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Click below for ATS’ heat sinks with Thermal Tape offerings:

 

Thermal Tape

Thermally Conductive Adhesive Transfer Tapes

  • Thermally conductive carrier material :
    • T412
    • T766
    • 3M 8815
    • Laird Phase Change Material
  • Easy to attach
  • Most cost-effective
  • Suitable for low-mass heat sinks
  • Suitable for components with low power dissipation
  • Double sided pressure sensitive adhesive
  • Excellent thermal properties as low as 10 psi.
  • Rework without damage to sensitive components

 

     

The interface material plays a pivotal role in transporting the heat from the component to the heat sink. The tape is applied to the base of the heat sink and then the heat sink is attached to the component. For tape to work well, proper cleaning of the component surface and the base of heat sink is required. Also, it is usually necessary to apply the tape with a certain amount of pressure. Providing efficient thermal transfer for a wide range of applications including:

  • Bonding heat sinks
  • Heat spreaders
  • IC packages
  • Power transistors
  • and more