Tag Archives: consumer electronics

Free Webinar this Thursday on the “Thermal Management of Consumer Electronics”

From the basic science of thermal energy, to diagnosing and resolving difficult heat issues, ATS engineers share their knowledge with audiences throughout the year with our free webinar series.

Our next webinar will be this Thursday, August 8 at 2pm ET on the “Thermal Management of Consumer Electronics.”

iPhone2

Consumer electronics are now being used in places that were once exclusive to business and military electronics. Products like Apple’s iPhone and iPad are sophisticated technologies with powerful processors housed in small spaces with restricted airflow. As a result, these devices, and others like them, are providing many new benefits, but they also bring higher thermal management needs. Attendees will learn the available cooling options, and important factors such as the importance of spreading resistance in component and system thermal management.

The prerecorded webinar is free but seating is limited. Register Now.

ARM Microprocessors and ATS superGRIP: Attached at the Clip

Advanced Thermal Solutions, Inc., (ATS), has introduced a line of heat sinks compatible with the Sitara ARM Microprocessor family from Texas Instruments.

AM1707 from Texas Instruments

AM1707 from Texas Instruments

The Sitara ARM Microprocessors feature ARM Cortex-8 and ARM9 MPUs, which are used in a wide variety of Industrial, Medical, and Consumer Electronics applications.

The AM17x family consists of low-power ARM microprocessors that enable OEMs and ODMs to maximize product offerings by providing high processing performance life, advanced operating systems and rich user interfaces. Compatible operating systems include Neutrino, Integrity, Windows, Embedded CE, Linux, VXWorks and Android.

ATS patented maxiFLOW heat sinks with superGRIP clip attachment ensure long-term product reliability and maximum performance from the Sitara ARM Microprocessors. maxiFLOW high performance BGA heat sinks feature a low profile, spread fin array that maximizes surface area for more effective convection air cooling. The unique maxiFLOWTM design provides thermal performance that is 30-200% better than conventional heat sinks.

ATS' maxiFLOW Heat Sink with superGRIP Attachment

ATS’ maxiFLOW Heat Sink with superGRIP Attachment

maxiFLOW is available with pre-assembled phase change material, maxiGRIP clip attachments, and superGRIP clip attachments. The superGRIP attachment system features a plastic frame clip that fastens securely around the perimeter of a component and a metal spring clip that slips through a heat sinks fin field and locks securely to both ends of the plastic frame. The resulting superGRIP assembly applies steady even pressure to the component throughout the product lifecycle, improving thermal performance and long-term reliability. The ATS superGRIP heat sink attachment system permits the use of high performance phase changing thermal interface materials that improves heat transfer by as much as 20 times more than typical double-sided adhesive thermal tapes. It also allows for the heat sink to be detached and reattached without damaging the component or the PCB, an important feature for applications where PCB rework and ease of assembly and disassembly are important. The full range of ATS products compatible with Texas Instruments products can be viewed in the new heat sink selection tool on http://qats.com/Distributor/AE-Dist.php

To learn more about maxiFLOW heat sinks and the superGRIP clip attachment, please visit www.qats.com, email ats-hq@qats.com, or call 781-769-2800.