Category Archives: Liquid Cooling

Green Revolution Cooling Submerges Compute Blades in a Bucket for Liquid Cooling Success

Green Revolution Cooling has released a liquid cooling system that takes a novel approach to liquid cooling: submerging!   While the very thought of submerging a $10,000 compute blade into anything liquid makes our hair stand on end, Green River’s approach appears to easily work.

Here’s how it works, in a nutshell.   From GRC’s own web site:

Since GR Cooling technology requires such a radical change in thinking, a simple process overview is provided for the three components: the rack, the cooling system, and the control system.

After 60 seconds of modification the server is set into the rack and submerged entirely in GreenDEFâ„¢ coolant. The coolant, a far superior cooling medium compared to air, effectively captures 100% of the server heat. With the trapped heat, the coolant then flows outside without heating the air in the server room.

The rack reorients servers and fully submerges them in a non-conductive coolant which captures 1,300x times more heat by volume than air. The superior heat dissipation qualities of the coolant provides more uniform cooling for even the highest density servers.

The cooling system moves the heated GreenDEFâ„¢ coolant to the outside heat exchanger where heat is rejected and the coolant is returned.

The control system carefully controls coolant mineral oil flow and heat exchanger fan speed to ensure the cooling process is always efficient.  Advanced features such as redundant temperature, pressure and coolant level instrumentation, smart monitoring, and intelligent optimization that alerts for failures or any other events allows for “lights out” management.

Overall GR Cooling provides a cost effective method to achieve the most efficient data centers in production.

You can read a quick PowerPoint Presentation from GRC that provides a simple, laymans explanation of their approach:  Green Revolution Cooling: How it Works in Non-Technical Terms.

Selecting and Implementing Liquid Cooling within Electronic Systems – ATS On-Demand Webinar

As many of our readers know, ATS features Live Broadcast Webinars throughout the year on various topics around thermal management and design. What many of you may not know is that we archive these for on-demand viewing. Topics include heat sinks, thermal interface materials, and liquid cooling.

The use of liquid cooling systems is becoming more practical and effective for managing skyrocketing increases in power dissipation. But how do you decide when you need to cool with liquid? How do you find the right liquid cooling system for your application? Our on-demand webinar provides the best practices for implementing a liquid cooling system at the device level. You may reach it by clicking to it at this link: Selecting and Implementing Liquid Cooling within Electronic Systems

Cabinet Cooling Using a Water and Refrigeration System: A Case Study by ATS Thermal Labs

Escalating computing capabilities and shrinking chip packages are leading to corresponding increases in server and rack power densities. Cooling the new higher-powered racks is a serious challenge to system designers and data center managers. In the past, designers tried such methods as cabinets with better airflow configurations, adding central air conditioning systems, raising floors and using cold-aisle and hot-aisle layouts. Today, engineers are turning their attention to water-cooled techniques and refrigeration technology to solve cabinet overheating problems. ATS’s white paper on this topic is free and covers the material in depth, please click to this link to get it: “Case Study: Cabinet Cooling Using a Water and Refrigeration System“

Understanding how fluid boils in tiny “microchannels” gives engineers another tool to cool high-power electronics

Yesterday we let everyone know about “Understanding Boiling Heat Transfer: a “how to” article from ATS Thermal Labs“.  Hopefully you had a chance to look at our “how to” article as a basic understanding of this important concept.  And there’s relatively new research in this space that’s worth a look as well.

As reported in Purdue University News,  out at Purdue University’s labs, Indiana’s 21st Century Research and Technology Fund has provided $1.9 million to Purdue and Delphi Corp. in Kokomo, Ind., to help commercialize an advanced cooling system using boiling die-electric liquid in microchannels to cool electronic components in hybrid and electric cars.

Tannaz Harirchian, a doctoral student on the project noted that:

One big question has always been, where is the transition from macroscale boiling to microscale boiling?  How do you define a microchannel versus a macrochannel, and at what point do we need to apply different models to design systems? Now we have an answer.

Here is an abstract of the work being done:

ABSTRACT

Boiling Heat Transfer and Flow Regimes in Microchannels – a Comprehensive Understanding

Suresh V. Garimella and Tannaz Harirchian

Cooling Technologies Research Center
School of Mechanical Engineering and Birck Nanotechnology Center, Purdue University

Although flow boiling in microscale passages has received much attention over the last decade, the implementation of microchannel heat sinks operating in the two-phase regime in practical applications has lagged due to the complexity of boiling phenomena at the microscale. This has led to difficulties in predicting the heat transfer rates that can be achieved as a function of the governing parameters. From extensive experimental work and analysis conducted in recent years in the authors’ group, a clear picture has emerged that promises to enable prediction of flow boiling heat transfer over a wide parameter space. Experiments have been conducted to determine the effects of important geometric parameters such as channel width, depth, and cross-sectional area, operating conditions such as mass flux, heat flux and vapor quality, as well as fluid properties, on flow regimes, pressure drops and heat transfer coefficients in microchannels. High-speed flow visualizations have led to a detailed mapping of flow regimes occurring under different conditions. In addition, quantitative criteria for the transition between macro- and micro-scale boiling behavior have been identified. These recent advances towards a comprehensive understanding of flow boiling in microchannels are summarized here.

There’s more on the boil at Purdue University and the applications for the research are far-reaching beyond cooling just automotive electronics.  Click to “New findings could help hybrid, electric cars keep their cool” so you can have a read of the Purdue University News Article with links to the research.

Closed Loop Liquid Cooling for Electronics – an ATS Thermal Labs “how to” article

The successful operation of high power electronics requires cooling that is a departure from traditional air cooled systems.   In all cases of semiconductors, junction temperature must be maintained at specific levels in order for the semiconductors to operate at the desired frequencies for a given application.

CLLC’s or Closed Loop Liquid Cooling techniques can be excellent methods to approach a problem using liquid cooling without having to move to full scale plumbing in your system.  Check our article out now to understand how to do it:  Closed Loop Liquid Cooling for High Power Electronics.