Tag Archives: chassis

New Consulting Project Subscription Plan

ATS has released a Consulting Project Subscription Plan (CPSP) for engineering services. From our corporate headquarters in Norwood, Massachusetts,we offers comprehensive thermal management analysis and design services for the telecommunications, medical, military, defense, aerospace, automotive, and embedded computing industries. The new plan allows ATS engineers to become an extension of your team for a pre-determined amount of hours, providing expert thermal and mechanical engineering consultation, design, simulation, testing and validation.

ATS Design Services

Services include Design, Simulation, Testing, Analysis & Prototyping

The CPSP includes the use of ATS thermal lab facilities and covers all projects approved by an authorized representative of subscribed customers. ATS thermal management analysis and design services encompass both experimental and computational simulations using proprietary tools and computational fluid dynamics software packages such as FLOTHERM and CFdesign.

Thermal Testing & Analysis

Thermal Testing & Analysis

The new subscription plan gives customers priority access to ATS engineering and manufacturing resources for all chip, board, enclosure, and system related projects. ATS studies the full packaging domain, including components, circuit boards (PCBs), shelves, chassis, and system packaging.

Consulting capabilities include:

– heat sink, board and fan characterization

– heat sink design and optimization

– PCB & fan tray design and optimization

– liquid cooling design

– prototyping of heat sinks and complete cooling systems

– wind tunnel testing of components, PCBs, chassis and enclosures

ATS offers rapid prototyping of machined parts and cooling systems from its US facilities. Sheet metal fabrication and cut heat sink prototypes are quickly provided from international partners.

Liquid Crystal Thermography

Liquid Crystal Thermography

ATS believes that customers who wish to remain competitive should consider a design-to-suit opportunity solution first. Contrary to common perception, this proves to be less expensive to the customer in the long run, because of the ensuing gain in product efficiency and compatibility. Working side-by-side with customers worldwide, ATS engineers provide tailored solutions to thermal and mechanical packaging challenges on real projects with real schedules.

To learn more about the consulting project subscription plan, call 781-769-2800, email ats-hq@qats.com, or visit www.qats.com.

Jet Impingement for thermal management: a practical approach to using it in 1U Server Chassis

Jet impingement for thermal management can give you a cost effective, highly directed airflow that can really help semiconductor cooling in your systems. But how do you cost effectively implement such a technology in low cost, 1U servers? Would just going to water, as Google did with their latest patent on a server cooling “sandwich”?

ATS has invented a method to easily deploy jet impingement cooling in both 1U low cost computer servers and in 6U ATCA Chassis. We call it ThermJETTTM. Some of the key elements include:

  • Test results showing cooling PCBs 20ºC better than conventional methods
  • No liquid
  • Relatively easy to implement with mechanical changes

Our readers can learn about ThermJETTTM by calling us at 781-769-2800, emailing us at sales.hq@qats.com or read more at the embedded presentation on ThermJETTTM below:

ATS Announces Free Webinar: Analytical, Computational and Experimental Thermal Analysis of a xTCA Chassis

ATS Announces Free Webinar: Analytical, Computational and Experimental Thermal Analysis of a xTCA Chassis on Thursday, May 27, 2010 2:00 PM – 3:00 PM EDT

ATCA and MicroTCA are chassis standards geared to getting systems from telecomm, computing, military, medical and other companies to market faster and with lower cost. While the form factor, modularity and price point are attractive, thermal challenges can be magnified with the small form factors and interoperability challenges of a standard architecture. Attendees will be equipped with advanced, fast and accurate thermal design techniques that will help them efficiently use modeling and testing tools to determine device junction temperatures and speed time-to-market.

To register please visit our registration site here:
Analytical, Computational and Experimental Thermal Analysis of a xTCA Chassis