Category Archives: Thermal Research

Free ATS Webinar: How to Properly Measure Temperature within Electronic Systems and Analyze the Results

On Thursday, April 28, 2011 2:00 PM – 3:00 PM EDT, ATS will be holding a free webinar, “How to Properly Measure Temperature within Electronic Systems and Analyze the Results”

Attendees will become familiar with the importance of temperature measurement in electronic systems. They will learn about the essential instruments and the locations within a system where testing should be conducted.  The webinar presenter will also discuss how to analyze the temperature data as part of a complete thermal analysis.

To register, click to our registration site at this link: https://www2.gotomeeting.com/register/952923650

For the Chinese Mandarin presentation of our webinar please register at http://bit.ly/ATS_temp_mesaurement_Mandarin

 

Thermal Analysis embedded in your system: ATS kicks off embedded board Week

Well it’s a festive time here at Advanced Thermal Solutions, Inc. as we kick of Embedded Board Week here at ATS.

As many of our readers know, an embedded board is one that is basically inside another system.  The board is effectively a component within some other firms product. ATS’s embedded boards give OEMs the ability to use ATS’s proven technology for measuring air temperature, air velocity and air pressure in their systems.  Simply embedded one of our boards into your system and presto, you have usable ATS technology in your application.

Today we’ll talk about our lineup of embedded boards and during the week we’ll discuss applications. ATS has three primary embedded board types:

ISD embedded board for OEM ApplicationsISD: The ISD is an analog input,  PCB-based scanner for simultaneous, high speed measurements of air velocity and temperature from two independent sensors.

ATS ISD-232 embedded board ISD-232: The ISD is a digital input, PCB-based scanner for simultaneous, high speed measurements of air velocity and temperature from two independent sensors.

PTB-1000 OEM Embedded Board PTB-1000: The PTB-1000Pressure Transducer Board is a four-channel test board for measuring differential pressure where air flow integrity is critical to proper performance.

We’ll be writing about the many varied applications for these boards this week.  In the meantime, to get more information or to purchase these boards, click to our web page at qats.com, call us at 781-769-2800 or email us at [email protected].

Graphite for thermal management applications moves forward with Kaneka’s high thermal conductive graphite sheet

We’ve written about Graphite before for thermal management and frankly, we aren’t that excited about it’s commercialization. Kaneka Corp of Japan has made some progress in this area though. As reported in CBS’s BNET, Kaneka has “developed a graphite sheet based on the high-temperature sintering technology and polymer design technology using polyimides as raw materials that have the highest thermal conductivity in the world.” That sounds pretty exciting to us.

Panasonic has a product like this, their PGS Graphite Sheet, as does HP Materials, and others. But Kaneka’s sheet looks like a big step forward in the kind of high performance thermal properties that might make the use of graphite a good choice for very demanding applications or very dense or small ones where the use of a graphite sheet as both container and heat sink make sense. Here are some specifications:

  • Surface directional thermal conductivity of 1 200 [W.m.sup.-1].[K.sup.-1] is second only to that of diamond)
  • A thinness of less than 50 [mu]m
  • A relative weight of about 2 [g.cm.sup.-3] which is less than a quarter that of copper

Kaneka’s material, named Graphinity, can be see at here:  Kaneka Graphinity High Thermal Conductive Graphite Sheet

We wrote about the use of graphite in our post on Intel’s use of carbon nanotubes to create heat sinks and in our coverage of an article Tim Haas of Avnet wrote on LED thermal management.

ATS even did a comparison between three geometrically identical heat sinks made of Copper, Aluminum and High-performance Graphite (though not nano-tube) and we did not see any difference. Surprisingly, the only advantage that high-performance Graphite offered was its light-weight, but, thermally and mechanically it was the worst (readers may download a copy of our study at ECNMag.com at this link: Comparing the Impact of Different Heat Sink Materials on Cooling Performance.

Thermal Measurements in Electronics Cooling: Dr. Kaveh Azar, Author

Dr. Kaveh Azar’s book, “Thermal Measurements in Electronics Cooling” is a valuable reference tool to have in your thermal lab. In his book, Dr. Azar covers such topics as:

  • Measuring velocity in electronic systems
  • Heat Flux measurements: theory and practice
  • Wind Tunnel Design
  • Principles of component characterization
  • Measuring pressure in electronic systems

You can read excerpts from “Thermal Measurements in Electronics Cooling” at Google by clicking to Google Books at this link: Thermal Measurements in Electronics Cooling

You can purchase Dr. Azar’s books from Amazon by visiting this link here.

Association for Computing Machinery (ACM) releases paper on temperature balancing for low cost thermal management

The Association of Computing Machinery has released a new research paper entitled, “Proactive temperature balancing for low cost thermal management in MPSoCs”. The point behind the paper is:

Designing thermal management strategies that reduce the impact of hot spots and on-die temperature variations at low performance cost is a very significant challenge for multiprocessor system-on-chips (MPSoCs). In this work, we present a proactive MPSoC thermal management approach, which predicts the future temperature and adjusts the job allocation on the MPSoC to minimize the impact of thermal hot spots and temperature variations without degrading performance. In addition, we implement and compare several reactive and proactive management strategies, and demonstrate that our proactive temperature-aware MPSoC job allocation technique is able to dramatically reduce the adverse effects of temperature at very low performance cost. We show experimental results using a simulator as well as an implementation on an UltraSPARC T1 system.

Our readers can download a copy at the ACM Portal here: “Proactive temperature balancing for low cost thermal management in MPSoCs“