Category Archives: Thermal Analysis

Some Basic Principles of Wind Tunnel Design

Wind tunnels generate uniform air flows, with low turbulence intensity, for thermal and hydraulic testing. These devices have been around for more than a century, and are used in many industries, including aerospace, automotive, and defense. They also play a key role in electronics thermal management. Wind tunnels are made in different shapes and sizes, from just 30 cm long to large enough to contain a passenger airplane. But the basic idea behind all wind tunnels is universal.

There are two basic kinds of wind tunnels. One is the open type, which draws its air from the ambient and exits it back to the ambient. This kind of wind tunnel provides no temperature controls. The air follows the ambient temperature. The second type of wind tunnel is the closed loop wind tunnel, whose internal air circulates in a loop, separating it from outside ambient air. The temperature in a closed loop wind tunnel can be controlled using a combination of heaters and heat exchangers. Air temperatures can be varied from sub-ambient to over 100oC. Figure 1 shows a schematic of a closed loop wind tunnel.

In general, closed loop wind tunnels are made with the following sections:

1-Test section

2-Settling chamber

3-Contraction area

4-Diffuser

5-ÂBlower assembly

6-Heater/heat exchanger assembly

Figure 1. Schematic of an ATS Closed Loop Wind Tunnel.

A good quality wind tunnel will have a flow uniformity of 0.5-2% and turbulence intensity of 0.5-2%. It should provide temperature uniformity within 0.1-0.5oC at the inlet of the test section [1].

108K different push pin heat sink assembly configurations featuring 3 different pitch heat sink types, 3 different fin geometries, brass and plastic push pins

 

To achieve uniform, high quality flow in the test section, the settling chamber and the contraction area are used to smooth the flow. The role of the settling chamber, which is upstream of the contraction area, is to eliminate swirl and unsteadiness from the flow. The settling chamber includes a special honeycomb and a series of screens. As long as a flows yaw angles are not greater than about 10o, a honeycomb is the most efficient device for removing swirl and lateral velocity variations and to make the flow more parallel to the axial axis [2]. Large yaw angles will cause honeycomb cells to stall, which increases the pressure drop and causes non-uniformity in the flow. For large swirl angles, screen meshes should be placed before the honeycomb. For swirl angles of 40o, a screen with a loss factor of 1.45 will reduce yaw and swirl angles by a factor of 0.7. Several screens are needed upstream of the honeycomb to bring the swirl down to 10o.

Using a honeycomb will also suppress the lateral components of turbulence. Complete turbulence annihilation can be achieved in a length of 5-10 cell diameters [2]. Honeycombs are also known to remove the small scale turbulence caused by the instability of the shear layer in front of them. This instability is proportional to the shear layer thickness, which implies a short honeycomb has a better ratio of suppressed turbulence to that generated.

Screens break up large eddies into smaller ones which decay faster. They lower turbulence drastically when several screens are placed in a row. Screens also make flow more uniform by imposing a static pressure drop which is proportional to velocity squared. A screen with a pressure drop coefficient of 2 removes nearly all variations of longitudinal mean velocity. Low open area screens usually create instabilities. In general, screens should have openings larger than 57%, with wire diameters about 0.14 to 0.19 mm. Sufficient distance is needed between multiple screens to stabilize static pressure from perturbation. This distance is typically a percentage of the settling chamber diameter.

The contraction area is perhaps the most important part of a wind tunnel’s design. Its main purpose is to make the flow more uniform. It also increases the flow at the test section, which allows flow conditioning devices to be at lower flow section with less pressure drop. Batchelor used the rapid distortion theory and estimated the variation in mean velocity and turbulence intensity [3]

A considerable number of shapes have been investigated for contraction, including 2-D, 3-D and axisymmetric shapes with various side profiles.

The shape of the contraction can be found using potential flow analysis. Consider the axisymmetric contraction shown in Figure 2 [4]

Figure 2. Schematic of an Axisymmetric Contraction [4].

The design of a wind tunnel is a lengthy process and, as shown above, it requires extensive knowledge and experience in both theory and construction. A novice might attempt to construct a tunnel, but considering the time spent, it might not be justified economically. Wind tunnel design also depends on economic and space constraints. Larger wind tunnels allow more space to have all the conditioning elements in place. A space-constrained wind tunnel must compromise some features at the cost of reduced flow quality, but can still be acceptable for practical engineering purposes.

References

  1. Azar, K., Thermal Measurements in Electronics Cooling, Electronics Cooling Magazine, May 2003.
  2. Bell, J. and Mehta, R., Design and Calibration of the Mixing Layer and Wind Tunnel, Stanford University, Department of Aeronautics and Astronautics, May 1989.
  3. Batchelor, G., The Theory of Homogeneous Turbulence, Cambridge University Press, 1953.
  4. Edson, D. and Joao, B., Design and Construction of Small Axisymmetric Contractions, Faculdade de Engenharia de Ilha Solteira, Brazil, 1999.

The Importance of Heat Flux Sensors

Heat flux sensors are practical measurement tools which are useful for determining the amount of thermal energy passed through a specific area per unit of time. Measuring heat flux can be useful, for example, in determining the amount of heat passed through a wall or through a human body, or the amount of transferred solar or laser radiant energy to a given area.

Affixing a thin heat flux sensor to the top of a component will yield two separate values which are useful in determining the convection heat transfer coefficient. If the heat flux can be measured from the top of the component to the ambient airstream and if the temperature at the top of the component and of the ambient airstream is measured, then the convection coefficient can be calculated.

