Category Archives: Thermal Design

Isothermal Plate Provides Precise, Controllable Heat Source to Simulate Hot IC’s for Heat Sink Development or Test and Measurement

Posted on April 7, 2010 by | 1 comment

Advanced Thermal Solutions, Inc. (ATS) CIP-1000 is a controllable isothermal plate system which produces surface temperatures from 10 to 170°C. The temperature can be controlled with an accuracy of +/- 0.1°C. The CIP-1000 heat source system features a 75 mm diameter isothermal copper plate whose constant temperature can be raised or lowered both automatically and manually. A three wire RTD sensor and integral PID controller ensure specific, uniform temperature across the entire plate. Temperature settings can be programmed for automated ramping, including hold times for each step. Manual temperature management is also supported.

Applications include:

  • Simulating a hot semiconductor for thermal development of heat sinks
  • Temperature control for bio-technology applications
  • Quick spot heating of materials needed in electronics hardware lab prototyping work

You can learn more by visiting the ATS CIP-1000 Information Page

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Posted in Engineering, Heat Sinks, Thermal, Thermal Design

Tony Koryban Mail Bag Archives: finding the special air conditioner to cool computers that can handle watts?

Posted on April 2, 2010 by | Leave a comment

As is our custom at ATS, we bring to you Tony Koryban’s Mail Bag archives, this week’s question?

Dear TK,

I got stuck with the job of getting quotes for the ventilating/air conditioning system for the new computer room. It will be filled with network routers and servers and such. All the power for that stuff is given in watts, but all the air conditioners seem to be rated in BTUs per hour, or TONS, even! Where can I find the special air conditioners for computer equipment that can handle watts?

Cheesed-off in Chesterton

Tons of fun answering this question where the answer is simpler than you might think!  You can read all about it at this link:  “Tony Koryban Mailbag Archives“

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Posted in Analysis, Consulting, cooling, Thermal Design

ATS Thermal Design Webinar April 8: Strategies in Cooling High Capacity/High End Systems

Posted on April 2, 2010 by | Leave a comment

As the definition of what a high capacity/high end system is changes to accommodate the ever increasing needs for computer and storage resources, so do the thermal management challenges. Attendees of this webinar will learn about the strategies for cooling high capacity systems, including the use of liquid cooling. Webinar taught by Dr. Kaveh Azar of Advanced Thermal Solutions. It is free of charge. You may register at ATS’s webinar registration by clicking to: Strategies in Cooling High Capacity and High End Systems

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Posted in cooling, Thermal, Thermal Design, Training, Webinar

Case Study: Thermal analysis & heat sink design to optimize cooling of 16 Core packet processor

Posted on March 31, 2010 by | Leave a comment

Computer-driven simulation and analysis of thermal characteristics can be used to develop optimal cooling solutions for high-performance board designs. Of course, those designs have to be verified by real-world testing to improve MTBF and shorten time-to-market.

ATS recently did just that. Facing a problem involving a PCI-X card, a hot 16-core 500Mhz packet processor, and a COTS PCI type, rack mount chassis, ATS found a solution where none could be found before. There was alot to do and we’re happy to share what we did in this white paper at RTC Magazine, “Thermal Analysis and Heat Sink Design Optimize Cooling of High-Performance Modules“

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Posted in Analysis, Case Studies, CFD, Consulting, Heat Sinks, Thermal Design

ATS Candlestick Sensor: A Thin Profile Sensor for Measuring both Temperature and Velocity

Posted on March 30, 2010 by | 3 comments

The Candlestick sensor from Advanced Thermal Solutions, Inc. is narrow and low profile to minimize disturbance to airflow when studying heat conditions in electronic enclosures. The sensor’s robust base-and-stem design allows continuous repositioning and reading during the testing process. One Candlestick sensor measures both temperature and velocity to eliminate errors that can occur when airflow is non-isothermal. Its all-plastic design prevents shorting of electronics. Multiple sensors are easily installed to thoroughly map a system’s thermal and airflow conditions. Double-sided adhesive makes the sensors easy to mount on any surface.

  • Temperature Range: -30°C to 150°C (±1°C)
  • Velocity Range: 0 to 51 m/s (10,000 ft/min) (± 2%)

You can learn at this link at qats.com:  ATS Candlestick Sensors

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Posted in Instrument, Product Highlights, Sensor, Thermal, Thermal Design