Heat Spreaders: Material and Technology; a “How To Do It” article from ATS thermal labs

Heat spreaders are employed in critical locations for more efficient heat removal.  They can be applied to low power devices, such as memory modules in PC and semiconductors in mobile devices or to directly conduct heat to ambient air or to a chassis.  On high power devices, such as CPUs and IGBT modules, they spread heat to active cooling devices.  Our article will help you understand how to do this best.  Click on over to have a read, “Heat Spreaders: Material and Technology“.