Category Archives: Thermal Analysis

Can a thermal interface material, by itself, be effective in thermal management without a heat sink?

Our first reaction when we saw the press release from Fujipoly was one of skepticism. Here’s the full release:

Carteret, NJ Monday, November 15, 2010 A new thermal material breakthrough from Fujipoly allows engineers to reduce chip and circuit temperature by as much as 11% without the need for a heatsink.

The advanced 4-ply, peel-n-stick FPDSEM 90 Cooling Patch offers the fastest and easiest way to radiate heat from an electronic component to the surrounding environment. All you need to do is apply the patch like a sticker to the surface of any hot spot. The material can also be custom cut or trimmed to fit virtually any shape.

The low resistance Cooling Patch provides a thermal conductivity of 1.5 W/m°K and a thermal emissivity of 0.97. Fujipolys FPDSEM 90 is 25mm thick and can be ordered in sheets, rolls or kiss-cut rolls depending on your application.

The phrase our team focused on was, “reduce chip and circuit temperature by as much as 11% without the need for a heatsink.

Here’s a .jpg of their new thermal material. The green marker points to the Fujipoly TIM while the blue marker points to the semiconductor (or click on the photo to zoom in on it)

Fujipoly thermal interface material

While the claims are impressive, unless the paste has significant emissivity (highly metalized) our team did not see how it would work. We speculate that Fujipoly may have developed a special material; however, the 10-11% thermal reduction will not work at higher velocity flow , anything more than 1-1.25 m/s  the impact is in 1-2%.

If anyone of our readers gives this material a try before us, drop us a line and let us know what you learned; joday-at-qats.com

OEM cuts project costs, improves MTBF using ATS heat sink solution: An ATS Thermal Labs Case Study

A California based optical networking company asked ATS for thermal management services to manage excess heat in a telecom cabinet.

The OEM’s optical transport board employed 16 heat sinks, two of which were ATS maxiFLOWTM heat sinks. These were attached to hot processors using the ATS maxiGRIPTM clip system. The other heat sinks were all 15mm x 15mm straight fin designs attached to various semiconductors using a thermally conductive epoxy. The thermal epoxy was meant to provide a secure, mechanical bond for mounting the heat sinks to the ICs on their circuit board. But the results were not as expected. The epoxy-attached heat sinks began falling off the PCBs in both field and lab deployments.

The customer’s team considered alternative approaches, including thermal adhesive tape but were unable to find a suitable solution. ATS was brought onto the team to find the problems root cause and provide a suitable solution that met the OEMs technical requirements and cost constraints.

ATS analyzed the customer’s circuit boards, heat sinks, and the thermal epoxy, and completed thermal modeling and analysis of the application. Following this approach, ATS recommended using the originally designed-in heat sinks. The thermal analysis showed their performance was satisfactory, with margin, for this application. ATS recommended a heat sink clip be used instead of thermal epoxy. The ATS superGRIPTM heat sink clip and a phase change thermal interface material were then introduced.

ATS supplied early samples of a standard superGRIP and 15mm x 15mm straight fin heat sink. After physical testing, both thermal teams came to the conclusion that the new solution would improve both the mechanical attachment and thermal performance. However, the standard off the shelf superGRIP was not the right dimensions for a best fit; critical to it’s mechanical attachment and capability to apply the right amount of pressure for phase change material to be effective. That correct amount of pressure is critical to phase change material so it can give the best heat transfer from the semiconductor to the heat sink.

ATS developed a custom superGRIP for the application, and upon further testing found the combination of straight fin heat sink, superGRIP, and phase change interface to meet the design requirements.

The result of this partnering work between ATS and their customer were:

  • Reduced cost of production as epoxy required more training to use and had a shelf life
  • Passing of NEBS shock and vibration testing
  • Increased product MTBF and reliability
  • The OEM was able to ship their product to gain sales

If your team is facing a similar dilemma, contact us at ATS ; Phone: 781-769-2800, email: [email protected] or visit our web site at http://www.qats.com. You can also click to ATS’s You Tube Channel to see a demo of our superGRIP heat sink clip

Thermocouples for Thermal Analysis: what they are and how they work (part 2 of 2)

In part 1, we covered the basics behind what thermocouples are and how they work. In part 2, we’ll cover how thermocouples can be made and know when to select the right thermocouple for your project.

