We’ve just released Qpedia Thermal eJournal for May 2011. This is Volume 5, Issue 5 of our monthly thermal management publication. We’ve got a number of good articles in this issue including the “Thermal Simulation and Management of 3D Stacked Chips.
As Tom Tarter noted in an August 2010 Presentation to IMAPS:
3D Packaging provides increased density and performance and is a key element to meeting and exceeding Moore’s law predictions
So while stacked chip designs satisfy the ever increasing performance need, thermal management issues are core to the success of a given multi-chip design. And our article in QPedia on “Thermal Simulation and Management of a 3D Stacked Chip” will equip you to better handle this chip packages thermal challenges
This months QPedia also addresses ATCA and Thermal Management, Miniature Refrigeration and more. To get your free copy, click to, “Qpedia Thermal eJournal“.