fanSINK Deployment in a System: How System Flow Affects Fan Sink Performance
fanSINKS are commonly used in electronics systems to deliver direct air to devices that need additional cooling. But engineers applying fanSINKS in systems need to consider the existing airflow in the system from other fans. This white paper discusses an experimental investigation for a fanSINK deployed in a system and recommendations for engineers on proper deployment.
How to Select a Peltier Cooler for Cooling or Heating Electronics
Peltier Coolers, or Thermoelectric Coolers (TECs) can be used to heat or cool components and/or systems with low power dissipation. This ability, along with their high reliability, make TECs a strong choice for providing precise thermal control over a heat-generating device. This white paper from ATS’s Qpedia Thermal eMagazine gives a proven method to properly select them.
Liquid Cooling Systems and their Components: An Introduction
A four page introduction to liquid cooling systems for electronics. This white paper considers passive vs. active liquid cooling, the components used in each and examples.
Clips, Screws or Glue? Heat Sink Attachment Technical Brief
Heat Sinks need to be attached somehow to the heat source. There are alot of options, but where do you get clear objective information on which to use? Well look no further than at ATS! Our engineering white paper from our Qpedia eMagazine does an excellent job of explaining the options and the science behind them.
Measuring Thermal Resistance of Minichannel Cold Plates
This white paper explains how microchannel cold plates improve liquid cooling performance as electronic power dissipation continues to rise. It focuses on the role of solid conduction and fluid convection in determining thermal resistance, with emphasis on laminar single-phase flow inside microchannels.
How to Analyze Heat Transfer of Compact Heat Exchangers
This article concentrates on compact heat exchangers and how to use standard curves for heat transfer analysis.
An ATS “How To” On Implementing Liquid Cooling
This article presents basic equations for liquid cooling and provides numerical examples on how to calculate the loads in a typical liquid cooling system.
ATS has their hands on SFP modules
An SFP’s (Small Form-Factor Pluggable Devices) performance and lifespan are dependent upon the ambient temperature of its operating environment and the thermal packaging of the device. This article will review several thermal modeling techniques for Small Form Factor Pluggable Devices.
Heat Pipe Optimization White Paper
- Heat Pipe applications in the thermal management of electronics
- Analytic approach in finding the optimal L-ratio
- Complete breakdown for various heat pipe options
How to Measure Airflow in Complex Systems
The complexity and unpredictability of system air flows present problems when one needs to determine the temperature rise in a channel or a device’s junction temperature.
Because most analysis tools fail to accurately predict such complex flows, direct measurements are often needed. This white paper from Advanced Thermal Solutions, Inc. (ATS) will show you the options.