Thermocouples can be made of any two dissimilar metal wires, and their emf voltage depends on the composition of the chosen metals. However, what makes thermocouples so popular is that the materials used to construct them are restricted and their output emf’s have been standardized. Certain materials and combinations are better than the others, and some have basically become the standard for given temperature ranges. Table 1 lists some of the available thermocouples in the U.S. market.

Thermocouple Type Material Composition Temperature Range Uncertainity Color Code
T Cu vs. Constantan -250 to 350°C Greater of 1°C or 0.75% Blue-Red
K Chromel vs. Alumel -200 to 1250°C Greater of 2.2°C or 0.75% Yellow-Red
J Iron vs Constantan 0 to 750°C Greater of 2.2°C or 0.75% White-Red
R Platinum vs. Platinum-13% Rodium 0 to 1450°C Greater of 1.5°C or 0.25% None Established
S Platinum vs. Platinum-10% Rodium 0 to 1450°C Greater of 1.5°C or 0.25% None Established
C Tungsten 5% Rhenium vs. Tungsten 26% Rhenium 0 to 2320°C Greater of 4.5 °C to 425°C, 1% to 2320°C None Established
E Chromel vs. Constantan -200 to 900°C Greater of 1.7°C or 0.5% Purple-Red

Table 1: Different types of thermocouples

Selecting the right type of thermocouple for an application depends on many factors. These include sensitivity, temperature range, corrosion resistance, linearity of output voltage, and cost. For example, types R and S are relatively expensive and are not sensitive. However, they perform well at high temperatures up to 1768°C and are resistant to a number of corrosives. Type C thermocouples are suitable for higher temperature applications, but they are relatively expensive and corrode easily in an oxidizing environment. A Type T thermocouple is inexpensive and very sensitive, but will corrode at temperatures above 400°C. Type K is very popular for general use, relatively inexpensive, reasonably corrosion-resistant, and can be used at high temperatures, up to 1372°C. K-type thermocouples also have provide relatively linear output as compared to the other types [2].

The actual magnitude of the thermocouple emf is very small, and is in the order of few millivolts. At a given temperature, Type E has the highest output emf among common types, but this voltage is still measured in millivolts. The sensitivity of thermocouples is also relatively low. For instance, the voltage change per degree Fahrenheit from 38 to 93°C is only 36 microvolts. As a result, thermocouples require accurate and sensitive measuring devices and cannot be used for temperature changes of less than about 0.1°C. Traditionally, expensive voltage balancing potentiometers were used to measure emf. Today, a high quality digital voltmeter is sufficient [3].

The National Institute of Standards and Technology (NIST) has developed standard calibration curves for determining temperature based on the measured emf voltage. These data represent the output emf of thermocouples when an ice cold junction is used, and are incorporated in the memory of most DAQ systems.  Unfortunately, the temperature-voltage relationship of thermocouples is nonlinear and curve-fitted using polynomial functions. Obviously, the higher the order of the polynomial function, the higher the accuracy of temperature reading. The polynomial function should only be used inside the temperature range of the thermocouple type and should not be extrapolated. To save computational time, a lower order polynomial fit can be used for a smaller temperature range.

Thermocouple wires come in variety of sizes. Usually, the higher the temperature, the heavier should be the wire. As the size increases, however, the time response to temperature change increases. Therefore, some compromise between response and life may be required.

Thermocouples can be connected electrically in series or in parallel. When connected in series, the combination is usually called a thermopile, (whereas there is no particular name for thermocouples connected in parallel). A wiring schematic of a thermopile combination is shown in Figure 3.

Thermocouples example diagram

Figure 3 – Series-connected thermocouples forming a thermopile

The total output from n thermocouples will be equal to sum of the individual emf’s. The main purpose of using a thermopile rather than a single thermocouple is to obtain a more sensitive element. Parallel connection of thermocouples is used for averaging.

 

References:

  1. Omega Temperature Handbook, Omega Engineering, Inc. 2nd edition.
  2. Wheeler, A. and Ganji, A., Introduction to Engineering Experimentation, Prentice Hall Inc., pp. 240-246, 1996.
  3. Beckwith, T., Marangoni, R., and Lienhard, J., Mechanical Measurements, Fifth Edition, Addison Wesley Longman, pp. 676-685, 1993.

