Microprocessor Power and Temperature Mapping, a “How To” Article from ATS Thermal Labs

Power mapping is a method for determing the hot spots on a chipset’s die surface. These are the areas where the power density on the chip is highest. And, those are the specific areas that cause the most complicated heat problems even in lower power processors. But, unless you know where those hot spots are on your semiconductor you really cannot optimize your thermal design for it. Our “how to” article equips you to do such mapping: Microprocessor Power and Temperature Mapping