Tag Archives: thermal research

Graphite for thermal management applications moves forward with Kaneka’s high thermal conductive graphite sheet

We’ve written about Graphite before for thermal management and frankly, we aren’t that excited about it’s commercialization. Kaneka Corp of Japan has made some progress in this area though. As reported in CBS’s BNET, Kaneka has “developed a graphite sheet based on the high-temperature sintering technology and polymer design technology using polyimides as raw materials that have the highest thermal conductivity in the world.” That sounds pretty exciting to us.

Panasonic has a product like this, their PGS Graphite Sheet, as does HP Materials, and others. But Kaneka’s sheet looks like a big step forward in the kind of high performance thermal properties that might make the use of graphite a good choice for very demanding applications or very dense or small ones where the use of a graphite sheet as both container and heat sink make sense. Here are some specifications:

  • Surface directional thermal conductivity of 1 200 [W.m.sup.-1].[K.sup.-1] is second only to that of diamond)
  • A thinness of less than 50 [mu]m
  • A relative weight of about 2 [g.cm.sup.-3] which is less than a quarter that of copper

Kaneka’s material, named Graphinity, can be see at here:  Kaneka Graphinity High Thermal Conductive Graphite Sheet

We wrote about the use of graphite in our post on Intel’s use of carbon nanotubes to create heat sinks and in our coverage of an article Tim Haas of Avnet wrote on LED thermal management.

ATS even did a comparison between three geometrically identical heat sinks made of Copper, Aluminum and High-performance Graphite (though not nano-tube) and we did not see any difference. Surprisingly, the only advantage that high-performance Graphite offered was its light-weight, but, thermally and mechanically it was the worst (readers may download a copy of our study at ECNMag.com at this link: Comparing the Impact of Different Heat Sink Materials on Cooling Performance.

ATS thermal lab video demonstrates PTM-1000 pressure transducer; applications for measuring pressure drop across ATCA Blades

PTM-1000 Pressure Transducer Instrument We’ve been busy in the lab shooting another video, this one on our PTM-1000 pressure transducer module. Besides just showing what the PTM-1000 is, we also show two applications:

The first application shown is how to use the PTM-1000 and our ATCA Blade Analyzer that fits easily into our bench top wind tunnel to develop pressure drop curves for ATCA (Advanced Telecommunications and Computing Architecture) boards. Developing and understanding the pressure drop curves across an ATCA or other COTS (commercial off the shelf) board is important since balancing the board to board pressure drop in a given COTS chassis is critical to proper air flow volume control and thermal management of a system. We’ve been asked by several companies who are part of PICMG if we can do this and we’re happy to finally say YES!

The second application demonstrates measuring the volumetric flow rate of air across the ATCA card. The video follows but if you’d like your own PTM-1000, or just want to talk to one of our team on how to apply it to your engineering work, visit us at qats.com, call us at 781-769-2800, email us at [email protected] or request a quote via our project form.

Thermal Management Instrumentation Demo Video with SMT Magazine

ATS recently was interviewed by SMT Magazine about what research instruments are used to do the necessary thermal analysis to develop a thermal management solution, including an aluminum heatsink, copper heatsink or other kind of heatsink.

The demo shows a wind tunnel, sensors, differential pressure system, and thermal measurement system and their use.   We do an actual demo of how to use the equipment all in five minutes.   Have a look at this link here, “PCBA in Wind Tunnel Demo at SMT” or at SMT Magazine’s site directly

Aluminum heatsink design uses passive cooling for high end graphics but don’t forget about your chassis fan strategy

At ATS we’ve long been proponents of pushing the limits of thermal management using air. Why? No one wants truly wants to use liquid cooling in their computers be they workstations, servers, telecommunication servers or any other compute engines. Plumbing is something most engineers want to avoid. So our team applauded the release of Sapphire’s passive heatsink cooled graphics card, their HD5670.

The key thing to note on this card thermally is the unique geometry of the aluminum heatsink, aluminum heatpipe and fins. Thin and compressed to their graphics card, the PCI card’s silhouette requires only one X16 lane graphics slot. Sapphire doesn’t mention recommended air flow but they do suggest for best cooling performance, a chassis installed with at least one 120mm or 90mm fan is required.

Our team thought this design was well done, and a great application for passive heatsink cooling. Some thoughts we had included:

First, the required air flow amount and air flow velocity are key for a proper thermal management solution. These will be a function of what else you have in your chassis of course, CPU, memory, disk drives etc. A key critical point is do not block the air flow to known hot components and boards in your chassis. This is a common mistake we see at ATS be it computing or telecommunications. We’ve done a write up on how to choose a fan for your computer chassis on our blog, you can read it by visiting, “Five Basic Steps When Designing for a Cooling Fan Thermal Management”

Second, whether your fans are at the air inlet or outlet makes a difference and that needs to be considered. Always mount your cooling fans on the inlet side of your electronics chassis. This allows you to direct the highest velocity airflow to the areas of greatest need. In our example here, the Sapphire graphics card and your CPU (many thanks to Tony Koryban for his wisdom on fan placement)

With creative designs like Sapphires and the correct choice and placement of fans, air cooling continues to be an excellent choice for many thermal management problems. If you need help designing such a passive heatsink approach, drop some mail to us at [email protected]

ATS announces reduced cost bundles of thermal instruments

We announced a family of thermal instrument bundles yesteday. We are very excited about this news since it reflects both an ease of choosing the right set of instruments to do thermal analysis but also a lower price point for our instruments.

Choosing the right set of instruments to set up your thermal analysis lab isn’t necessarily like going to Apple and choosing what options you want on your new Macbook Pro. You really have to sort through the various options to get what you need. And our team of engineers has now done that for you to simplify the process. You can read all about it at ATS’s thermal instrument blog here: ATS Announces New Instrument System for Studying Air Flow and Air Temperature