Category Archives: Qpedia Thermal eMagazine

The current issue of ATS’s Thermal eMagazine, Qpedia is ready for you to download and read! This months articles include:

1. Piezoelectric Fans and Comparisons to Traditional Axial Fans
2. High-Performance Server Cooling
3. NEBS Standards and Testing Criteria
4. Power Issues in Data Centers

Just click on this link to get your free copy today: Qpedia Thermal eMagazine Current Issue

We’ve just released Qpedia Thermal eJournal for May 2011. This is Volume 5, Issue 5 of our monthly thermal management publication.  We’ve got a number of good articles in this issue including the “Thermal Simulation and Management of 3D Stacked Chips.

As Tom Tarter noted in an August 2010 Presentation to IMAPS:

3D Packaging provides increased density and performance and is a key element to meeting and exceeding Moore’s law predictions

So while stacked chip designs satisfy the ever increasing performance need, thermal management issues are core to the success of a given multi-chip design. And our article in QPedia on “Thermal Simulation and Management of a 3D Stacked Chip” will equip you to better handle this chip packages thermal challenges

This months QPedia also addresses ATCA and Thermal Management, Miniature Refrigeration and more. To get your free copy, click to, “Qpedia Thermal eJournal“.