The latest Qpedia Thermal eMagazine has just been released and can be downloaded at www.qats.com. This issue marks the eighth year Qpedia has been publishing the highly regarded magazine for the thermal engineering community.
One of this issue’s featured articles is “Thermal Conductivity of Printed Circuit Boards.”
Some components are designed to dissipate most of their heat through the PCB, and their packages are not necessarily designed to minimize Θjc. It may also be the case that the environment renders a heat sink less effective, and the heat dissipation depends on both the heat sink and the PCB. In these cases, how should the thermal performance of the PCB be analyzed? PCBs have their own copper traces, different numbers of fiberglass layers and copper planes, and many different patterns of vias. The question is what are the effects of these PCB features on the thermal conductivity of the board?
Read the “Thermal Conductivity of Printed Circuit Boards” article now by downloading the latest Qpedia at http://www.qats.com/Qpedia-Thermal-eMagazine/Current-Issue