ATS’ wrap-up of news in the Thermal Management and Electronics Cooling industry for the week ending June 10, 2011
- Bergquist has a new phase change material: Suited for use between high-power electrical device requiring electrical isolation and its heat sink, Hi-Flow® 650P thermally conductive phase change material offers thermal impedance of 0.20ºC-in.²/W at 25 psi. Top side is dry to touch, bottom side has natural tack, and polyimide film reinforcement provides dielectric strength as well as cut-through resistance. Appropriate uses include power supplies, IGBTs, discrete components, and automotive applications.
- Ta-I Ramps Production on HS Substrate: Chip resistor maker Ta-I Technology plans to ramp up its monthly production capacity of LED heat sink substrates to 200,000 units by the end of June 2011, according to company chairman Paul Chiang.
- Ellsworth Adhesive: Ellsworth Adhesives has now become a distributor of Sauereisens adhesives and potting solutions. Sauereisen, one of the leading manufacturers of adhesives and sealant solutions, has been added to the Ellsworth Adhesives business portfolio as a new supplier.
- PNY: PNY unveils new NVIDIA GTX 580 liquid cooled graphics card with CPU cooling
- Jaro Thermal New Heat Sink: Honeycomb heatsink cools BGAs in thin-profile devices