Reduced network load by transmitting processed insights rather than raw data
  • Lower system cost vs. cloud-based AI
  • Lower power consumption, enabling simpler and cheaper cooling solutions

With AI now embedded across sectors—from smart homes to drones to industrial robotics—thermal management solutions are evolving alongside to ensure performance and longevity.

References

  1. MIT Technology Review, https://www.technologyreview.com/2025/05/20/1116327/ai-energy-usage-climate-footprint-big-tech/
  2. GIGAIPC, https://www.gigaipc.com/en/solution-detail/Machine-Vision/
  3. Embedded, https://www.embedded.com/ai-efficiency-will-depend-on-model-size/
  4. Intel, https://www.intel.com/content/www/us/en/software/programmable/fpga-ai-suite/overview.html
  5. Mirabilis Design, https://www.mirabilisdesign.com/intel-fpga-neural-processor-ai/
  6. Electronic Design, https://www.electronicdesign.com/technologies/industrial/boards/video/21273991/a-look-inside-amds-kria-k24-system-on-module
  7. AMD, https://www.technologyreview.com/2025/05/20/1116327/ai-energy-usage-climate-footprint-big-tech/
  8. Advanced Thermal Solutions, Inc., https://www.qats.com/Heat-Sinks/Device-Specific-AMD-Kria-K26
  9. NVIDIA, https://www.nvidia.com/en-us/autonomous-machines/embedded-systems/jetson-orin/
  10. Advanced Thermal Solutions, Inc., https://www.qats.com/Heat-Sinks/Device-Specific-NVIDIA
  11. Things Embedded, https://things-embedded.com/us/nvidia-jetson/orin/agx/
  12. NVIDIA, https://www.nvidia.com/en-us/autonomous-machines/embedded-systems/jetson-nano/product-development/
  13. Prox PC, https://www.proxpc.com/blogs/case-studies-real-world-applications-of-nvidia-jetson-orin-nano
  14. Tom’s Guide, https://www.tomsguide.com/phones/oneplus-phones/oneplus-13-is-official-and-one-of-the-first-snapdragon-8-elite-powered-phones
  15.  PBKreviews, https://www.youtube.com/watch?v=WqJq3-ngL2Q

2mm High Heat Sinks Perfect for Cooling Tight-Spaced, Passive Cooling Applications

blueICE ultra low-profile heat sinks come in 2 to 7mm heights and are ideal for tight-space, passive cooling applications such as:

– connected appliances

– IIOT (Industrial Internet of Things)

– autonomous farming equipment

– drones.

blueICE™ heat sinks are very lightweight, ranging from 4 to 30 grams. No mechanical hardware is needed to mount them to components. A double-sided, thermal conductive adhesive tape can be used to attach a blueICE heat sink securely.

Their spread fin design offers thermal resistance as low as 1.23° C/W in air velocity of 600 ft/min.

blueICE heat sinks are very lightweight, ranging from 4 to 30 grams. A double-sided, thermal conductive adhesive tape can be used to attach a blueICE heat sink securely. This no-hardware attachment method reduces weight and assembly time, while saving valuable board space. Available from ATS’s global distribution network. 

==> Cool your tight spaced projects! Blue Ice heat sink web page

==> Is BlueIce the right HS for your application? email our engineers and we’ll help you design a solution: ATS Engineering Team

Improving your thermal management might be as simple as adding a different heat sink

ATS maxiFLOW heat sinks provide the highest thermal performance for physical volume occupied compared to other heat sink designs.

maxiFLOW heat sinks are ideal for cooling BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs and LQFP packages. Whenever higher cooling capacity is required, maxiFLOW, provided with thermal tape, can readily be used. The double-sided adhesive thermal tape facilitates the attachment of the heat sink to the device.

ATS maxiFLOW heat sinks provide the highest thermal performance for physical volume occupied compared to other heat sink designs.  maxiFLOW heat sinks are ideal for cooling BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs and LQFP packages.

For fast, secure clip-on attachment, ATS provides the industry-leading maxiGRIP and superGRIP mounting systems. maxiFLOW heat sinks are available @ digikey

See how superGRIP is the fastest clip for adding a heat sink to a hot component in prototype or manufacturing
Click the image to see our video on our Youtube Channel to see how superGRIP is the fastest clip for adding a heat sink to a hot component in prototype or manufacturing

==> Improve your thermal management with maxiFLOW Heat Sinks by learning about maxiFLOW on our website.

==> Available through our global distribution network:

Edge Computing Applications Use Device Level Cooling to Ensure Performance and Reliability

Edge computing devices are often installed environmentally severe and/or remote locations where reliable, long-term operation is essential. It is critical to thermally manage the CPUs, FPGAs, GPUs and other processing devices housed inside. Active cooling from ATS fanSINKs provides the cooling airflow continuously needed at the device level.

fanSINKs feature cross-cut, straight fins that maximize fan airflow for more efficient cooling. They are available for component packages from 27mm-84mm. Depending on their size, fanSINKs can be securely clipped onto a device with the ATS maxiGRIP attachment system, or with PEM screws or push pin hardware for direct attachment to the PCB. Smaller fanSINKs attach with maxiGRIP’s high performance plastic frame clip and 300 series stainless steel spring clip. The secure maxiGRIP attachment eliminates the need to drill holes in the PCB. Larger size fanSINKs fit tightly on components and attach firmly to the PCB with standoff and spring hardware.

fanSINKs are pre-assembled with Chomerics T-412 thermal adhesive tape (smaller sizes), or with Chomerics T-766 phase change thermal interface material (larger sizes). These proven interface materials increase heat flow into the sinks to maximize cooling performance. Fans for use with fanSINKs are customer specified and provided.

fanSINKS can be purchased via ATS’s global distribution network, including Mouser and Digi-Key and Sager. Also, Sager provides customer specific value add of fans to meet customer application requirements.

==> Learn about our Edge Computing and Appliance fanSINKS at ATS’s website