Tag Archives: heat sink

Customer sees 40% reduction in BOM cost from ATS Thermal Engineering

Can you save 40% off the BOM cost of your thermal management solution?  You bet you can, here’s a one minute case study describing how ATS did exactly that with one OEM manufacturer

ATS’s maxiFLOW Push-Pin Heat Sink Named EDN’s 2011 HOT 100

ATS is proud to announce our maxiFLOW push-pin heat sink is THE winner of the EDN Hot 100 Products for 2011! We were the lone selection in the EDN 100 for heat sinks and we are quite proud. Our award underscores our motto:  Innovation in Thermal Management.   Click here to learn more about maxiFLOW/Push Pin Heat sinks!  108K different push pin heat sink assembly configurations featuring 3 different pitch heat sink types, 3 different fin geometries, brass and plastic push pins.

maxiFLOW push pin heat sinkEDN Hot 100 award for maxiFLOW

How to Compare the Thermal Performance of Different Heat Sinks in latest Qpedia Thermal eMagazine

Qpedia, ATS’s monthly thermal e-magazine is ready for our followers to read!  We’ve got a number of terrific articles this month, including:

  • How to Compare the Thermal Performance of Different Heat Sink
  • Synthetic Air Jet for Electronics Cooling
  • Waste Heat Recovery of Electronic Equipment
  • Effect of Cross-Flow on Straight and Inclined Jets

The article, “How to Compare the Thermal Performance of Different Heat Sink” is one we want to highlight.  Some of the key points covered include:

  • Effect of materials in comparing heat sinks
  • Proper wind tunnel testing
  • Data analysis and computation for tests

Qpedia’s current issues are always no cost to our readers.  Our Qpedia back issues are available at no cost for readers who register on qats.com

How to Apply Thermal Interface Material: Thermal Grease

In another video from our lab, Greg, an ATS thermal engineer, demonstrates the sometimes tricky application of thermal grease.  Thermal grease is among the best TIM conductors, but, it’s messy! Check Greg’s careful application for how to do it:

How to optimize your heat sink and more in this month’s Qpedia Thermal eJournal

Qpedia Thermal eJournal, our publication on all things related to thermal management and electronics cooling is hot off the presses! This months Qpedia features articles on:

  • Getting the Most Out of Your Heat Sink Design: An Overview of the Parameters Which Influence Your Design
  • CFD Simulation of Jet Impingement
  • Spray Cooling Electronics in a 1-U Chassis
  • Transient Response of a PCM with Embedded Graphite Nanofibers

Get your copy right away, for no charge, by clicking to Qpedia Thermal eJournal