Category Archives: thermal management

Thermal Coupling in Electronics Cooling (part 1 of 2)

Today we begin a two-part series on Thermal Coupling in Electronics Cooling. In part 1 we’ll cover what thermal coupling is and how the coupling effect works.

Thermal coupling is the interrelationship among the three primary modes of heat transfer: conduction, convection and radiation. Each of these modes is common in electronics cooling and thermal engineers must understand how they can be used together to lower the junction temperature of hot electronic components.

To further explore heat transfer types, a simple virtual test was performed using CFdesign software [1]. A block of material was modeled and subjected to a prescribed heat load. The block was cooled via convection (air flow over the block) and radiation heat transfer. Different block materials were modeled to understand how their inherent thermal conductivity affected overall heat transfer. Each of the test cases was plotted on a graph to show the coupling effects of the various modes of heat transfer.

The test featured a 60 mm x 60 mm block of solid material set in a 250 mm x 25 mm tunnel (or duct). A 10 mm x 10 mm heat source was applied to the blocks base. Figure 2 shows a schematic of the thermal resistance network for this case. The schematic, Figure 1, is a one-dimensional representation of the heat transfer path with the convective, radiative and conductive resistances clearly shown.

Network Model for Solid Block with Heat Source

Figure 1. Network Model for a Solid Block with Heat Source

This model shows that heat must first flow through the solid block via conduction. It can then be dissipated to the wall of the tunnel by radiation or carried away in the fluid (air flow) by convection. In effect, the block is thermally coupled to the tunnel walls and to the air passing through the tunnel.

The total convective resistance in the network is equal to the sum of the convective resistances from the surface of the block to the fluid (Rconvcf), and from the fluid to the walls of the tunnel (Rconvfw). It is defined in Equation 1 below.

Rconv = Rconvcf+ Rconvfw (1)

The total conductive resistance is equal to the sum of the through-plane conduction for the block and the spreading resistance or in-plane conduction through the block. This is defined in Equation 2:

Rcond = Rcond + Rsp (2)

The radiation resistance (Rrad) is defined from the surface of the block to the walls of the tunnel.

In part 2 we’ll explore the coupling effect of radiation, conduction and convection.

Got a question on part 2 already or maybe part 1 from today? Contact us and lets see how ATS thermal engineers can make your next project a success!  Email us at [email protected] , call us at 781-769-2800 or visit our Design Services

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References

1. CFdesign® Software, Blue Ridge Numerics, Inc.

 

Free ATS Webinar: How to Properly Measure Temperature within Electronic Systems and Analyze the Results

On Thursday, April 28, 2011 2:00 PM – 3:00 PM EDT, ATS will be holding a free webinar, “How to Properly Measure Temperature within Electronic Systems and Analyze the Results”

Attendees will become familiar with the importance of temperature measurement in electronic systems. They will learn about the essential instruments and the locations within a system where testing should be conducted.  The webinar presenter will also discuss how to analyze the temperature data as part of a complete thermal analysis.

To register, click to our registration site at this link: https://www2.gotomeeting.com/register/952923650

For the Chinese Mandarin presentation of our webinar please register at http://bit.ly/ATS_temp_mesaurement_Mandarin

 

ATS Releases Our Latest Instrument: The iQ-200 which measures Air Temperature, Velocity, and Pressure with a Single Instrument

We spend a lot of time coming up with new ways to solve thermal management problems for our customers. In fact, our case study list reads like a rogues gallery of thermal problems: from obstructed air flow to over heat sink application, we’ve seen almost everything in the thermal engineering. But what do we use to hunt down the root cause of these problems? Well, in part we  use excellent thermal analysis instruments.

One such new instrument is the iQ-200. This may be among the few, (if not only) thermal management instrument that allows you to simultaneously or individually test air temperature, air velocity, and pressure drop in one instrument.

Key features include:

  • Sixteen hot wire anemometer ports measure velocity using ATS single-sensor technology, requiring no need to change sensors when measuring different velocity ranges.
  • twelve thermocouple ports supporting J, K, T and E types, with a range of -40 to 750C.
  • Pressure is measured by four ports, supporting differential or absolute pressure, with a range of 0-1,035Pa (0-0.15 psi)
  • User-friendly LabVIEWTM- based IQstage data acquisition software is included in the system. IQstage manages incoming data from various sensors and provides a rich graphical presentation of the results. It automates your test process so you can do more valuable work.

