Choosing the right heat sink is essential. So is HOW YOU ATTACH IT to your hot components? Learn about this important step in deploying a thermal management solution at our webinar “How to Choose the Right Heat Sink Attachment for Component Packages of all Sizes and Shapes”. Clips, push pins, tapes and other methods will be reviewed for popular SoC and SiP packages.
A handy technical reference sheet and white paper on attachment types will be provided to those who register through a download button during the online seminar.
This webinar is pre-recorded and presented by ATS Product Engineering Manager, Greg Wong. Q&A is an important part of both our Live and Pre-Recorded Webinars. Attendees can submit a question by clicking the floating question button in the bottom-right corner during the webinar on May 26. After the session, Greg will respond to each of your questions and follow up questions.