ATS HP-97 Series are high-power component simulators used for replicating the heat dissipation conditions of devices

semiconductor thermal simulatorATS’ HP-97 Series are high-power component simulators used for replicating the heat dissipation conditions of devices. It features a 32 x 32 mm Aluminum block and a cartridge heater embedded within a high temperature DERLIN® housing and mounted to an FR4 plate. DERLIN® is known for its stiffness, dimensional stability, impact resistance, and structural strength. To learn more as well as how to purchase please visit our site at this link: The HP-97 high-power component simulator

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