ATS Heat Sinks Offer Cooling for NVIDIA Jetson Modules for Embedded, Edge AI, and Robotics Applications

Advanced Thermal Solutions, Inc. (ATS) has introduced a family of heat sinks developed specifically for cooling NVIDIA® Jetson™ modules, widely used in robotics, embedded, and edge AI applications.

Each straight-fin, black anodized, aluminum heat sink comes with mounting screws or with a steel leaf spring and screws for secure through-hole mounting onto a PCB. Hole pattern guides are included. A high-performance thermal interface material (TIM) is pre-assembled on the attachment side of the heat sink.

The new heat sinks include passive (fanless) and active (fan-ready) options. Active heat sinks ship with hardware for attaching customer-selected fans to match performance needs. ATS includes a list of recommended fan suppliers.

Thermal resistance of these heat sinks is as low as 0.21°C/W and varies by size and active or passive configuration.

NVIDIA Jetson is a leading AI-at-the-edge computing platform with over a million developers. With pretrained AI models, software development kits and support for cloud-native technologies across the full Jetson lineup, manufacturers of intelligent machines and AI developers can build and deploy high-quality, software-defined features on embedded and edge devices targeting generative AI, robotics, AIoT, smart cities, healthcare, agriculture and farming, industrial applications, and more.

The new ATS heat sinks are designed to safeguard component life and performance of the full NVIDIA Jetson lineup of modules, from the high-performance NVIDIA Jetson AGX Orin™ to the compact yet powerful Jetson Nano™ series. ATS heat sinks for NVIDIA Jetson modules are available through Arrow Electronics and other authorized ATS distributors.

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