The increasing speed of expensive processors is forcing less expensive “associated board” or “dependant” devices to keep up. Consequently, thermal management and EMI are becoming issues for traditional lower frequency or power devices, such as ASIC, memory, power resistors, controller chips, LEDs, and other traditionally lower power devices that comprise 70 to 80 per cent of all devices. For many engineers, this is not only an expansive challenge but also a first-time issue with devices that once ran lower speeds and consumed less than 0.25 W but evolved to 0.50-20 W.
So what to do? One way to address this challenge is by way of the right thermal interface material. 3M’s Jeff McCutcheon has a great article on this topic at EP&T. You can have a read at EP&T by clicking to his article, “Higher frequencies leading to rising power and EMI in traditionally low power electronic devices“.
ATS’s did a few articles on this topic our readers will find helpful here on our blog.