Tag Archives: heat sink

Free ATS Webinar: How to Properly Measure Temperature within Electronic Systems and Analyze the Results

On Thursday, April 28, 2011 2:00 PM – 3:00 PM EDT, ATS will be holding a free webinar, “How to Properly Measure Temperature within Electronic Systems and Analyze the Results”

Attendees will become familiar with the importance of temperature measurement in electronic systems. They will learn about the essential instruments and the locations within a system where testing should be conducted.  The webinar presenter will also discuss how to analyze the temperature data as part of a complete thermal analysis.

To register, click to our registration site at this link: https://www2.gotomeeting.com/register/952923650

For the Chinese Mandarin presentation of our webinar please register at http://bit.ly/ATS_temp_mesaurement_Mandarin

 

iMAPS New England 38th Symposium & Expo – May 3, 2011 The Largest Regional Microelectronics Symposium

The New England Chapter of IMAPS has assembled an impressive Technical Program for their 38th Symposium and Expo being held May 3, 2011 at the Holiday Inn Conference Center, Boxborough MA.

Representing a wide range of Microelectronic disciplines, an Exhibit Hall featuring 60 Companies and 300-500 Participants from North America and beyond.

For details on Exhibiting or Sponsoring, e-mail: [email protected]

What is a Heat Pipe and How Does it work in Thermal Management? (part 2 of 2)

We’re concluding a two part series today on what a heat pipe is and how it works in thermal management. In part one we talked about what a heat pipe is and the anatomy of a heat pipe. Here in part 2 we’ll conclude with factors that can limit a heat pipes effectiveness, differences in the thermal performance of various heat pipe types, and the spreading resistance of different materials.

Table 1 shows experimental data for the operating temperature and heat transfer for three different types of heat pipes [1].

Heat Pipes With Different Constructions and Operating ConditionsTable 1: Heat Pipes with Different Structures and Operating Conditions [1]

Certain factors can limit the maximum heat transfer rate from a heat pipe. These are classified as follows:

  1. Capillary Limit: Heat transfer is limited by the pumping action of the wick
  2. Sonic Limit: When the vapor reaches the speed of sound, further increase in the heat transfer rate can only be achieved when the evaporator temperature increases
  3. Boiling Limit: High heat fluxes can cause dry out.
  4. Entrainment Limit: High speed vapor can impede the return of the liquid to the condenser

A heat pipe has an effective thermal conductivity much larger than that of a very good metal conductor, such as copper. Figure 4 shows a copper-water heat pipe and a copper pipe dipped into an 80oC water bath. Both pipes were initially at 20oC temperature. The heat pipe temperature reaches the water temperature in about 25 seconds, while the copper rod reaches just 30oC after 200 seconds. However, in an actual application when a heat pipe is soldered or epoxied to the base of a heat sink, the effective thermal conductivity of the heat pipe may be drastically reduced due to the extra thermal resistances added by the bonding. A rule of thumb for the effective thermal conductivity of a heat pipe is 4000 W/mK.

Experiment Comparing Speed of Heat Transfer Between a Heat Pipe and a Copper PipeFigure 4. Experiment Comparing Speed of Heat Transfer Between a Heat Pipe and a Copper Pipe [1].

Heat pipe manufacturers generally provide data sheets showing the relationship between the temperature difference and the heat input. Figure 5 shows the temperature difference between the two ends of a heat pipe as a function of power [2].

Temperature Difference Between the Evaporator and the Condenser in a Heat PipeFigure 5. Temperature Difference Between the Evaporator and the Condenser in a Heat Pipe [2]

There are many heat pipe shapes in the market, but the most common are either round or flat. Round heat pipes can be used for transferring heat from one point to another. They can be applied in tightly spaced electronic components, such as in a laptop. Heat is transferred to a different location that provides enough space to use a proper heat sink or other cooling solution. Figure 6 shows some of the common round heat pipes available in the market.

Typical Round Heat Pipes in the Market.Figure 6. Typical Round Heat Pipes in the Market.

Flat heat pipes (vapor chambers) work conceptually the same as round heat pipes. Figure 7 shows a flat pipe design, they can be used as heat spreaders. When the heat source is much smaller than the heat sink base, a flat heat pipe can be embedded in the base of the heat sink, or it can be attached to the base to spread the heat more uniformly on the base of the heat sink. Figure 8 shows some common flat heat pipes.

Conceptual Design Schematic of a Flat Heat Pipe

Figure 7. Conceptual Design Schematic of a Flat Heat Pipe

Commonly Used Flat Heat PipesFigure 8. Commonly-used Flat Heat Pipes

Although a vapor chamber might be helpful in minimizing spreading resistance, it may not perform as well as a plate made from a very high conductor, such as diamond. A determining factor is the thickness of the base plate. Figure 9 shows the spreading resistance for 80 x 80 x 5 mm base plate of different materials with a 10 x 10 mm heat source. The vapor chamber has a spreading resistance that is better than copper, but worse than diamond. However the price of the diamond might not justify its application. Figure 9 also includes the spreading resistance from the ATS Forced Thermal Spreader (FTS), which is equal to that of diamond at a much lower cost. The FTS uses a combination of mini and micro channels to minimize the spreading resistance by circulating the liquid inside the spreader.