This instrument lets you replace multiple others in your lab, saving you cost and space. To learn more about points on how a student competes in essay writing.

You can read more by clicking to over to The iQ-200 Air Temperature, Velocity and Measurement Instrument, email us to ask for more information by clicking [email protected], or call our lab at 781-769-2800

What is electronics thermal management?

We talk a lot here on the ATS Thermal Management blog about thermal management. And there’s a good reason for that of course! That’s what we are fanatical about. Keeping electronics cool so they operate at their best design point.

But, after you peel back boiling points, forced thermal spreaders, heat sinks, liquid cooling, thermal interface material, and more you are left with one critical, salient point about what is electronics thermal management.

To ensure that the device junction temperature (Tj) stays below a set limit.

What is a junction? The Hottest Spot on a Chip

this photo shows the semiconductor junction temperature hot spot

When semiconductor designers make a chip, especially a complex ASIC or something like an Intel server processor, these chips are effectively systems. Packed with circuits, and often in very dense packages, certain parts of the chip have sections that operate with greater frequency than other parts.  The result, those “spots” or “junctions” are very hot.  And so, cooling that junction is the key to all this Thermal Management. That’s our goal.

In fact, the first step in really getting the right solution to your projects thermal challenge is to determine it’s junction temperature. Here’s some handy helps to get you there….

How to calculate a semiconductor junction temperature part 1

How to calculate a semiconductor junction temperature part 2

Once you’ve calculated your junction temperature, you can then have a much better chance of choosing the right heat sink.

Of course, if you ever need help with this ATS is here. You can email us at [email protected] or give us a call at 781-769-2800 We’re always happy to help with your thermal management projects.

Why Temperature Management is Critical

Temperature management of electronics matters and today is even more critical for the proper operation of systems. As Andre Pope of Mentor Graphics noted in his blog post, “How thermal testing can help increase reliability of electronic systems? ”

According to a study of the US Air Force Avionics Integrity Program from about two decades ago failure of electronics systems in about 55% of all cases was due to thermal issues. This figure is being quoted since then. Actually, I have my personal evidence for this from my own history of using a PC at home. My actual PC at home broke down twice. The first breakdown was something I could smell and see – there was a smoke signal issued by the machine: the controller IC in its hard-drive electronics simply burnt out. The second computer breakdown I had was when my 7 years old no-name PC stopped working completely. In this case I was not sure if it was a real hardware failure. I suspected that either the BIOS has forgotten its contents or my well known operating system gave up after 7 years of service. So, the ratio is 50-50.

Thus, making sure that we eliminate half of the possible failures is really very important. With such an action we can double the reliability of our systems. The question is, how one can achieve reducing the number of thermal problems? Of course with thermal-aware design. By doing so, we can eliminate our own failures.

In short, reliability is directly affected by temperature! Or, in mathematical terms:

Thermal  management of electronics formula: heat transfer is a function of temperature

Why thermal management of electronics is important formula 2: stress

thermal management of electronics formula 3: activation energy

Thermal management of electronics symbol definitions for math formulas

This answers the “why we should” care about thermal management certainly, but, why is thermal management such a challenge? Well, at ATS our team has identified five reasons:

  • Higher Frequency Circuits result in high heat flux
  • Smaller Packaging hence, high speed circuits tighter placement and higher density
  • Low Acoustic Noise Requirements Force chassis designers to utilize low-to-medium (200-400 LFM) speed air flow
  • Circuit Designers Determine Component Placement Sometimes resulting in less-than-optimal air flow at the PCB level
  • EMI Shielding Because of High Frequency Results in constricted area for air passage

I’m sure each of us could identify with at least one of the challenges we’ve listed above. And, those challenges – the raising of the bar if you will – is what we need to focus on to provide successful thermal management.

One of the ways we work with engineers is to educate them on thermal solutions; one tool we have for that is our Qpedia Thermal Journal, its published online once month, you can get the current copy, free, from our engineering staff to you by visiting, Qpedia Current Issue