Thermal Management of High Power Components through Pool Boiling

Boiling and condensation are increasingly employed thermal management methods for high heat flux electronic devices. These heat transfer mechanisms are applied in thermosyphons, heat pipes, vapor chambers and two-phase minichannel and microchannel heat sinks. The fundamental physics behind these devices includes pool boiling, vapor condensation and convection heat transfer. Boiling and condensation processes are affected by device geometry, surface roughness, wall superheat, saturation pressure and fluid properties. Understanding the fundamentals of pool boiling and condensation, and the parameters that affect them, will improve the design of thermal management devices.   To learn more on this topic, ATS has published a white paper that readers can have for free by clicking to qats.com at this link, “Use of Pool Boiling to Thermally Manage High Power Components“