Advanced Thermal Solutions, Inc. (ATS) has an extensive product line of innovative, off-the-shelf and custom heat sinks and attachments that provides the broadest range of designs to meet the demanding thermal challenges presented by today’s high-powered electronics. Led by its patented maxiFLOW™, which provides the highest thermal performance for physical volume it occupies compared to other heat sinks on the market, ATS has a solution to meet any thermal problem.
In addition, ATS engineers have world-renowned expertise in thermal management and are capable of designing liquid and air cooling solutions using heat sinks, heat pipes, heat exchangers, fans, and cold plates. ATS has more than two decades of solving the industry’s toughest thermal challenges and have a proven record of success in handling the industry’s leading components.
From the latest generation of Intel processors to Altera’s high-powered Stratix FPGA to Qualcomm’s ARM processors to Texas Instruments, Nvidia, NXP, Cavium, and many more, ATS has the experience, the analytical capability, and the products to provide you with the necessary thermal management.
Board Level Solutions
maxiFLOW™ – maxiFLOW™ heat sink design provides the highest thermal performance for the physical volume that it occupies as compared to other heat sink designs. maxiFLOW™ heat sinks are ideally suited to meet the thermal requirements of a broad range of electronics packages, including: BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs and LQFP.
Straight Fin – ATS offers a large variety of high performance Straight fin heat sinks that can be used in many applications where the direction of the airflow is clearly defined. The straight fin heat sink can be utilized in areas where the maxiFLOW™ flair-fanned cannot be used, providing an excellent alternative for cooling thermally sensitive devices.
Cross-Cut – Electronics packages are numerous and range from BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs, LQFP and many others. ATS offers a large variety of cross cut heat sinks that can be used in a variety of applications where the direction of the airflow is ambiguous. The cross cut allow for the heat sink to receive air from any direction.
Pin Fin – Electronics packages are numerous and range from BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs, LQFP and many others. ATS offers a large variety of cross cut heat sinks that can be used in a variety of applications where the direction of the airflow is ambiguous. The cross cut tape on allow for the heat sink to receive air from any direction and can be easily attached to the device by a thermally conductive tape.
fanSINK™ – In many electronic systems, such as telecomm and datacom chassis, or 1U, 2U servers and blades, the system air flow rate is not adequate for cooling of high power devices. Therefore, additional air flow introduced at the device level is required. ATS offers a large family of fanSINK™ products for applications where FPGA or ASICs in BGA packages are deployed. ThefanSINK™ can be either clipped on to the device by maxiGRIP™ or superGRIP™ heat sink attachment technologies or taped on.
Power Brick – DC/DC power converters are an essential part of PCB design and their performance requires a stable temperature for optimum performance. ATS has produced a broad array of high performance power brick heat sinks, based off of the patented maxiFLOW™ design, to effectively cool DC/DC power converters and power modules deployed in a host of electronics applications. ATS’ power brick heat sinks are available in full, half, quarter and eighth packaging.
pushPIN™ – With over 108K different push pin heat sink assembly configurations, ATS offers the largest push pin heat sink offering in the market. Select from fine and ultra-fine pitch heat sinks designed for high velocity air flows and coarse pitch heat sinks for low velocity air flow conditions. Offered in straight fin, cross-cut and the ultra performance maxiFLOW™ fin geometries, ATS pushPIN™ heat sink line is suited to meet a wide variety of applications for components ranging in size from 25mm-70mm. Push pins are offered in brass and plastic and are packaged with different compression springs to achieve precise force required for secure attachment.
blueICE™ (Ultra Low Profile) – In many electronics systems, such as Telecomm, Datacomm, Biomedical equipment and others, card-to-card spacing is small, yet stringent thermal requirements remain the same. Electronics packages such as BGA, QFP, LCC, LGA, CLCC, TSOP, DIP, LQFP are commonly used with stringent thermal requirements in a tight space with limited airflow. Ultra low profile heat sinks offered by ATS range from 2 to 7mm in height and are ideally suited for tight-space application electronics since they offer the best thermal performance. Their thermal resistance is as low as 1.23° C/W within an air velocity of 600 ft/min.
Standard Board Level – ATS’ high quality, low cost, aluminum stamped heat sinks are ideal for low power thermal management solutions. The simple design and manufacturing of these heat sinks allows high volume manufacturing and reducing assembly costs. Stamped heat sinks are ideally used for TO packages and other power devices.
Extrusions – Aluminum extrusions are the most cost-effective solutions for the majority of electronic cooling applications. ATS offers a wide variety of aluminum profiles used for heat sink fabrication and other aluminum applications. Whether you are seeking a standard extrusion profile or the expertise from our design team to create a new and innovative profile, ATS has the capabilities and expertise to meet your requirements.
Heat Sink Attachments
superGRIP™ – superGRIP™ is a two component attachment system which quickly and securely mounts heat sinks to a wide range of components, without needing to drill holes in the PCB. superGRIP™ provides a strong, even attachment force with minimal space required around the components perimeter, making it ideal for densely populated PCBs. superGRIP™ is available with ATS maxiFLOW™ heat sink and straight fin heat sinks.
maxiGRIP™ – maxiGRIP™ is a unique, two component attachment system which quickly and securely mounts heat sinks to a wide range of components, without needing to drill holes in the PCB. The steady, even attachment force provided by maxiGRIP™ allows the heat sink and thermal interface material to achieve maximum thermal performance. maxiGRIP™ is available with ATS maxiFLOW™, straight fin, fanSINK™ and device specific heat sinks.
Thermal Tape – The interface material plays a pivotal role in transporting the heat from the component to the heat sink. The tape is applied to the base of the heat sink and then the heat sink is attached to the component. For tape to work well, proper cleaning of the component surface and the base of heat sink is required. Also, it is usually necessary to apply the tape with a certain amount of pressure.