Tag Archives: thermal research

Thermocouples for thermal analysis: what they are and how they work (part 1 of 2)

This week here on ATS’s thermal blog, we kick off a two part series on thermocouples. Today, here’s part 1.

With their versatility and easy use, thermocouples are the most common means for doing thermal analysis and performing temperature measurements. Data from such measurements can then be used to develop the right thermal management solution, including heat sinks, for an electronic system.

Thermocouples date back to 1821, when Thomas Seebeck, an Estonian scientist, found that when two dissimilar metals were connected at both ends, and one end was heated, there was a resulting flow of current in this thermoelectric circuit.

Today, this voltage is known as electromotive force (emf), and is a function of the junction temperature and composition of the two metals. The repeatable nature of emf, along with standardized material types and calibration curves has made thermocouples the devices of choice for many temperature measuring applications.

Despite simplicity of thermocouples, their emf voltage cannot be measured directly. As shown in Figure 1, using a voltage measuring device will create two additional thermocouple junctions, designated as J2 and J3 in the thermoelectric circuit.

thermocouples for thermal analysis article, part 1, feature on ats thermal blogFigure 1 Measuring junction voltage with a DMV[1]

The voltage reading then becomes a function of three temperatures, two of which are of no interest to the experimenter. To solve this problem, another junction needs to be created in series in the circuit, as shown in Figure 2.

thermocouples in thermal analysis on ats heat sink blogFigure 2 External Reference Junction [1]

This added junction is kept at a known temperature, 0°C, by submerging it in an ice bath, and is the reference temperature. Most commonly, a mixture of pure water and pure ice at 1 atmospheric pressure is used for the reference junction. Today, electronic measuring devices simulate an ice reference bath without the need for an actual ice bath. This is often referred to as cold junction compensation (CJC).

After adding the ice bath, there are still two junctions at the device terminals, but each of these consists of the same two materials. If held at the same temperature, their emf voltage will be the same and cancel each other out.

In part 2 of our two part series on thermocouples, we’ll cover what thermocouples can be made of and how to select the right thermocouple for your project.

Thermal Analysis embedded in your system: ATS kicks off embedded board Week

Well it’s a festive time here at Advanced Thermal Solutions, Inc. as we kick of Embedded Board Week here at ATS.

As many of our readers know, an embedded board is one that is basically inside another system.  The board is effectively a component within some other firms product. ATS’s embedded boards give OEMs the ability to use ATS’s proven technology for measuring air temperature, air velocity and air pressure in their systems.  Simply embedded one of our boards into your system and presto, you have usable ATS technology in your application.

Today we’ll talk about our lineup of embedded boards and during the week we’ll discuss applications. ATS has three primary embedded board types:

ISD embedded board for OEM ApplicationsISD: The ISD is an analog input,  PCB-based scanner for simultaneous, high speed measurements of air velocity and temperature from two independent sensors.

ATS ISD-232 embedded board ISD-232: The ISD is a digital input, PCB-based scanner for simultaneous, high speed measurements of air velocity and temperature from two independent sensors.

PTB-1000 OEM Embedded Board PTB-1000: The PTB-1000Pressure Transducer Board is a four-channel test board for measuring differential pressure where air flow integrity is critical to proper performance.

We’ll be writing about the many varied applications for these boards this week.  In the meantime, to get more information or to purchase these boards, click to our web page at qats.com, call us at 781-769-2800 or email us at [email protected].

How to choose a heat sink attachment method to secure your heat sink and for optimal heat transfer (part 2 of 2)

In part 1 of our 2 part series, we laid the ground work for our two part series by noting that there are six main methods you can use to secure a heat sink to a semiconductor

  1. Thermal Tape
  2. Epoxy
  3. Wire Form Z-Clips
  4. Clips
  5. Threaded Stand-offs (PEMS) and Compression Springs
  6. Push-Pins and Compression Springs

In part one we covered thermal tape, epoxy and wire form z-clips. In part two we’ll cover clips, push pins and stand offs and have a special offer for our readers to get all this information in a handy download.

Commercial heat sink clip and ATS maxiGRIP heat sink clip Heat Sink Clips: Heat sink clips are Plastic or plastic/wire clips that grip the components. They are a step above z-clips in ease of use and application. Where a Z-Clip requires a PCB anchor, standard heat sink clips do not. In fact, as long as you have keep out area available around a chip and height available, a clip is a great option. There are many options in using a clip. There are very basic clips, such as those from Malico, which quickly and easily hold a heat sink onto a semiconductor and more advanced clips such as what we at ATS offer in our maxiGRIP and superGRIP clips. The main benefits of a clip are, first, they apply a pre-load to the TIM (thermal interface material) improving thermal performance. Second, they require no holes or anchors in the PCB. This is a very big benefit since clips do not reduce the trace space available for board layout. Third, clips make rework easy by allowing heat sinks to be easily removed and reapplied without damaging the PCB board. Finally, some clips, like maxiGRIP and superGRIP provide a strong enough mechanical attach to pass NEBS, ETSI and MIL shock and vibration. There are some downsides that need to be noted though. First, designers need to insure they design in some keep out area around the semiconductors so that a clip can be used. That also assumes that the design team has considered a thermal management strategy during the architect phase of the product too. Secondly, clips do add extra assembly time since they have to be manually applied.