Thermal Spreading Resistances for Different Materials
Figure 9. Thermal Spreading Resistances for
Different Materials.

Heat pipes have a very important role in the thermal management arena. With projected lifespans of 129,000-260,000 hours (as claimed by their manufacturers), they will continue to be an integral part of some new thermal systems. However, with such problems as dry out, acceleration, leakage, vapor lock and reliable performance in ETSI or NEBS types of environments, heat pipes should be tested prior to use and after unsatisfactory examination of other cooling methods have been explored.

That ends our two part series on heat pipes. Have you got a question on heat pipes or their application? How about an interest in bringing ATS’s team of experienced thermal engineers into one of your projects? You can reach us by visiting http://www.qats.com Purchase heat sinks through our Heat Sink eShop or email us at [email protected] or give us a call at 781-769-2800

References:
1. Faghri, A. Heat Pipe Science and Technology Taylor & Francis, 1995.
2. Thermacore Internation, Inc., www.thermacore.com.
3. Xiong, D., Azar, K., Tavossoli, B., Experimental Study on a Hybrid

Heat Sink Types: The Pros and Cons (part 1 of 2)

At ATS we design many heat sinks. In fact, as of today, we have over 4000 different heat sink designs in our library, plus all our off the shelf designs. It’s likely we have designs that, with minor modifications will fit any thermal challenge.  But despite having over 4000+ designs in our library, there are some very basic designs that form the basis for all the variations in the market. In this two-part series, we want to cover these basic designs and give you the pros and cons. At the end of our series, we’ll have a concise cheat sheet for you for easy reference. Here in part 1 we’ll talk about the following heat sink types: Extruded, Stamped, Bonded Fin, and Folded Fin.

Extruded heat sinks are the “utility infielder” of our industry. They are relatively inexpensive, once a design is made the manufacturing is highly automated, and, in most cases, aluminum is the material used. Aluminum is cheap and a relatively good thermal conductor. They are used for most general applications, depending on the design, fin pitch and base thickness they can be low to high performers, and, as I mentioned earlier, they are cost effective.  The basic con is they are limited in their dimensions being that they are based on an aluminum extrusion with a given width.

108K different push pin heat sink assembly configurations featuring 3 different pitch heat sink types, 3 different fin geometries, brass and plastic push pins

 

Stamped heat sinks are literally made from a piece of metal being stamped out in a press. A tool is made to the form of the heat sink, then, metal is moved through a stamping machine and the stamp creates the heat sinks. This too is a highly automated process and, as you might guess, once the heat sink design is complete and the prototypes OK’d, then the actual production is a relatively “simple”.  Stamped heat sinks are generally use for low power applications since they are typically low in performance. They are cheap, even less expensive than extruded heat sinks.

Bonded fin heat sinks are generally geared towards physically large applications that require moderate performance. Bonded fin heat sinks are made by bonding individual fins of metal to a base. The bonding can be done by a thermal epoxy (somewhat cost-effective) or by brazing (expensive). The main advantage to this type of heat sink is it can be used for large applications, such as a DC-DC Brick, or an electric welder. The main drawback is manufacturing process isn’t automated on the scale of stamped, extruded, or folded fin heat sinks, resulting in a high cost for bonded fin.

Folded fin heat sinks are best when there is ducted air, that is, air flow is directed through a duct of some kind directly at the heat sink. Fin pitch can be optimized in the manufacturing process making this kind of heat sink, with ducted air flow, very high performing. Also, because the heat sink material is folded, there can be a big increase in surface area over which heat can be dissipated. Fold fin heat sinks have high heat flux density [1]. The drawbacks to this type of heat sink are the cost including manufacturing and ducting necessary in your system. In some cases, plastic can be used to create a folded fin heat sink.

In part 2 of our 2 part series on heat sink types, we’ll look at active heat sinks, forged, swaged, single fin assembly and skived.

Need a heat sink like the ones we discussed here? Then please check out our eSHOP to purchase online, visit our heat sink section to see our complete list, or email us at [email protected] with your questions and we’ll respond as quick as we can!

And don’t forget our QoolPCB program, Cool an entire PCB, all heat sinks included, for $50!!

—————–

References:

[1] Heat Flux or Thermal Flux is the rate of heat energy transfer through a surface. Heat flux density is the heat flux unit per area http://en.wikipedia.org/wiki/Heat_flux

ATS’s High Efficiency Pin Fin Heat Sinks are Value Price and Effective

High Efficiency Custom Pin Fin Heat Sink, ATS010010002-PF-1A Advanced Thermal Solutions High Efficiency Custom Pin Fin Heat Sink, ATS010010002-PF-1A , has the following features: * Length: 10mm * Width: 10mm * Height: 2mm * Thermal Resistance at 200LFM: 19.64 C/W Unducted Flow It’s a low cost, quick add to any moderate thermal management problem. You can learn more about ATS’s Pin Fin Heat Sink product line here ATS High Efficiency Pin Fin Heat Sink You may also contact us at 781-769-2800, email: [email protected] or visit qats.com