Advanced Thermal Solutions, Inc. (ATS) has released a new thermal test instrument, the iFLOW-200, which assesses the thermal and hydraulic characteristics of cold plates in electronics cooling. It can be used to simulate a wide range of conditions to optimize a cold plate’s performance before it is commercialized or prior to its use in an actual application.
The iFLOW-200 measures coolant temperatures from 0-70°C with the high accuracy of ± 1°C. Differential pressure of the coolant in the cold plate is measured up to 103,000 Pa (15 psi), with the precise accuracy of ± 1%. Distilled water is used as the reference coolant. For test comparisons, the systems coolingVIEW software can also calculate thermal resistance and pressure drop as a function of flow rate for selected liquids.
The instrument system includes a pair of K-type thermocouples for measuring temperature changes on the cold plate surface. Temperatures are monitored on the coolingVIEW interface.
The iFLOW-200 system features easy set up and operation to save time when evaluating different cold plate models. Designed for accuracy and convenience, the iFLOW-200 simply requires setting the starting and ending coolant flow rates, and choosing the dwell time, pumping power and other parameters. These are easily done on any PC using the systemd user-friendly application program.
The iFLOW-200 system features separate controller and hydraulics enclosures with USB connections. The hydraulic package includes a fluid level indicator, coolant inlets and outlets from/to the cold plate under test, ports for surface temperature thermocouples, and a fluid cooling system for its internal heat exchanger. The iFLOW-200 is also ideal for testing alternative liquids.
More information about the iFLOW-200 Cold Plate Characterization System can be found at http://www.qats.com/Products/Temperature-and-Velocity-Measurement/Instruments/iFLOW-200
Posted in Cold Plates, Instrument, Product Highlights
Tagged analysis, cold plate, cold plate characterization, component test, coolant, cooling, electronics, electronics cooling, engineering, flow rate, hydraulic performance, instrument, liquid cooling, liquids, mechanical engineering, pressure drop, pressure measurement, product design, technology, temperature measurement, thermal analysis, thermal engineering, thermal management, thermal performance, thermal resistance, thermal test instrument, thermal testing, thermocouple
We’ve started a new regular feature here at ATS, “The ATS Product Highlight”. Our readers can glance to the right hand column to see our inaugral highlight, ATS’s Verizon’s Thermal Management Design Services, a complete set of services to assist the OEM in passing Verizon’s new NEBS VZ.TPR.9208 Thermal Management Requirements for Improved Energy Efficiency of Telecommunications Equipment.
We caught up with our CEO, Dr. Kaveh Azar, to ask him a few questions about why ATS decided to start such a service, what services ATS is providing and more. Just click on the Slidecast below for this 4 minute overview on ATS’s new service:
Our readers can also checkout our initial announcement at heatsinks.wordpress.com by clicking to our post, “ATS Announces Thermal Design Services to help Telecom Equip OEMs meet Verizon’s VZ.TPR.9208 Thermal Management Req.” and our readers can see a 3 minute interview of Verizon’s Chuck Graff, the author of VZ.TPR.9208, as to why Verizon decided to release this specification by clicking to, “Verizon’s Chuck Graff speech on VZ.TPR.9208 Thermal Management Spec; Pass Verizon’s tests by partnering with ATS“
ATS Announces Free Webinar: Analytical, Computational and Experimental Thermal Analysis of a xTCA Chassis on Thursday, May 27, 2010 2:00 PM – 3:00 PM EDT
ATCA and MicroTCA are chassis standards geared to getting systems from telecomm, computing, military, medical and other companies to market faster and with lower cost. While the form factor, modularity and price point are attractive, thermal challenges can be magnified with the small form factors and interoperability challenges of a standard architecture. Attendees will be equipped with advanced, fast and accurate thermal design techniques that will help them efficiently use modeling and testing tools to determine device junction temperatures and speed time-to-market.
To register please visit our registration site here:
Analytical, Computational and Experimental Thermal Analysis of a xTCA Chassis