Thermocouples for thermal analysis: what they are and how they work (part 1 of 2)

This week here on ATS’s thermal blog, we kick off a two part series on thermocouples. Today, here’s part 1.

With their versatility and easy use, thermocouples are the most common means for doing thermal analysis and performing temperature measurements. Data from such measurements can then be used to develop the right thermal management solution, including heat sinks, for an electronic system.

Thermocouples date back to 1821, when Thomas Seebeck, an Estonian scientist, found that when two dissimilar metals were connected at both ends, and one end was heated, there was a resulting flow of current in this thermoelectric circuit.

Today, this voltage is known as electromotive force (emf), and is a function of the junction temperature and composition of the two metals. The repeatable nature of emf, along with standardized material types and calibration curves has made thermocouples the devices of choice for many temperature measuring applications.

Despite simplicity of thermocouples, their emf voltage cannot be measured directly. As shown in Figure 1, using a voltage measuring device will create two additional thermocouple junctions, designated as J2 and J3 in the thermoelectric circuit.

thermocouples for thermal analysis article, part 1, feature on ats thermal blogFigure 1 Measuring junction voltage with a DMV[1]

The voltage reading then becomes a function of three temperatures, two of which are of no interest to the experimenter. To solve this problem, another junction needs to be created in series in the circuit, as shown in Figure 2.

thermocouples in thermal analysis on ats heat sink blogFigure 2 External Reference Junction [1]

This added junction is kept at a known temperature, 0°C, by submerging it in an ice bath, and is the reference temperature. Most commonly, a mixture of pure water and pure ice at 1 atmospheric pressure is used for the reference junction. Today, electronic measuring devices simulate an ice reference bath without the need for an actual ice bath. This is often referred to as cold junction compensation (CJC).

After adding the ice bath, there are still two junctions at the device terminals, but each of these consists of the same two materials. If held at the same temperature, their emf voltage will be the same and cancel each other out.

In part 2 of our two part series on thermocouples, we’ll cover what thermocouples can be made of and how to select the right thermocouple for your project.

Six questions to ask to guide your engineering investigation to the right heat sink

Here’s a series of questions our engineers walk through when faced with a new thermal management project that requires choosing the right heat sink.

Component or Device Details: This includes asking questions to determine the components power level (generally expressed in watts), maximum temperature (Case or Junction C), package size, package type (BGA, flip chip, etc.), package material, and package configuration (exposed die or heat spreader, etc.)

System Airflow: Is there a fan or blower? Is it ducted or unducted? Is it pushing air onto the area needing thermal management or pulling air over the component needing thermal management? Or is it convection cooled?

Space Constraints: What is the allowable height off the PCB? What is the maximum heat sink height allowed? Is heat sink overhang over the component allowed? If heat sink over hang isn’t allowed, would it be allowed if a heat sink were cut out in place to allow closely positioned heat sinks to not be effected (yet overhang would happen in other places).

System Operating Conditions: What is the known to be maximum ambient temperature outside the system? What is the allowed maximum ambient inside the system? Is there a maximum altitude in which the system may eventually operate? Are there shock and vibration specifications to be considered (such as in MIL, NEBS, or ETST)?

Attachment Method Allowed: What attachment method is allowed for the heat sink? Are there pre-drilled, “industry accepted” holes already so that a push-pin heat sink is allowed or is it preferred that there are no holes in the PCB? Can a clip be used? Is a clip needed for compression of thermal interface material or simply to attach a heat sink loosely? If a clip is okay, how much keep out area around the components is available.

Thermal Interface Material In this section we ask questions to determine the best thermal interface material to use. Choosing and applying the right thermal interface material can reduce case temperature by as much as 50% We’ll want to know if the component has any surface irregularities or all out roughness, and we’ll need to know the surface area of the contact area.

We’ll take answers from all the questions and use them to help us get a complete picture of the thermal requirements for a given project. Stepping through questions such as these can be a logical road map to doing some basic thermal analysis that can lead to the right heat sink for your application.

ATS can also help with this process either by doing the engineering investigation for you or providing a heat sink solution to your findings. You can learn about us and our heat sink offering by clicking out our web site, qats.com.