Where:

q = Heat flux, or transferred heat per unit area

h = Convection coefficient

TS = Temperature at the surface of the solid/fluid boundary

TA= Ambient airstream temperature

Using a heat flux sensor can be useful for lower powered systems under natural convection scenarios. Under forced convection, the heat lost to convection off the top of a component can often be significantly higher than the heat lost to the board, particularly if the board is densely populated and the temperature of the board reaches close to the temperature of the device. Under natural convection situations, often the balance of heat lost to convection and heat lost through the board becomes more even and it therefore is of even greater interest to the designer to understand the quantity of heat dispersed through convection.

Experiments done at Bell Labs alluded to the effect of board density on the heat transfer coefficient. In these experiments, thin film heat flux sensors are affixed to DIP devices which populate a board. The total heat generation of the board is kept constant, so the removal of components from a densely populated board only increases the heat generation per component. The results of this particular experiment highlight an increase in the ratio of heat lost through convection from the surface of the component as board density increases and individual device power decreases.

 Surface Heat Flow vs. Board Density

Qs/Qt = the ratio of total heat flow through device surface to total heat generation

σ = the ratio of total device surface area to total board area

If a board was to be sparsely populated, a greater percentage of heat can be transferred to the board due to larger thermal gradients; however since the overall surface area of the sum of devices decreases, to some extent the heat transfer coefficient must increase to reflect a balance. As the number of components decreases, the power generation increases per component, and the larger resulting temperature gradients in the region around the component yield more convective flow and thus an increase in the heat transfer coefficient. On the other hand, if the board becomes more densely populated, the proportion of heat transferred through the surface, as compared to through the board increases, and the overall increase in heat transferred through the surface yields increased flow and heat transfer at an individual component surface.

The use of a heat flux gauge is an important tool for the electronics designer. In particular, by using a heat flux gauge, it is possible to experimentally determine the heat transfer coefficient at a certain location on the electronics board where it would have had to be simply predicted or estimated previously. Due to the complexity of many electrical systems as well as the irregular nature of many boards, often analytical or CFD methods are not accurate and the best approach is empirical techniques. The use of the heat flux sensor can give results which would be difficult to calculate using analytical or numerical simulations. However, like most other instruments, it is important to use the sensor correctly and carefully to decrease the errors within a system and increase the reliability.

An Instrument for Measuring Air Velocity, Pressure and Temperature in Electronics Enclosures

For engineer-level thermal management studies, the iQ-200 instrument from Advanced Thermal Solutions, Inc, ATS, can simultaneously measure air velocity, air pressure and the temperature of components and surrounding air at multiple locations inside electronic systems. This enables users to obtain full and accurate profiles of components, heat sinks, PCBs and other electronics hardware to enable more effective thermal management.

Developed by Advanced Thermal Solutions, Inc., ATS, the iQ-200 system simultaneously captures data from up to 12 J-type thermocouples, 16 air/velocity sensors, and four pressure sensors.

The thermocouples provide surface area temperature measurements on heat spreaders, component packages, housing hardware, and elsewhere to track heat flow or detect hot spots. Temperature data is tracked from -40 to 750°C. The sensors (available separately) measure both air temperature and velocity at multiple points allowing a detailed analysis of airflow.

Candlestick Sensor from ATS

Thin, low profile ATS candlestick sensors can be easily positioned throughout a system under test and measure airflow from -10 to +6°C. Air velocity is measured from natural convection up to 6 m/s (1200 ft/min). The iQ-200 can be factory modified to measure airflow to 50 m/s (10,000 ft/min) and air temperature up to 85°C. Four differential transducers capture pressure drop data along circuit cards, assemblies and orifice plates. Standard pressure measurement capabilities range from 0- 1,034 Pa (0 – 0.15 psi).

The ATS iQ-200 system comes preloaded with user-friendly iSTAGE application software which effectively manages incoming data from the various sensor devices, and allows rich graphic presentation on monitors and captured on videos or documents. The iQ-200 connects via USB to any conventional PC for convenient data management, storage and sharing.

More information on the iQ-200 system from ATS can be found on Qats.com (http://www.qats.com/products/Temperature-and-Velocity-Measurement/Instruments/iQ-200/2632.aspx), or by calling 781-769-2800.

Learn How to Cool Consumer Electronics in our February 23rd Webinar

“Thermal Management of Consumer Electronics” is the topic of our next webinar, on Thursday, February 23rd, 2PM EST. The free webinar will cover:

Consumer electronics are now being used in places that were once exclusive to business and military electronics. Products like Apple’s iPhone and iPad are sophisticated technologies with powerful processors housed in small spaces with restricted airflow. As a result, these devices, and others like them, are providing many new benefits, but they also bring higher thermal management needs. Attendees will learn the available cooling options, and important factors such as the importance of spreading resistance in component and system thermal management.

The webinar is going to be chock full of great information cooling consumer electronics. The webinar is free and taught by Dr. Kaveh Azar, one of the worlds foremost authorities on heat transfer. Click here to register: “Thermal Management of Consumer Electronics“

How To Make a Thermocouple Video from ATS

ATS’s Latest Video, “How To Make a Thermocouple” has just been published.  If you’ve ever needed to make a thermocouple in your lab or shop, this is the video for you. Let Greg from our engineering team show you how it’s done.

And for a more robust alternative to a thermocouple, consider ATS Spot Sensor,  you can learn more about our spot sensor at this link or get a quote at this link.