heat sink being attached to a board using a PEMThreaded Standoffs (PEMS): These are threaded mechanical assemblies that offer the highest level of retention and stability. This approaches benefits include, first, that they are a strong mechanically. They will pass shock and vibe for NEBS, ETSI and MIL.  Second, they provide the highest TIM preload, insuring excellent performance from whatever thermal interface material you choose. Third, they are ideal for heavy copper heat sinks. Finally, they make installation and rework easy since a simple unscrewing of the attach allows the non-destructive removal of the heat sink.  But, as with all heat sink attach methods, there are a few drawbacks to consider. First, they require holes in the PCB removing valuable space for trace. Second they tend to be expensive, especially given that holes need to be drilled into a PCB board to use them.

push pin attach for heat sinks Push-Pins: These are generally plastic or brass push-pin that offer quick and easy mechanical attachment. They are generally equally strong to a threaded standoff (PEMs) approach to heat sink attach. Push pins offer a very strong TIM preload as well as being ideal for large, heavy copper heat sinks. Some of the drawbacks include requiring holes in the PCB board which reduces the trace length space available, a generally complicated assembly process, and finally a fairly high price relative to other solutions.

That wraps up our two part series on heat sink attachment options.

Special offer for our readers to get all this information in a handy download
There’s a lot of material in our two part series on heat sink attachment. To make referencing our series quicker, we’ve assembled this material into a two page “Resource Guide” completed with images as a handy reminder during your next thermal management project.To get a copy, simply drop some email to us at [email protected] with the words, “HEAT SINK ATTACH OFFER” in the subject line and we’ll send a copy to you.

If you’re looking for a solution on heat sink attachment and need to bounce this off us, feel free to! ATS sells various heat sinks attachment options, of course, and we’ll talk about that next time, but we’re happy just to discuss your options in your application, so call us at 781-769-2800, email us at [email protected] or visit our website at http://qats.com

What is Jet Impingement Cooling and How is it applied for Thermal Management of Electronics (Part 2 of 2)

Jet Shape and its effect on cooling

Jets are deployed in different shapes that impact the eventual heat transfer from the impinged jet surfaces. These shapes include round and square. There can be a single jet or multiple smaller jets where the data has shown to have better performance than a single jet. Figure 2 shows the temperature gradient in a jet impingement application. [3] The jet was seeded with liquid crystal to show the thermal transport, its interaction, and the temperature gradient.

Figure 2: Temperature Gradient in a Jet

Figure 2: Temperature Gradient in a Jet

The heat transfer coefficient is maximized at the center, and the distribution is shown in Figure 3. [4]

Figure 3 – Heat transfer coefficient distribution

Figure 3: Heat Transfer Coefficient Distribution

Figure 4 shows the local heat transfer coefficient for air jet impingement as a function of dimensionless distance for a jet diameter of 1 mm, Re = 10,000 at different H/d. It is seen that at H/d = 1, H is higher than the other two values. In this experiment, an H = 2,500 W/m2K was achieved.

Figure 4 - Heat transfer coefficient for an air jet at d = 1 mm, Re = 10,000

Figure 4: Heat Transfer Coefficient for an Air Jet at d = 1 mm, Re = 10,000

Figure 5 shows the heat transfer coefficient for a water jet, as reported by Garimella [2] that has attained a value of 60,000 for confined submerged jets. The x axis is the ratio of jet to target spacing to nozzle diameter. The top curve was for 4.6 m/sec (10 gram/sec), the middle curve was for 6.9 m/sec, and the bottom was for 9.2 m/sec.

Figure 5 - Heat transfer coefficient for single submerged confined water jet

Figure 5: Heat transfer coefficient for single submerged confined water jet

Recently, Motakef, et al, described the achievement of a heat transfer coefficient of 500,000 with a water microjet, and 20,000 with an air microjet. [5] In their design, they manufactured a 3-D structure with hundreds of microjets that were 300 microns size. The jets are kept at a distance of a few hundred microns from the surface. The special manifold design allows the returned flow to exhaust without interfering with the main jets. This design significantly increases the heat transfer coefficient. Without the manifolding the heat transfer coefficient degrades to that of a macro-jet. Figure 6 shows a sample of this honeycomb structure.

