Monthly Qpedia Issue Just Released!

Qpedia_oct_coverThe October issue of Qpedia Thermal eMagazine has just been released and can be downloaded at: Hot articles this month include:

Basic Finite Volume Concepts in CFD

Computational Fluid Dynamics (CFD) has become an essential tool in modern engineering analysis and thermal management, leading to faster solutions and an increase in productivity. It is also a very rich field that has benefitted from decades of work to improve its accuracy and speed. In this article, the author offers a high level overview of a special kind of numerical scheme in CFD. The intent is to familiarize readers with the very basics of CFD, so hopefully they can have a better appreciation of what is behind the commercial codes.

Micropumps – For Tomorrow’s Portable Electronics

Electronic devices such as tablets and ultrabooks have become more and more compact while maintaining high computing performance, and this has driven demand for innovative thermal management strategies. Active liquid cooling systems need be considered, even in these portable applications. These systems demand small pumps, often referred to as micropumps, which deliver the necessary pressure and flow with high reliability. This paper explores several common approaches to building micropumps.

Industry Developments: Thermoelectric Peltier Cooling

A Peltier cooler, heater or thermoelectric heat pump is a solid-state device which  transfers heat from one side to the other, with consumption of electrical energy, depending on the direction of the current. It can also be used as a temperature controller that either heats or cools. In this article, the writer provides an overview of thermo-electric cooling construction, component cooling, enclosure cooling and TEC Specs from IEC.

Heat Transfer Devices That Use Liquid As a Coolant, 2007 to 2009

Qpedia continues its review of technologies developed for electronics cooling applications. We are presenting selected patents that were awarded to developers around the world to address cooling challenges. After reading the series, you will be more aware of both the historic developments and the latest breakthroughs in both product design and applications.


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