Fujipoly, a firm we featured in the ATS Thermal Interface Material Resource Roundup, have released a duo of additions to their fine line of Sarcon specially formulated thermal interface materials. Applicable to an aluminum heat sink, copper heatsink or other applications requiring low thermal resistance gap filler pad compounds, Sarcon 100GR-HL and SARCON XR-Um-Al are both available now from Fujipoly.
SARCON XR-Um-Al is a uniquely formulated gap filler compound that has a putty-like consistency. This physical property contributes to the material’s extremely low contact and thermal resistance while maintaining a thermal conductivity of 17 watt/m-k. The gap filler pad is manufactured with a thin aluminum carrier film for customer-friendly application. The low adhesion aluminum barrier enables users to remove the carrier film after installation with no pull-out effect. This thermal interface material is available in sheets up to 50mm x 50mm with thicknesses ranging from 0.2mm to 0.5mm.
SARCON 100GR-HL is a thermal gap filler pad manufactured with a hardened top surface. The unique, one-sided treatment is less tacky than the opposing surface allowing the thermal pad to consistently adhere to either the target electrical component or opposing heat sink. The hard surface allows for effortless removal without tearing or damaging the material during assembly and rework operations. Sarcon® 100GR-HL transfers heat with a thermal conductivity of 2.8 W/m°K and a thermal resistance of .44°Cin2/W at 72.5 PSI. This 1.0mm thick, flame retardant TIM is available in sheets up to 300mm x 200mm.
Thermal interface material is an important part of a thermal management system. So important in fact we’d like to point our readers to a couple of resources we’ve put together here at ATS. The first is our white paper, “When to use thermal interface material with your heatsink and why?” The second is an on-demand webinar we have made available to the thermal engineering community entitled, “Heat Sink Selection Made Easy“, in which we cover a bit about thermal interface material relative to heatsink selection. These materials are free of charge of course. If you’ve got questions or need a bit of help with your thermal engineering, give us a try, companies like Lucent, and Motorola already have. Call us at 781-949-2521 or email us at sales.hq@qats.com