Computer-driven simulation and analysis of thermal characteristics can be used to develop optimal cooling solutions for high-performance board designs. Of course, those designs have to be verified by real-world testing to improve MTBF and shorten time-to-market.
ATS recently did just that. Facing a problem involving a PCI-X card, a hot 16-core 500Mhz packet processor, and a COTS PCI type, rack mount chassis, ATS found a solution where none could be found before. There was alot to do and we’re happy to share what we did in this white paper at RTC Magazine, “Thermal Analysis and Heat Sink Design Optimize Cooling of High-Performance Modules“