Figure 6 - A 10 x 20 x 1.7 mm MJCA micro jet structure

Figure 6 – A 10 x 20 x 1.7 mm MJCA micro jet structure

Even though a very high heat transfer coefficient can be achieved using jet impingement, the packaging of such a system is very challenging. The following must be carefully considered and studied:

  1. What type of fluid should be used? Is it air or liquid? If it is air, what is the noise implication? If it is liquid, how will the liquid be drawn out of the system without damaging the electronics parts if there is any leakage?
  2. What type of compressor is needed to generate the high speed jet? Is its size practical for commercial use? What is its life span?
  3. What type of filter should be used to prevent the nozzle from clogging? What is the effect of the filter on the fluid line pressure drop? What would be the impact of semi-clogged nozzles on the pressure drop?
  4. What is the cost of such a system, and does it justify its application for that specific application?

To reach part 1 of this series click to: What is Jet Impingement Cooling and How is it applied for Thermal Management of Electronics (Part 1 of 2)

Need help on apply Jet Impingement Cooling in your thermal designs? ATS offers Jet Impingement technology and consulting for ATCA, Telecomm and 1U compute Chassis. You can learn more at our post, Jet Impingement for thermal management: a practical approach to using it in 1U Server Chassis or calling us at 781-769-2800 or email us at [email protected]

 

References:

  1. Womac, D., Ramadhyani, S., Incropera, F., Correlating equations for impingment cooling of small heat sources with single circular jets, Transactions of the ASME, Vol. 115, PP 106-115, 1993.
  2. Fitzgerald, J., Garimella, S., Flow field effects on heat transfer in confined jet impingement, Transactions of the ASME, Vol. 119, pp. 630-632, 1997.
  3. Ashforth-Frost, S., Ridel, U., Thermal and hydrodynamic visualization of a water jet impinging on a flat surface using microencapsulated liquid crystals, International Journal of Fluid Dynamics, Vol 7, Article, 1-7, 2002.
  4. Glynn, C., ODonovan, T. and Murray, D., Jet impingement cooling, Department of Mechanical and Manufacturing Engineering, Trinity College, Dublin.
  5. Motakef, S., Overholt, M., Micro-fabricated solutions to management of high heat flux systems, CapeSym, Inc., Natick, Massachusetts.

What is Jet Impingement Cooling and How is it applied for Thermal Management of Electronics (Part 1 of 2)

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What Jet Impingement Cooling Article Begins Below

Continued power increases in devices, such as processors and IGBTs are requiring high capacity cooling methods to remove excess heat. One such method is the jet impingement of a liquid or gas onto a surface on a continuous basis. This mode of heat transfer has been tested extensively for many years and is still an ongoing pursuit. Some issues, among them noise reduction, are still being improved.

Impingement jets can either be air-powered or use some form of liquid, typically water. High speed jet impingement on a component surface creates a thin boundary layer, and thus a high heat transfer equation. There are three common jet configurations: the free-surface jet, which uses dense liquid in a medium that is less dense, such as air; the submerged jet, which allows the fluid to impinge in the same medium fluid; and the confined submerged jet, which is shown in Figure 1.

Jet Impingement Cooling

Figure 1

It has been shown that the submerged jet has higher a heat transfer coefficient than the free-surface jet for Reynolds numbers greater than 4000. [1]  Other research shows that the confining wall can reduce the heat transfer coefficient due to the circulation regions between the top plate and the bottom surface. [2]

108K different push pin heat sink assembly configurations featuring 3 different pitch heat sink types, 3 different fin geometries, brass and plastic push pins

 

Determining heat transfer through jet impingement is very complicated, and depends on many factors. Among the most critical are the Reynolds number, the Prandtl number, jet diameter, and wall-to-nozzle spacing.

It has been shown that for the same Reynolds number, decreasing the jet diameter will increase the heat transfer coefficient due to the higher speed. For a constant diameter jet, the heat transfer coefficient is a function of . For certain values of jet distance to jet diameter, reducing the distance does not make an appreciable difference in the heat transfer. This is because the potential core is very close to the surface.

In part 2 we’ll cover jet shape and it’s effect on cooling. To reach part 2 click to What is Jet Impingement Cooling and How is it applied for Thermal Management of Electronics (Part 2 of 2)

Need help on apply Jet Impingement Cooling in your thermal designs? ATS offers Jet Impingement technology and consulting for ATCA, Telecomm and 1U compute Chassis. You can learn more at our post, “Jet Impingement for thermal management: a practical approach to using it in 1U Server Chassis” or calling us at 781-769-2800 or email us at [email protected]

References:

  1. Womac, D., Ramadhyani, S., Incropera, F., Correlating equations for impingment cooling of small heat sources with single circular jets, Transactions of the ASME, Vol. 115, PP 106-115, 1993.
  2. Fitzgerald, J., Garimella, S., Flow field effects on heat transfer in confined jet impingement, Transactions of the ASME, Vol. 119, pp. 630-632, 1997.