Power modules, those devices that integrate together power semiconductors, power switches and other components in one tidy package, are really power systems or power blocks. Mostly convenient, they can be integrated into a design efficiently.
But what happens when all that power, even in small amounts, is aggregated together? You get a lot of heat in a package and when electronics get hot, you really need to cool them so they work best. ATS has a terrific “how to” article on doing just that using Micro-Channel Structures.
Regular readers of our blog here at Advanced Thermal Solutions know we’ve covered microchannels and cooling a bit before. On March 10, we posted on “Understanding How Fluid Boils in Tiny Microchannels Gives Engineers another Tool to Cool High Power Electronics” and then published an article entitled, “The Thermal Performance of Microchannel and Macrochannel Cold Plates“.
Our “how to” article today though covers the cooling of power modules. We invite you to have a look by clicking to our article, “Direct Cooling of Power Modules by Using Micro-Channel Structures“.
